Patent application number | Description | Published |
20130079229 | CRYOGENIC COOLING SYSTEM WITH WICKING STRUCTURE - A cryogenic cooling system includes a chamber defined by an outer wall and an inner wall, the chamber housing at least one component to be cooled; a wicking structure in thermal contact with one of the outer wall and the inner wall of the chamber; and a delivery system in a spaced apart relationship with the chamber and fluidly connected to the wicking structure for transporting a working fluid to and from the wicking structure. Also provided is a magnetic resonance imaging system including the cryogenic cooling system. | 03-28-2013 |
20130090242 | Techniques for Sub-Cooling in a Superconducting System - Techniques for sub-cooling in a superconducting (SC) system is disclosed. The techniques may be realized as a method and superconducting (SC) system comprising at least one insulated enclosure configured to enclose at least a first fluid or gas and a second fluid or gas, and at least one superconducting circuit within the at least one insulated enclosure. The superconducting (SC) system may be sub-cooled using at least the first fluid or gas. | 04-11-2013 |
20130092413 | Current Lead with a Configuration to Reduce Heat Load Transfer in an Alternating Electrical Current Environment - A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead. | 04-18-2013 |
20130130913 | Techniques for Protecting a superconducting (SC) Tape - Techniques for protecting a superconducting (SC) article are disclosed. The techniques may be realized as an apparatus for protecting a superconducting (SC) article. The apparatus may comprise a porous sleeve configured to fit around the superconducting (SC) article. The porous sleeve may be made of non-conductive, dielectric material. | 05-23-2013 |
20140262157 | WAFER PLATEN THERMOSYPHON COOLING SYSTEM - Disclosed is a thermosyphon system for cooling a platen in an ion implantation system. The thermosyphon system may include a vacuum chamber housing at least one wafer platen and a phase separator tank operative to contain both a liquid and gas phases of an element. A re-condensing cold head is exposed within the phase separator tank and is operative to condense the element from its gas phase to its liquid phase. This creates a convection driven closed loop pipe configuration. The closed loop pipe configuration includes a liquid phase pipe to carry the lower temperature liquid phase from the phase separator tank to the platen in the vacuum chamber. A reaction with the warmer platen converts the liquid phase to the gas phase. A gas phase pipe carries the higher temperature gas phase from the platen in the vacuum chamber back to the phase separator tank. | 09-18-2014 |