Chung-Lin
Chung-Lin Chang, Kaohsiung City TW
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20140044229 | SHIFT REGISTER AND VOLTAGE ADJUSTING CIRCUIT AND VOLTAGE ADJUSTING METHOD THEREOF - A shift register and a voltage adjusting circuit and method thereof are disclosed. The voltage adjusting circuit includes a first input terminal, a second input terminal, a transistor, a first capacitor, a second capacitor, and an output terminal. The first input terminal receives a second clock signal. The second input terminal receives a fourth clock signal. The transistor has a source electrode, a drain electrode, and a gate electrode. The source electrode is coupled to ground and the gate electrode is coupled to the second input terminal. The first capacitor is coupled between the drain electrode and the first input terminal. One end of second capacitor is coupled between the first capacitor and drain electrode, and the other end of second capacitor is coupled between the second input terminal and gate electrode. The output terminal is coupled between the first capacitor and drain electrode to output an adjusted voltage. | 02-13-2014 |
20140159086 | ACTIVE DEVICE ARRAY SUBSTRATE AND DISPLAY PANEL - An active device array substrate and a display panel are provided. The active device array substrate includes a substrate, a first conductor layer, a gate dielectric layer, a second conductor layer, an overcoat layer, a transparent electrode, a capacitive layer and pixel electrodes. The first conductor layer includes gate lines and light-shielding patterns. The gate dielectric layer covers the first conductor layer. The second conductor layer includes data lines and drain electrodes. Each of the data lines correspondingly overlaps one of the light-shielding patterns. The transparent electrode covers the overcoat layer. The pixel electrode is disposed on the capacitive layer and covers a portion of the shielding pattern. Each of the light-shielding patterns has a width greater than that of the overlapping data line. The gap between the edge of the light-shielding pattern and that of the overlapping data line is not greater than 2.5 microns. | 06-12-2014 |
20140198277 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes a bottom substrate, at least one thin film transistor, an overcoat layer, a bottom common electrode, at least one pixel electrode and a liquid crystal layer. The thin film transistor is disposed on the bottom substrate, including a gate electrode, a source electrode and a drain electrode. The overcoat layer is disposed above the thin film transistor. The bottom common electrode is disposed on the overcoat layer. The pixel electrode is disposed above the bottom common electrode and electrically connected to the drain electrode. The liquid crystal layer is disposed above the pixel electrode. | 07-17-2014 |
20140252381 | ACTIVE DEVICE ARRAY SUBSTRATE - An active device array substrate for saving material cost includes a substrate, scan lines, data lines, a thin film transistor, a color filter layer, a transparent conductive layer, an insulating layer and a pixel electrode. The color filter layer covers and contacts the scan lines, data lines and the thin film transistor. The transparent conductive layer is disposed on the color filter layer and electrically isolated from the scan lines, the data lines and the thin film transistor by the color filter layer. The insulating layer covers the transparent conductive layer. The pixel electrode is disposed on the insulating layer and connected to the thin film transistor. | 09-11-2014 |
Chung-Lin Huang, Taipei TW
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20090053873 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE - A method of forming a semiconductor structure is provided. The method includes providing a substrate and forming a mask layer on the substrate. Next, dielectric isolations are formed in the mask layer and the substrate, wherein the dielectric isolations extend above the substrate. Then, the mask layer is removed to expose a portion of the substrate, and a dielectric layer is formed on the exposed portion of the substrate. Subsequently, a first conductive layer is formed on the dielectric layer, and a portion of the dielectric isolation is removed, wherein a top surface of the remaining dielectric isolation is lower than a top surface of the first conductive layer. Moreover, a conformal layer is formed over the substrate, and a second conductive layer is formed on the conformal layer. | 02-26-2009 |
Chung-Lin Huang, Taoyuan County 330 TW
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20110053337 | SELF-ALIGNMENT METHOD FOR RECESS CHANNEL DYNAMIC RANDOM ACCESS MEMORY - A self-alignment method for a recess channel dynamic random access memory includes providing a substrate with a target layer, a barrier layer and a lining layer, wherein the target layer has shallow trench isolation structures; patternizing the lining layer, barrier layer and target layer to form recess trench channels; depositing a dielectric layer onto the recess trench channel; forming an ion doped region in the target layer; removing a portion of the dielectric layer to expose a portion of the recess trench channel; forming a filler layer covered onto the recess trench channel; removing a portion of the filler layer to expose a portion of the recess trench channel; forming a passivation layer onto the recess trench channel; removing the passivation layer on the lining layer; and removing the lining layer to form a plurality of structural monomers disposed at the recess trench channel and protruded from the target layer. | 03-03-2011 |
20120012905 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is disclosed which includes a silicide substrate, a nitride layer, two STIs, and a strain nitride. The silicide substrate has two doping areas. The nitride layer is deposited on the silicide substrate. The silicide substrate and the nitride layer have a recess running through. The two doping areas are at two sides of the recess. The end of the recess has an etching space bigger than the recess. The top of the silicide substrate has a fin-shaped structure. The two STIs are at the two opposite sides of the silicide substrate (recess). The strain nitride is spacer-formed in the recess and attached to the side wall of the silicide substrate, nitride layer, two STIs. The two doping areas cover the strain nitride. As a result, the efficiency of semiconductor is improved, and the drive current is increased. | 01-19-2012 |
Chung-Lin Lai, Taichung City TW
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20150224822 | Wheel Hub - A wheel hub includes tubular first and second hub bodies. The first hub body includes a first surrounding wall and a first spoke-mounting segment. The first surrounding wall has a first end portion and a first coupling portion disposed on the first end portion. The first spoke-mounting segment is connected to the first surrounding wall at a position opposite to the first end portion. The second hub body includes a second surrounding wall and a second spoke-mounting segment connected to the second surrounding wall. The second surrounding wall has a second end portion facing the first end portion and a second coupling portion disposed on the second end portion and coupled fixedly to the first coupling portion. | 08-13-2015 |
Chung-Lin Liao, Taichung City TW
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20150125327 | Pumping Device - A pumping device includes a frame body, a pump body, a piston rod, a drive shaft, a main guiding member, a carrier block, a plug unit, and a rotary-to-linear motion conversion mechanism disposed between the carrier block and the drive shaft so as to convert rotation of the drive shaft to linear motion of the carrier block. A shaft axis of the drive shaft and a piston axis of the piston rod cooperatively define a vertical plane. A bottom surface of the carrier block is guided by the main guiding member and defines a bottom plane which is orthogonal to the vertical plane. | 05-07-2015 |
Chung-Lin Tsai, Chu-Nan TW
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20150332629 | DISPLAY - A display is disclosed. The display comprises a panel, a data driver and a scan driver. The panel comprises pixels, data lines and scan lines. The data lines transmit data signals to the pixels, and the scan lines transmit scan signals to the pixels. The data driver provides the data signals, and the scan driver provides the scan signals. The scan driver comprises a shift register circuit. The shift register circuit comprises an i+1 | 11-19-2015 |
Chung-Lin Tsai, Chung-Lin TW
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20100290253 | Light Guide Apparatus Of Backlight Module - A light guide apparatus of a backlight module is provided. The light guide apparatus includes a light guide plate and a plurality of LEDs serving as light sources disposed at one lateral side of the light guide plate. The light guide plate includes a circuit configured thereon, and the light sources are welded on the circuit of the light guide plate. | 11-18-2010 |
Chung-Lin Tsai, Taipei TW
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20100232138 | Light Guide Plate Having Sectional Light Guiding Structure - A light guide plate (LGP) having a sectional light guiding structure is provided. The LGP is integrally configured with first grooves extending from a first side of the LGP to a second side of the LGP, and second grooves extending from a third side of the LGP to a fourth side of the LGP. The first grooves intersect with the second grooves, thus dividing the first surface of the LGP into a plurality of light guiding sections. Light sources are disposed in the first grooves and/or the second grooves. A sequence of lighting the light sources is controlled for respectively controlling the light sources to project light into the light guiding sections, so that the light guiding sections are controlled to guide the light according to a predetermined sequence. | 09-16-2010 |
Chung-Lin Tsai, Chungli TW
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20110157918 | BACK LIGHT MODULE - A backlight module is provided in the present invention. The backlight module includes a light guide plate, a light source plate and a plurality of side-view lighting elements. The light guide plate comprises a light guide body being an integrally-formed single plate body and comprising a plurality of elongated grooves and a plurality of penetrated grooves. The penetrated grooves and the elongated grooves are collectively arranged on a surface of the light guide plate to separate the light guide plate into a plurality of light emitting regions. The side-view lighting elements arranged on the light source plate are attached to a side of the light guide body and respectively disposed for the penetrated grooves to illuminate corresponding light emitting regions. | 06-30-2011 |
Chung-Lin Tsai, Chungli City TW
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20120069600 | Double-Sided Light-Emitting Light Guide Plate Assembly and Method for Manufacturing the Same - A double-sided light-emitting light guide plate assembly, and a method for manufacturing the same are disclosed, wherein a reflector is arranged between a first light guide plate and a second light guide plate. When light is emitted from a light source, it enters into the first light guide plate and the second light guide plate from one lateral side of the double-sided light-emitting light guide plate assembly. Through the reflector having two opposite reflective surface, the light is output from the first light output surface of the first light guide plate, and the second light output surface of the second light guide plate, such that the light guide plate assembly of the present invention can emit light from its two opposite surfaces. | 03-22-2012 |
Chung-Lin Tsai, Chung-Li TW
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20110050464 | Key Structure Having Improved Light Emitting Efficiency - A key structure having an improved light emitting efficiency is provided. The key structure includes a light guide plate, an isolation sheet, a circuit board, an elastic member, and a key cap sequentially disposed one on another in order. A circuit and a plurality of first electrical contacts are distributed on a top surface of the light guide plate. An optical structure is disposed at a bottom surface of the light guide plate. The isolation sheet has a light reflective surface facing the light guide plate. A light source emits a light into the light guide plate. The light is reflected by the optical structure to pass through the through holes configured at the isolation sheet, thus allowing more light outputting through the through holes, so as to improve the illumination of the key cap, and improve the light emitting efficiency. | 03-03-2011 |
20110122649 | Method And Structure For Uniforming Light Emitted From Backlight Module - A method and a structure for improving the uniformity light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light. In such a way, by designing particular distribution intensities of the optical microstructures and the optical sub-microstructures, the light emitted from the LGP can be uniformed. | 05-26-2011 |
Chung-Lin Tseng, Zhongli City TW
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20120139765 | Processing System Compensating DC Offset and Gain Error - A processing system including a first processing module and a second processing module is disclosed. The first processing module transforms and amplifies a grounded signal to generate a first processed signal and transforms and amplifies a predetermined signal to generate a second processed signal. The second processing module transforms the first processed signal to a first digital code according to a first reference voltage group and transforms the second processed signal to a second digital code according to a second reference voltage group. The second processing module adjusts a third reference voltage group according to the first and the second digital codes, and during a normal mode, the second processing module generates a third digital code according to the adjusted third voltage group. | 06-07-2012 |
20130033906 | Apparatus And Method For Providing An Alternating Current - A system for providing, from a direct current (DC) voltage source, an alternating current (AC) to an electrical grid outputting a grid voltage, the system including: a transformer for coupling to the DC voltage source through a first switch controlled by a first control signal, and configured to provide a converted voltage based on a DC voltage; a rectifier coupled to the transformer, and configured to generate an envelope voltage of the converted voltage; a plurality of switches coupled to the rectifier to receive the generated envelope voltage of the converted voltage, the plurality of switches being controlled by a plurality of control signals, respectively, and configured to generate the AC from the generated envelope voltage of the converted voltage; and control apparatus coupled to the first switch and the plurality of switches, and configured to provide, based on the grid voltage, the first control signal and the plurality of control signals. | 02-07-2013 |
Chung-Lin Wang, Taichung City TW
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20120267262 | CONTAINER FOR A CONTACT LENS - This invention provides a container for a contact lens, comprising: a central recess; a peripheral groove surrounding the central recess; and a rim surrounding the peripheral groove; wherein the central recess is a curved surface having one or a plurality of continuous R values less than an R value of the contact lens in its natural state, and wherein the R value is a radius of curvature of a curved surface. | 10-25-2012 |
20120272866 | Contact Lenses with Pores for High Oxygen Permeability and Manufacturing Method Thereof - Contact lenses with pores having high oxygen permeability and a manufacturing method thereof. The manufacturing method comprises the steps of uniformly mixing water-soluble salts and the formula of contact lenses having hydrophilic monomers to form a mixed formula; molding and forming the mixed formula to obtain contact lenses; dissolving and dialyzing the water-soluble salts by a water solution so as to form a plurality of pores with a predetermined diameter on a surface and in the interior of the contact lenses. The diameter of pore size has an allowable range between 0.03 μm and 0.05 μm such that the contact lenses with high oxygen permeability can be obtained. | 11-01-2012 |
Chung-Lin Wang, Hsinchu City 300 TW
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20110130064 | METHOD FOR FABRICATING ALTERNATING-CURRENT LIGHT-EMITTING-DIODE PACKAGE DEVICE - The present invention discloses a method for fabricating an AC LED package device, which comprises steps: providing a plurality of LED modular chips each having a plurality of LEDs in same polar direction in series; connecting forward and reversely the LED modular chips with a wire-bonding method to form an AC LED package device; and connecting the AC LED package device with an AC power source. In the present invention, the LED modular chips, each of which have LEDs all connected in same polar direction, are used to form an AC LED package device. Therefore, the present invention is using less-complicated photomasks compared with prior art. Accordingly, the present invention simplifies the process, promotes the yield and lowers the cost. | 06-02-2011 |
Chung-Lin Wang, Hsinchu City TW
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20090104471 | Solderable aluminum-based material - The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology. | 04-23-2009 |
20140209937 | PACKAGE-FREE AND CIRCUIT BOARD-FREE LED DEVICE AND METHOD FOR FABRICATING THE SAME - The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield. | 07-31-2014 |
Chung-Lin Wu, Hsinchu City TW
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20090165537 | Device and method for optical nanoindentation measurement - This invention relates to a device and method for optical nanoindentation measurement, according to which respective measurement results are obtained by having an indenter tip apply load to a fixed portion of a thin film, having an indenter tip apply load to a non-fixed portion of a thin film, and having a vibrating component transmit the dynamic properties of the vibration to the thin film. By combining the above measurement results in calculations, the Young's modulus, the Poisson's ratio, and the density of the thin film can be obtained. | 07-02-2009 |
20140174204 | CAPACITIVE SHEAR FORCE SENSOR AND METHOD FOR FABRICATING THEREOF - A capacitive shear force sensor and a method for fabricating thereof are provided. The capacitive shear force sensor includes a first electric field shielding layer, a second electric field shielding layer, a driving electrode, a first sensing electrode, a second sensing electrode and a dielectric layer. The second electric field shielding layer is disposed under the first electric field shielding layer. The driving electrode is disposed between the first electric field shielding layer and the second electric field shielding layer. The first and the second sensing electrodes are disposed between the driving electrode and the second electric field shielding layer. The dielectric layer is disposed between the driving electrode and the first sensing electrode, and between the driving electrode and the second sensing electrode. The first sensing electrode and the driving electrode form a first capacitor. The second sensing electrode and the driving electrode form a second capacitor. | 06-26-2014 |