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Chung-Lin
Chung-Lin Huang, Taoyuan County 330 TW
| Patent application number | Description | Published |
|---|---|---|
| 20110053337 | SELF-ALIGNMENT METHOD FOR RECESS CHANNEL DYNAMIC RANDOM ACCESS MEMORY - A self-alignment method for a recess channel dynamic random access memory includes providing a substrate with a target layer, a barrier layer and a lining layer, wherein the target layer has shallow trench isolation structures; patternizing the lining layer, barrier layer and target layer to form recess trench channels; depositing a dielectric layer onto the recess trench channel; forming an ion doped region in the target layer; removing a portion of the dielectric layer to expose a portion of the recess trench channel; forming a filler layer covered onto the recess trench channel; removing a portion of the filler layer to expose a portion of the recess trench channel; forming a passivation layer onto the recess trench channel; removing the passivation layer on the lining layer; and removing the lining layer to form a plurality of structural monomers disposed at the recess trench channel and protruded from the target layer. | 03-03-2011 |
| 20120012905 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is disclosed which includes a silicide substrate, a nitride layer, two STIs, and a strain nitride. The silicide substrate has two doping areas. The nitride layer is deposited on the silicide substrate. The silicide substrate and the nitride layer have a recess running through. The two doping areas are at two sides of the recess. The end of the recess has an etching space bigger than the recess. The top of the silicide substrate has a fin-shaped structure. The two STIs are at the two opposite sides of the silicide substrate (recess). The strain nitride is spacer-formed in the recess and attached to the side wall of the silicide substrate, nitride layer, two STIs. The two doping areas cover the strain nitride. As a result, the efficiency of semiconductor is improved, and the drive current is increased. | 01-19-2012 |
Chung-Lin Huang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090053873 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE - A method of forming a semiconductor structure is provided. The method includes providing a substrate and forming a mask layer on the substrate. Next, dielectric isolations are formed in the mask layer and the substrate, wherein the dielectric isolations extend above the substrate. Then, the mask layer is removed to expose a portion of the substrate, and a dielectric layer is formed on the exposed portion of the substrate. Subsequently, a first conductive layer is formed on the dielectric layer, and a portion of the dielectric isolation is removed, wherein a top surface of the remaining dielectric isolation is lower than a top surface of the first conductive layer. Moreover, a conformal layer is formed over the substrate, and a second conductive layer is formed on the conformal layer. | 02-26-2009 |
Chung-Lin Tsai, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100232138 | Light Guide Plate Having Sectional Light Guiding Structure - A light guide plate (LGP) having a sectional light guiding structure is provided. The LGP is integrally configured with first grooves extending from a first side of the LGP to a second side of the LGP, and second grooves extending from a third side of the LGP to a fourth side of the LGP. The first grooves intersect with the second grooves, thus dividing the first surface of the LGP into a plurality of light guiding sections. Light sources are disposed in the first grooves and/or the second grooves. A sequence of lighting the light sources is controlled for respectively controlling the light sources to project light into the light guiding sections, so that the light guiding sections are controlled to guide the light according to a predetermined sequence. | 09-16-2010 |
Chung-Lin Tsai, Chung-Li TW
| Patent application number | Description | Published |
|---|---|---|
| 20110050464 | Key Structure Having Improved Light Emitting Efficiency - A key structure having an improved light emitting efficiency is provided. The key structure includes a light guide plate, an isolation sheet, a circuit board, an elastic member, and a key cap sequentially disposed one on another in order. A circuit and a plurality of first electrical contacts are distributed on a top surface of the light guide plate. An optical structure is disposed at a bottom surface of the light guide plate. The isolation sheet has a light reflective surface facing the light guide plate. A light source emits a light into the light guide plate. The light is reflected by the optical structure to pass through the through holes configured at the isolation sheet, thus allowing more light outputting through the through holes, so as to improve the illumination of the key cap, and improve the light emitting efficiency. | 03-03-2011 |
| 20110122649 | Method And Structure For Uniforming Light Emitted From Backlight Module - A method and a structure for improving the uniformity light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light. In such a way, by designing particular distribution intensities of the optical microstructures and the optical sub-microstructures, the light emitted from the LGP can be uniformed. | 05-26-2011 |
Chung-Lin Tsai, Chung-Lin TW
| Patent application number | Description | Published |
|---|---|---|
| 20100290253 | Light Guide Apparatus Of Backlight Module - A light guide apparatus of a backlight module is provided. The light guide apparatus includes a light guide plate and a plurality of LEDs serving as light sources disposed at one lateral side of the light guide plate. The light guide plate includes a circuit configured thereon, and the light sources are welded on the circuit of the light guide plate. | 11-18-2010 |
Chung-Lin Tsai, Chungli TW
| Patent application number | Description | Published |
|---|---|---|
| 20110157918 | BACK LIGHT MODULE - A backlight module is provided in the present invention. The backlight module includes a light guide plate, a light source plate and a plurality of side-view lighting elements. The light guide plate comprises a light guide body being an integrally-formed single plate body and comprising a plurality of elongated grooves and a plurality of penetrated grooves. The penetrated grooves and the elongated grooves are collectively arranged on a surface of the light guide plate to separate the light guide plate into a plurality of light emitting regions. The side-view lighting elements arranged on the light source plate are attached to a side of the light guide body and respectively disposed for the penetrated grooves to illuminate corresponding light emitting regions. | 06-30-2011 |
Chung-Lin Tsai, Chungli City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120069600 | Double-Sided Light-Emitting Light Guide Plate Assembly and Method for Manufacturing the Same - A double-sided light-emitting light guide plate assembly, and a method for manufacturing the same are disclosed, wherein a reflector is arranged between a first light guide plate and a second light guide plate. When light is emitted from a light source, it enters into the first light guide plate and the second light guide plate from one lateral side of the double-sided light-emitting light guide plate assembly. Through the reflector having two opposite reflective surface, the light is output from the first light output surface of the first light guide plate, and the second light output surface of the second light guide plate, such that the light guide plate assembly of the present invention can emit light from its two opposite surfaces. | 03-22-2012 |
Chung-Lin Wang, Hsinchu City 300 TW
| Patent application number | Description | Published |
|---|---|---|
| 20110130064 | METHOD FOR FABRICATING ALTERNATING-CURRENT LIGHT-EMITTING-DIODE PACKAGE DEVICE - The present invention discloses a method for fabricating an AC LED package device, which comprises steps: providing a plurality of LED modular chips each having a plurality of LEDs in same polar direction in series; connecting forward and reversely the LED modular chips with a wire-bonding method to form an AC LED package device; and connecting the AC LED package device with an AC power source. In the present invention, the LED modular chips, each of which have LEDs all connected in same polar direction, are used to form an AC LED package device. Therefore, the present invention is using less-complicated photomasks compared with prior art. Accordingly, the present invention simplifies the process, promotes the yield and lowers the cost. | 06-02-2011 |
Chung-Lin Wang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090104471 | Solderable aluminum-based material - The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology. | 04-23-2009 |
Chung-Lin Wu, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090165537 | Device and method for optical nanoindentation measurement - This invention relates to a device and method for optical nanoindentation measurement, according to which respective measurement results are obtained by having an indenter tip apply load to a fixed portion of a thin film, having an indenter tip apply load to a non-fixed portion of a thin film, and having a vibrating component transmit the dynamic properties of the vibration to the thin film. By combining the above measurement results in calculations, the Young's modulus, the Poisson's ratio, and the density of the thin film can be obtained. | 07-02-2009 |