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| 20090136748 | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods - An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C. | 05-28-2009 |
| 20090143497 | UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the same - A photocurable pressure-sensitive adhesive (PSA) composition includes an acrylic PSA binder, the acrylic PSA binder including at least one fluoro group in an amount of about 6 mol % to about 30 mol % based on a total amount of the acrylic PSA binder, a thermal curing agent, and a photoinitiator. | 06-04-2009 |
| 20090162650 | Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods - An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition. | 06-25-2009 |
| 20100330780 | MULTI-FUNCTION TAPE FOR A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer. | 12-30-2010 |
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| 20100152357 | Polycarbonate Resin Composition with Improved Transparency and Scratch-Resistance - A polycarbonate resin composition can have improved transparency and scratch resistance of the present invention and comprises about 10 to about 99% by weight of polycarbonate resin (A); and about 1 to about 90% by weight of acrylic copolymer with ultra-low molecular weight and high refractive index (B). The resin composition of the present invention can further comprise acrylic resin (C). The acrylic copolymer with ultra-low molecular weight and high refractive index (B) can have a refractive index of about 1.495 to about 1.590 and a weight average molecular weight of about 3,000 to about 40,000 g/mol. | 06-17-2010 |
| 20100168272 | Polycarbonate Resin Composition with Improved Scratch Resistance and Melt Flow Index - A polycarbonate resin composition of the present invention comprises about 40 to about 99% by weight of a polycarbonate resin (A), about 1 to about 60% by weight of an acrylic copolymer (B) having a high refractive index and a flexible structure, and about 0 to about 60% by weight of acrylic resin (C). A polycarbonate resin composition of the present invention can have excellent transparency and scratch resistance without requiring extra compatibilizers by including an acrylic copolymer having a high refractive index and a flexible structure with the polycarbonate resin. | 07-01-2010 |
| 20110160377 | Thermoplastic Resin Composition Having Improved Impact Strength and Melt Flow Properties - The present invention provides an aromatic vinyl thermoplastic resin composition including (A) about 10 to about 99% by weight of a thermoplastic resin (A) including (a1) an aromatic vinyl copolymer resin, (a2) a rubber-modified vinyl graft copolymer, or a combination of (a1) and (a2); and (B) about 1 to about 90% by weight of a branched aromatic vinyl copolymer resin including a silicon based compound. The thermoplastic resin composition of the present invention can have excellent impact strength, improved flow properties, and compactability. | 06-30-2011 |
| 20110160380 | Polycarbonate Resin Composition with Excellent Scratch Resistance and Impact Strength - A polycarbonate resin composition according to the present invention comprises a polycarbonate resin and an ultra-high molecular weight branched acrylic copolymer resin and can have excellent transparency, appearance, and flowability, as well as scratch resistance and impact strength. | 06-30-2011 |
| 20110160383 | Transparent Thermoplastic Resin Composition with Improved Impact Strength and Melt Flow Index - The present invention provides a transparent thermoplastic resin composition which may comprise (A) about 1 to about 100 parts by weight of an ultra-high molecular weight branched acrylic copolymer resin; (B) about 0 to about 99 parts by weight of an acrylic resin; and (C) about 0 to about 40 parts by weight of an acrylic impact modifier, based on 100 parts by weight of (A) and (B). The ultra-high molecular branched acrylic copolymer resin (A) may be prepared by polymerizing a monomer mixture comprising (a1) about 50 to about 99.899% by weight of a mono-functional monomer, (a2) about 0.1 to about 40% by weight of a (meth)acrylic monomer having a flexible segment represented following Chemical Formula 1, and (a3) about 0.001 to about 10% by weight of a branch-inducing monomer. The thermoplastic resin composition of the present invention can have improved transparency, scratch resistance, flowability, and impact strength. | 06-30-2011 |
| 20110160400 | Phosphoric and Acrylic Copolymer Resin Having Excellent Transparency and Flame Retardancy and Resin Composition Including the Same - The present invention provides a phosphoric and acrylic copolymer resin that can have good transparency, scratch resistance and flame retardancy and a composition including the same. The phosphoric and acrylic copolymer resin includes repeat units of (A-1) at least one vinyl monomer and (A-2) at least one phosphoric monomer. | 06-30-2011 |
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| 20100099043 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent. | 04-22-2010 |
| 20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
| 20110159428 | Positive Type Photosensitive Resin Composition - This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51. | 06-30-2011 |
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| 20090306287 | Polylactic Acid Resin Composition - The present invention relates to a polylactic acid resin composition. The composition includes about 25 to about 80 parts by weight of a polylactic acid resin, (B) about 20 to about 75 parts by weight of a polycarbonate resin, and (C) about 0.01 to about 5 parts by weight of a chain extender including an amine group, based on about 100 parts by weight of (A)+(B). The polylactic acid resin composition of the present invention is environmentally-friendly and has excellent hydrolysis resistance and simultaneously improved mechanical strength and heat resistance, and accordingly can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example vehicles, machine parts, electronic parts, office machines, miscellaneous goods, and the like. | 12-10-2009 |
| 20100056700 | Environmentally-Friendly Polylactic Acid Resin Composition - An environmentally-friendly polylactic acid resin composition includes (A) a mixed resin including (a1) a polylactic acid (PLA) resin and (a2) a polycarbonate resin, and (B) a compatibilizer capable of forming a stereo-complex with the polylactic acid resin. According to the present invention, the polylactic acid resin composition is environmentally-friendly and has excellent appearance and improved welding impact strength, as well as improved mechanical strength and heat resistance. Accordingly, it can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example electronic parts, office machines, miscellaneous goods, and the like. | 03-04-2010 |
| 20100125112 | Natural Fiber-Reinforced Polylactic Acid Resin Composition and Molded Product Made Using the Same - Disclosed is a natural fiber-reinforced polylactic acid resin composition that includes (A) a first polylactic acid resin; and (B) a natural fiber surface-treated with a second polylactic acid resin. The second polylactic acid resin can include a different isomer from the first polylactic acid resin, or alternatively, when measured under isothermal conditions after quenching from about 240° C. to a crystallization temperature, a spherulite crystal is first formed at a surface of the natural fiber and the growth rate at the surface is faster than at other positions. A molded product made using the natural fiber-reinforced polylactic acid resin composition is also disclosed. | 05-20-2010 |
| 20100160558 | Polyhydroxy Alkanoate Resin Composition and Molded Product Made Using the Same - Disclosed are a polyhydroxy alkanoate resin composition including (A) a polyhydroxy alkanoate resin and (B) a vinyl-based copolymer resin including (B-1) a copolymer including two or more monomers comprising an aromatic vinyl monomer, an unsaturated nitrile monomer, an acryl-based monomer, or a combination thereof; and (B-2) a rubber-modified vinyl-based graft copolymer and a molded product fabricated using the same. | 06-24-2010 |
| 20100160559 | Polylactic Acid/Polycarbonate Resin Composition and Molded Product Made Using the Same - Disclosed is a polylactic acid/polycarbonate resin composition including (A) a mixed resin including (a1) a polycarbonate resin and (a2) a polylactic acid resin, and (B) a modified acrylic-based resin, and a molded product made using the same. | 06-24-2010 |
| 20100168332 | Polylactic Acid Resin Composition and Molded Product Using the Same - Disclosed are a polylactic acid resin composition that includes (A) about 10 to about 80 wt % of a polylactic acid resin; (B) about 5 to about 50 wt % of a rubber modified vinyl-based graft copolymer; (C) about 10 to about 80 wt % of a vinyl-based copolymer; and (D) about 5 to about 75 wt % of poly(meth)acrylic acid alkyl ester, and a molded product made using the same. | 07-01-2010 |
