| Patent application number | Description | Published |
|---|
| 20080239306 | SYSTEM AND METHOD FOR OPTICAL POWER MANAGEMENT - A system and method for managing optical power for controlling thermal alteration of a sample undergoing spectroscopic analysis is provided. The system includes a moveable laser beam generator for irradiating the sample and a beam shaping device for moving and shaping the laser beam to prevent thermal overload or build up in the sample. The moveable laser beam generator includes at least one beam shaping device selected from the group consisting of at least one optical lens, at least one optical diffractor, at least one optical path difference modulator, at least one moveable mirror, at least one Micro-Electro-Mechanical Systems (MEMS) integrated circuit (IC), and/or a liquid droplet. The system also includes an at least two degree of freedom (2 DOF) moveable substrate platform and a controller for controlling the laser beam generator and the substrate platform, and for analyzing light reflected from the sample. | 10-02-2008 |
| 20090096088 | SEALED WAFER PACKAGING OF MICROELECTROMECHANICAL SYSTEMS - Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants. | 04-16-2009 |
| 20090107812 | ELECTRICAL CONNECTION THROUGH A SUBSTRATE TO A MICROELECTROMECHANICAL DEVICE - An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface. | 04-30-2009 |
| 20090159410 | MEMS MICROSWITCH HAVING A CONDUCTIVE MECHANICAL STOP - A MEMS switch includes a substrate, a movable actuator coupled to the substrate, a substrate contact, a substrate electrode, and a conductive stopper electrically coupled to the movable actuator and structured to prevent the movable actuator from contacting the substrate electrode while allowing the movable actuator to make contact with the substrate contact. | 06-25-2009 |
| 20100156577 | MICRO-ELECTROMECHANICAL SYSTEM SWITCH - A micro electro-mechanical system switch is presented. The switch includes a base substrate having a support surface. An actuating surface having a notch and an electrical contact surface having an extension is provided. The extension is disposed within the notch. A beam is attached to the base substrate. The beam includes an actuatable free end that is configured to flex upon actuation and to make contact with at least a portion of the extension and carry current therethrough. | 06-24-2010 |
| 20110094290 | LOW POWER PRECONCENTRATOR FOR MICRO GAS ANALYSIS - A low power preconcentrator for use in micro gas analysis, such as gas chromatography, and a system that employs the preconcentrator is disclosed. The preconcentrator includes a reservoir that comprises a heater membrane and elements coated at least partially with an adsorbent, and ports for receiving and discharging an analyte in communication with the reservoir. At least a portion of the reservoir (e.g., a cap) is made of a material having a thermal conductivity less than about 100 W/(m·K) and/or the heater membrane is made of a material that has a temperature difference less than about 75° C. when heated. The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims. | 04-28-2011 |
