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Chung-Yu
Chung Yu Hung, Ershuei Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110220973 | JUNCTION-FIELD-EFFECT-TRANSISTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A junction-field-effect-transistor (JFET) device includes a substrate of a first-type impurity, a first well region of a second-type impurity in the substrate, a pair of second well regions of the first-type impurity separated from each other in the first well region, a third well region of the first-type impurity between the pair of second well regions, a first diffused region of the second-type impurity between the third well region and one of the second well regions, and a second diffused region of the second-type impurity between the third well region and the other one of the second well regions. | 09-15-2011 |
Chung Yu Wang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110198638 | LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS - A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure. | 08-18-2011 |
| 20110230043 | TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING - Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer. | 09-22-2011 |
| 20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
Chung Yu Wang, Hsin Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090130840 | Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging - Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress. | 05-21-2009 |
| 20110193056 | Vertical LED Chip Package on TSV Carrier - A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV. | 08-11-2011 |
| 20110215354 | Double Flip-Chip LED Package Components - A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window. | 09-08-2011 |
| 20110215360 | LED Flip-Chip Package Structure with Dummy Bumps - A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip. | 09-08-2011 |
| 20110215361 | Thermally-Enhanced Hybrid LED Package Components - A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads. | 09-08-2011 |
Chung-Yu Chang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090091372 | SYSTEM-ON-A-CHIP AND POWER GATING CIRCUIT THEREOF - A system-on-a-chip and a power gating circuit thereof are provided. The power gating circuit includes a first transistor, a charge pump circuit, and a hold circuit. A gate terminal of the first transistor is controlled by a first input signal. A first source/drain terminal of the first transistor is coupled to a first voltage. A second source/drain terminal of the first transistor outputs an output voltage. The charge pump circuit is coupled to a bulk terminal of the first transistor for changing a bulk voltage of the first transistor according to a second input signal. The hold circuit is coupled to the bulk terminal of the first transistor for holding the bulk voltage of the first transistor. | 04-09-2009 |
Chung-Yu Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100210872 | Method for making hindered phenolic antioxidant - A method for making a hindered phenolic antioxidant based on Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate uses a methanol solution containing alkali metal methoxide as a catalyst solution, wherein the catalyst solution is filtered with a filter device with a filter pore diameter of less than 50 μm to remove insoluble matters therefrom before used in a transesterification process where methyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate and 1-Octadecanol are taken as reactants to obtain a crude product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high conversion rate and low color, and the crude product further undergoes a purification process for crystallization, filtering and drying to obtain a product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high purity and low color. | 08-19-2010 |
Chung-Yu Chen, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100151702 | Board-to-board connector assembly - A board-to-board connector assembly includes a receptacle connector and a plug connector mated with each other. The receptacle connector has a receptacle housing, a plurality of first terminals disposed in the receptacle housing, and at least one first fixing member mounted to the receptacle housing and having a base portion. A top of the base portion is bent toward one side and then extends downward to form a propping portion defining a first fixing structure thereon. The plug connector has a plug housing, a plurality of second terminals disposed in the plug housing and contacting the corresponding first terminals electrically, and at least one second fixing member mounted to the plug housing and having a base board. At least one end of the base board extends downward to form a connecting portion defining a second fixing structure thereon which can be buckled with the first fixing structure. | 06-17-2010 |
| 20100232154 | FLUORESCENT TUBE - A fluorescent tube has a seat, a circuit board, multiple light-emitting-diodes (LED), a lampshade and two electrical terminal. The seat has two ends and a mounting surface. The circuit board is mounted on the mounting surface and has top surface. The LED is mounted on the top surface of the circuit board. The lampshade is transparent and is mounted on the seat, covers the circuit board and has an inner surface and a lens. The inner surface is opposite to the mounting surface of the seat. The lens is formed on the inner surface and faces the LEDs to guide the light of the LEDs. The electrical terminals are respectively mounted on the ends of the seat. Because the fluorescent tube does not have any reflection board, the manufacturing time and cost of the fluorescent tube decrease. | 09-16-2010 |
Chung-Yu Chiang, Yuanlin Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110248351 | MULTI-THRESHOLD VOLTAGE DEVICE AND METHOD OF MAKING SAME - An integrated circuit device and method for manufacturing the integrated circuit device are disclosed. An exemplary method includes providing a substrate; forming a first gate over the substrate for a first device having a first threshold voltage characteristic, the first gate including a first material having a first-type work function; forming a second gate over the substrate for a second device having a second threshold voltage characteristic that is greater than the first threshold voltage characteristic, the second gate including a second material having a second-type work function that is opposite the first-type work function; and configuring the first device and the second device as a same channel type device. | 10-13-2011 |
Chung-Yu Lee, Shulin City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080263823 | Hinge assembly - A hinge assembly is used to pivotally attach a cover to a base of an electronic device and has a stationary leaf, at least one barrel and a pintle assembly. The stationary leaf has an upper end and barrel housing. The barrel housing has a slot and two keyways. Each barrel is mounted in the barrel housing and has a neck and two keys. The neck has two sides. The two keys are formed respectively on the two sides of the neck and are mounted respectively in the keyways. The pintle assembly is mounted through the bushing of the at least one barrel. | 10-30-2008 |
| 20080307609 | Hinge - A hinge connects a display to a base of a notebook. The display has two sides and a bottom edge. The hinge has a stationary leaf, a bearing, a bracket and two pivoting leaves. The stationary leaf is mounted on the base. The bearing is formed on and at a relative incline to the stationary leaf. The bracket is parallel with respect to the base, but when the bracket rotates on the bearing, the bracket changes angle relative to the base until the bracket corresponds to the incline of the bearing. This raises an end of the bracket over the base and allows the display to rotate. | 12-18-2008 |
| 20090282645 | HINGE WITH MULTIPLE STRENGTH-ENHANCED RESILIENT FLAT WASHERS - A hinge has a stationary leaf, multiple resilient flat washers and a pintle. The stationary leaf has a sleeve. The resilient flat washers are mounted in the sleeve and each resilient flat washer has a ring and a key wing. The ring has a receiving recess formed in a first surface and a mounting rib formed in a second surface. The receiving recess of each resilient flat washer engages the mounting rib of a corresponding resilient flat washer. With the engagements of the receiving recesses and the mounting ribs, the resilient flat washers are connected to each other to enhance the strength of the resilient flat washers. Therefore, the resilient flat washers are strong enough to bear the abrasion for long term use. | 11-19-2009 |
| 20090311073 | RESILIENT FLAT WASHER AND A HINGE WITH RESILIENT FLAT WASHERS - A resilient flat washer has a ring and a keyed wing. The ring has an inner annular edge, an outer annular edge and at least one inner abrasion flange. The at least one inner abrasion flange is formed longitudinally on the inner annular flange. The keyed wing is formed transversely on the outer annular edge. A hinge has a stationary leaf, multiple resilient flat washers and a pintle. The resilient flat washers are mounted in a sleeve of the stationary leaf. The pintle is mounted rotatably in the rings and has a pivoting rod. The pivoting rod abuts the at least one inner abrasion flange, so the contact area between each resilient flat washer and the pivoting rod are increased. Therefore, the friction provided by the resilient flat washers is enhanced. | 12-17-2009 |
| 20110232032 | Hinge with spacers - A hinge has a pintle, a spacer assembly, a stationary bracket and a rotating bracket. The pintle is mounted through the spacer assembly and is connected to the stationary and rotating brackets. The spacer assembly has multiple spacers stacked with each other. Each spacer has a ring segment and a bearing segment. The ring segment is mounted around the pintle. The bearing segment has an absorbing space to absorb the stress acting on the ring segment. Therefore, the spacer sustains less stress to prevent breakage easily and a lifespan of the spacer is extended. Therefore, the hinge has a longer lifespan. | 09-29-2011 |
| 20110232034 | Hinge with spacers - A hinge has a pintle, a spacer assembly, a stationary bracket and a rotating bracket. The pintle is mounted through the spacer assembly and is connected to the stationary and rotating brackets. The spacer assembly has multiple spacers stacked with each other. Each spacer has a ring segment and a bearing segment. The ring segment is mounted around the pintle. The bearing segment has an absorbing space to absorb the stress acting on the ring segment. Therefore, the spacer sustains less stress to prevent breakage easily and a lifespan of the spacer is extended. Therefore, the hinge has a longer lifespan. | 09-29-2011 |
Chung-Yu Lee, Shulin TW
| Patent application number | Description | Published |
|---|---|---|
| 20110146028 | HINGE - A hinge is mounted between a cover and a base between an electronic device and has a supporting bracket, a rotating bracket, a mounting bracket and a pintle. The supporting bracket is connected to the base and the rotating bracket is connected to the cover. The mounting bracket is attached to the supporting bracket and has a positioning wing and two sleeves. The pintle is attached to the rotating bracket, is mounted through the mounting bracket and has a flat wall. The flat wall of the pintle selectively abuts against the positioning wing of the mounting bracket to hold the cover at desired position. The abrasion between the sleeves and the pintle balances torque. | 06-23-2011 |
| 20110173776 | HINGE - A hinge is mounted between a cover and a body of an electronic device and has a sheath, a shaft and a positioning unit. The sheath is connected to the body and has a flat panel. The shaft is connected to the base, is mounted through the sheath and has a flat surface. The positioning unit is attached to the flat panel and has an undulated positioning member selectively abutting the flat surface of the shaft to provide positioning function and to enhance the largest torque. Moreover, the undulated positioning member increases the contact points between the shaft and the positioning unit so that the shaft is stable during rotation. | 07-21-2011 |
Chung-Yu Tsai, Tamshui Chen TW
| Patent application number | Description | Published |
|---|---|---|
| 20100212864 | PACKAGED HEAT DISSIPATING ASSEMBLY FOR AN INTERMEDIATE BUS CONVERTER - A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered. | 08-26-2010 |
Chung-Yu Wang, San Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110292646 | Structure of lighting device - A structure of lighting device includes g a hood, a heat dissipater, at least one substrate board, and a fastener. The hood forms a receiving space, at least one fitting slot, and at least one heat dissipation opening. The fitting slot is located inside the receiving space. The heat dissipation opening is defined in a circumferential surface of the hood. The heat dissipater is received in the receiving space. The heat dissipater forms at least one guide section. The guide section opposes the fitting slot and is received in the fitting slot. The substrate board is electrically connected to at least one light-emitting diode. The substrate board is coupled to the heat dissipater. The heat dissipation opening allows for air circulation for removing heat generated by light-emitting diodes. Further, the heat dissipation opening is formed to have a width W less than 3mm, and the heat dissipater is arranged to be spaced from a circumferential surface of the hood by a distance greater than 6mm. | 12-01-2011 |
| 20110317409 | Structure of lighting device - A structure of lighting device includes a heat dissipater having opposite edges respectively forming a guide slot and a groove. A substrate board has an edge received and retained in the guide slot and an opposite edge forming a mounting hole. A fastener is received through the mounting hole to tightly engage the groove so as to fix the substrate board to the heat dissipater. No pre-machining of thread tapping is needed to form inner-threaded holes first. The structure of lighting device offers advantages in respect of simple structural arrangement, efficient manufacturing and production, reduced labor and material used, and lowering of costs. | 12-29-2011 |
Chung-Yu Wu, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120099193 | LIGHT EMITTING DIODE PACKAGING STRUCTURE AND LIGHT EMITTING DIODE STEREOSCOPIC DISPLAY DEVICE - A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area. | 04-26-2012 |
Chung-Yu Wu, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090066389 | Power Controlling Apparatus Applied to Biochip and Operating Method Thereof - The invention discloses a power controlling apparatus for a biochip including M regions. Each region includes a plurality of cells respectively. The power controlling apparatus includes a pulse generating module, a combinational circuit, and M controlling modules. The pulse generating module generates a pulse. The combinational circuit receives the pulse and generates M controlling signals. Each controlling signal has a predetermined phase which is different from the phase of the other controlling signal. The M controlling modules are electrically connected to the combinational circuit. Each of the M controlling signals corresponds to and activates one of the M controlling modules to selectively power on one corresponding region of the M regions. The cells in the corresponding region which is powered have an action potential refractory time that is longer than the power-on interval of the corresponding region. | 03-12-2009 |
| 20100060370 | VOLTAGE-CONTROLLED OSCILLATOR - A voltage-controlled oscillator comprises a variable inductor, a negative impedance circuit, an operating voltage source and a ground point. The variable inductor comprises a transformer and a transistor switch, the transformer comprising a primary side coil and a secondary side coil, the primary side coil comprising a first coil and a second coil, and the secondary side coil comprising a third coil and a fourth coil. The transistor switch is connected in parallel with the primary side coil to adjust an inductance value of the variable inductor based on a gate voltage. The negative impedance circuit is connected in parallel with the secondary side coil to compensate the power consumption of the voltage-controlled oscillator during oscillation. The operating voltage source is electrically connected between the third coil and the fourth coil, and the ground point is electrically connected between the first coil and the second coil. | 03-11-2010 |
Chung-Yu Yang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100147242 | Intake ducting device for a car engine - An intake ducting device for a car engine comprising at least a round sheet main body having on its outer edge a circular ring, the circular ring can be fixed in the inner surface of an intake tube and is provided inside of it with a plurality of airflow disturbing holes, the airflow disturbing holes are arrayed at least in two layers from the inner side to the center of the circular ring and are in the form of grids, each airflow disturbing hole has at least an airflow deflector having an tilting angle relative to the axis of the intake tube, when airflow from the car intake tube passes the main body, by the function of the airflow disturbing holes and the airflow deflectors respectively in the airflow disturbing holes, the airflow can be separated against concentration, thereby the intake tube can take in air uniformly. | 06-17-2010 |
| 20110120435 | CAR ENGINE AIR-INTAKE UNIT - A car engine air-intake unit being provided on the inner rim of an intake tube, it comprises at least a main body in a shape of round sheet, the main body is provided thereon with a plurality of current guides and current guiding plates to guide air flow to enter the intake tube and to flow and rotate, and blades are provided which protrude out of the main body and extend from the current guiding plates to increase the rotating angle and stroke of the guided air flow. The present invention can be used in cooperation with any of various specific air-intake tubes, and can make assembling and adjusting by using different air taking in amount and any of various air-intake tubes of different bores; it has the advantage of convenience of use. | 05-26-2011 |
Chung-Yu Yeh, Renwu Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100265057 | ATTENTIVE DEVICE APPLIED TO VEHICLES - An attentive device applied to vehicles includes a controlling mechanism and a display panel connected thereto. Wherein, the display panel is disposed on a body of the vehicle and includes LEDs. Further, the LEDs are divided into at least two effect zones that are thence connected to the controlling mechanism. Either of the effect zones is arranged for a performance of a particular symbol, so that the LEDs in one of the effect zone would shine for exposing the symbol and preferably those in the other effect zone would extinguish or flash in case that a command is generated and transmitted by the controlling mechanism, which gives the latter drivers and passersby an impressive warning effect and efficiently promotes the driving safety by increasing the identification regarding to the status of the front driver. | 10-21-2010 |