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Chung, Miaoli County

Chia-Tin Chung, Miaoli County TW

Patent application numberDescriptionPublished
20110001152LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a convex package unit. The substrate unit has a substrate body and a chip-placing area. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area, and the annular reflecting resin body has an inner surface that has been cleaned by plasma to form a clean surface. The convex package unit has a convex package resin body disposed on the substrate body in order to cover the LED chips. The position of the convex package resin body is limited in the resin position limiting space.01-06-2011
20110006318LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.01-13-2011

Chi-Long Chung, Miaoli County TW

Patent application numberDescriptionPublished
20080280418METHOD FOR MANUFACTURING THE SHALLOW TRENCH ISOLATION STRUCTURE - A method for manufacturing a shallow trench isolation (STI) structure is provided. In the method, a substrate is initially provided. Then, a patterned pad layer and a patterned mask layer are successively formed in order on the substrate. After that, a portion of the substrate is removed by using the patterned mask layer and the patterned pad layer as a mask to form trenches in the substrate. Next, a first insulation layer is formed in the trenches. Afterwards, a protection layer is conformally formed on the substrate. Then, a second insulation layer is formed on the protection layer above the first insulation layer. Next, the patterned mask layer and the patterned pad layer are removed. Finally, a portion of the protection layer and the second insulation layer are removed.11-13-2008

Ching An Chung, Miaoli County TW

Patent application numberDescriptionPublished
20090275369STATION CONTROL METHOD AND STATION USING THE SAME - An apparatus is provided, for reducing power consumption in a system operating in a power saving mode, comprising a controller, an oscillator circuit and a voltage regulator. The controller provides a first control signal and a second control signal. The oscillator circuit, connected to the controller, wherein the controller controls the oscillator circuit according to the second control signal. The voltage regulator providing electric power to the oscillator circuit, connected to the controller, wherein the controller controls the voltage regulator according to the first control signal.11-05-2009
20100304780Low Power Module for a Station of a Wireless Communication System and Related Method - The invention relates to a low power module, and in particular, to a low power module applied in a station of a wireless communication system. A low power module includes a first MAC module, a second MAC module, a low power switch register, a control register unit, a slow clock generator, and a multiplexer (MUX). The first and second MAC module transmits and receives packets in a normal operational mode and a power save mode, respectively. The low power switch register switches a current mode to another mode. The control register unit controls the RF/BB module and the clock generator under the control of the low power switch register. The slow clock generator generates a slow operational clock for the second MAC module in the power save mode. The MUX chooses the normal operational or the slow operational clock periodically as a clock of the second MAC module according to the control register unit.12-02-2010

Patent applications by Ching An Chung, Miaoli County TW

Lung-Pin Chung, Miaoli County TW

Patent application numberDescriptionPublished
20090015174LIGHT SOURCE APPARATUS AND DRIVING APPARATUS THEREOF - A light source apparatus and a driving apparatus thereof are provided. The driving apparatus includes a first node, a second node, a clock synchronization unit, a control unit, a switch unit, and a feedback unit. The driving apparatus receives an AC voltage through the first and the second nodes. The clock synchronization unit converts the AC voltage into a clock synchronization signal. The control unit converts a preset brightness value into a driving current, outputs an adjusting signal according to a timing of the clock synchronization signal, and modulates a pulse width of the adjusting signal according a feedback signal. The switch unit determines whether or not the AC voltage is provided to the light source module according to a control of the adjusting signal. The feedback unit detects a load state of the light source module, and outputs the feedback signal to the control unit according a detection result.01-15-2009

Yi-Hsun Chung, Miaoli County TW

Patent application numberDescriptionPublished
20090141534DETECTION APPARATUS AND METHOD FOR SEQUENTIALLY PROGRAMMING MEMORY - A detection apparatus for sequentially programming a memory is provided. The detection apparatus comprises a current sensor and a programming controller. The current sensor is coupled to a programming source and a memory cell. The current sensor detects change of a programming current between the programming source and the memory cell and generates a control signal according to the detection result. The programming controller is coupled to the current sensor. The programming controller receives the control signal and generates a programming state signal.06-04-2009
20090238023MEMORY SYSTEM - A memory system is provided, comprising at least one memory unit and a source power supply circuit. Each memory unit is coupled between a source voltage and a ground voltage and accesses digital data according to a word line signal and a bit line signal. The source power supply circuit provides the source voltage to the memory units. When the memory unit is in a writing status, the source voltage is the first power voltage. When the memory unit is in a reading status, the source voltage is the second power voltage. The second power voltage equals to the first power voltage subtracted by a specific voltage for avoiding rewriting error.09-24-2009
20100177556ASYMMETRIC STATIC RANDOM ACCESS MEMORY - An asymmetric static random access memory (SRAM) device that includes at least one SRAM cell is provided. The SRAM cell includes the first inverter and the second inverter. The first inverter is coupled between a first power and a ground power, and includes a first output terminal coupled to a first node and a first input terminal coupled to a second node. The second inverter is coupled between the first power and the ground power, and includes a second input terminal coupled to the first node and a second output terminal coupled to the second node. When the first inverter and the second inverter receive current from the first power, the SRAM cell is programmed to a predetermined value in advance according to different conductance levels of the first inverter and the second inverter.07-15-2010
20100202219BURN-IN METHODS FOR STATIC RANDOM ACCESS MEMORIES AND CHIPS - A burn-in method for SRAMs and chips. For a memory cell of the SRAM, the SRAM burn-in method controls the control signals of the memory cell to generate current paths to pass through the memory cell, the corresponding bit-line and the corresponding bit-line-bar. The contacts/vias in the current paths are tested by providing burn-in currents to flow through the current paths, so that mismatched contacts/vias are burned by the burn-in currents. SRAMs that fail the burn-in test are abandoned after the burn-in procedure.08-12-2010