Patent application number | Description | Published |
20110027551 | SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE ELECTRICAL DEVICES AND FABRICATION METHOD THEREOF - A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure. | 02-03-2011 |
20110091732 | POLYAMIC ACID RESIN COMPOSITION AND POLYIMIDE FILM PREPARED THEREFROM - A polyamic acid resin composition, and a polyimide film and laminate prepared therefrom are provided. The polyamic acid resin composition includes a polyamic acid resin, a solvent, and a polar aprotic solution containing nanoscale silica, with surface hydroxyl groups, modified by a surface modification agent. Particularly, the surface modification agent has a structure represented by formula (I): | 04-21-2011 |
20110111333 | HEAT-RESISTANT FLEXIBLE COLOR FILTER - The invention provides a heat-resistant flexible color filter, including: a flexible transparent substrate, wherein the forming material thereof includes nano silica and polyimide, and the nano silica is present in an amount of about 20-70 wt %, based on 100 wt % of the forming material; and a heat-stable color photoresist material coated on the flexible transparent substrate, wherein the heat stable color photoresist material includes: a base soluble resin system about 30-90 wt %; a photosensitive system about 5-60 wt %; and a pigment coated with an inorganic alkoxide about 10-50 wt %. | 05-12-2011 |
20110130495 | ORGANIC/INORGANIC HYBRID MATERIAL AND FABRICATION METHOD THEREOF - An organic/inorganic hybrid material is provided, which includes an organic polymer and a plurality of inorganic nanoparticles, wherein the inorganic nanoparticles are self-connected or connected via a linker to constitute an inorganic network structure. By forming the inorganic network structure through interconnection of inorganic nanoparticles, the inorganic content in the hybrid materials can be drastically increased to improve the properties thereof. A method for fabricating the organic/inorganic hybrid material is also provided. | 06-02-2011 |
20110130507 | ORGANIC/INORGANIC HYBRID MATERIAL AND FABRICATION METHOD THEREOF - An organic/inorganic hybrid material is provided, including an organic polymer, and a plurality of inorganic nano-platelets, wherein the inorganic nano-platelets are self-connected or connected via a linker to constitute an inorganic platelet network. By the formation of the inorganic network structure, the hybrid materials can keep their transparency and flexibility at a high inorganic content, and exhibit greatly reduced coefficients of thermal expansion A method for fabricating the organic/inorganic hybrid material is also provided. | 06-02-2011 |
20110155235 | POLYIMIDE POLYMERS FOR FLEXIBLE ELECTRICAL DEVICE SUBSTRATE MATERIALS AND FLEXIBLE ELECTRICAL DEVICES COMPRISING THE SAME - A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. | 06-30-2011 |
20120164050 | ORGANIC DISPERSION OF INORGANIC NANO-PLATELETS AND METHOD FOR FORMING THE SAME - The present invention provides an organic dispersion of inorganic platelets, which includes an organic solvent and H-form inorganic platelets dispersed therein. The H-form inorganic platelets have a particle size of between about 20 and 80 mm and the organic dispersion has a sold content of between about 1 and 20 wt %. A method for forming the organic dispersion is also provided. | 06-28-2012 |
20120164423 | ORGANIC/INORGANIC COMPOSITE FILM AND METHOD FOR FORMING THE SAME - The present invention provides an organic/inorganic composite film, which includes a poly(vinylidene fluoride) (PVDF) and inorganic nano-platelets dispersed therein. A weight ratio of the PVDF and the inorganic nano-platelets is between about 97:3 and 20:80. The inorganic nano-platelets have a particle size of about 20-80 nm, wherein the organic/inorganic composite film has a transparency of greater than about 85% at a wavelength between 380 and 780 nm. In addition, a method for forming the organic/inorganic composite film is also provided. | 06-28-2012 |
20130059081 | METHOD OF FABRICATING FLEXIBLE SUBSTRATE STRUCTURE - A method of fabricating a flexible substrate structure is provided. A flexible metal carrier including at least one first region and at least one second region is provided. A surface-modified layer is formed on the first region of the flexible metal carrier. A flexible plastic substrate is formed over the first region and the second region of the flexible metal carrier. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier. | 03-07-2013 |
20130059118 | FLEXIBLE SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME - A flexible substrate structure including a flexible metal carrier, a surface-modified layer and a flexible plastic substrate is provided. The flexible metal carrier includes a first region and a second region. The surface-modified layer is located on and contacts with the first region of the flexible metal carrier. The flexible plastic substrate is located over the first region and the second region. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier. | 03-07-2013 |
20130172513 | POLYIMIDES - Disclosed is a polyimide polymerized by x molar parts of a first diamine, y molar parts of a second diamine, and 100 molar parts of a first dianhydride, wherein the first diamine has a formula of | 07-04-2013 |
20130267061 | METHOD FOR FABRICATING FLEXIBLE ELECTRICAL DEVICES - A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) | 10-10-2013 |
20140021169 | POLYIMIDE-CONTAINING LAYER AND METHOD FOR ETCHING POLYIMIDE-CONTAINING LAYER - The disclosure provides a polyimide-containing layer suitable for being etched by an alkaline solution and a method for etching a polyimide-containing layer. The polyimide-containing layer suitable for being etched by an alkaline solution includes 20-50 parts by weight of a silica dioxide, and 50-80 parts by weight of a polyimide. | 01-23-2014 |
20140120019 | ORGANIC DISPERSION OF INORGANIC NANO-PLATELETS AND METHOD FOR FORMING THE SAME - Disclosed is an organic dispersion of inorganic platelets, which includes an organic solvent and H-form inorganic platelets dispersed therein. The H-form inorganic platelets have a particle size of between about 20 and 80 nm and the organic dispersion has a sold content of between about 1 and 20 wt %. A method for forming the organic dispersion is also provided. | 05-01-2014 |
20140147649 | COATING, METHOD FOR MANUFACTURING THE COATING AND FILM FORMED BY THE COATING - A coating includes an organosiloxane polymer and a mesoporous silica material bonded with the organosiloxane polymer. A monomer of the organosiloxane polymer is | 05-29-2014 |
20140166993 | ORGANIC LIGHT EMITTING DIODE - Disclosed is an organic light emitting diode (OLED), including a flexible substrate having a surface with a bulge and groove structure. The OLED also includes a first electrode on the flexible substrate, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer. The flexible substrate includes polyimide. | 06-19-2014 |
20140242318 | SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE DEVICES - A substrate structure applied in flexible devices is provided. The substrate structure includes a carrier; a release layer with a first area formed on the carrier, which has a first adhesion force to the carrier; and a flexible substrate with a second area overlying part of the first area of the release layer and contacting the carrier, which has a second adhesion force to the release layer and a third adhesion force to the carrier, wherein the first area is larger than or equal to the second area, the third adhesion force is greater than the first adhesion force, and the first adhesion force is greater than the second adhesion force. | 08-28-2014 |