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Chung-Hsien
Chung-Hsien Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080230317 | Oil Circulation System For A Compressor - An oil circulation system for a compressor comprises a control valve body integrated therein with a pressure sensor, a differential pressure sensor and a temperature sensor. The control valve body is further integrated therein with a temperature control valve connected to an external cooler for lowering a temperature of a hydraulic oil, an oil filter for filtering the cooled hydraulic oil into a clean hydraulic oil, and a pressure relief valve for relieving a pressure of the clean hydraulic oil, which is then circulated back into the compressor for use. The integration of the aforementioned components effectively downsizes an entire set of machinery comprising the compressor and the oil circulation system and increases an efficiency of the compressor. | 09-25-2008 |
| 20090035937 | In-Situ Deposition for Cu Hillock Suppression - A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two. | 02-05-2009 |
Chung-Hsien Chuang, Sanchong City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090034593 | Data transmission rate adjustment system and method thereof - A data transmission rate adjustment system and method thereof comprise a driving module and a control module. The driving module performs a predetermined mathematical calculation based on a transmission rate request to generate a divisor. The control module then performs a division that divides a reference frequency by the divisor to generate a first transmission rate so that a data receiving terminal can receive data sent from a data sending terminal through the driving module based on the first transmission rate. The driving module monitors a transmission error rate of the data received by the data receiving terminal. If the transmission error rate exceeds a predetermined value, the divisor is automatically adjusted to generate a second transmission rate. The second transmission rate is also provided to replace the first transmission rate. | 02-05-2009 |
Chung-Hsien Huang, Tucheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100279037 | MULTI-LAYERED GLASS STRUCTURE - A multi-layered glass structure includes at least three glass substrates. The edges of the three glass substrates are sealed and fastened. There is a cavity space between two adjacent glass substrates, and the multi-layered glass structure includes at least one vacuum cavity space. The multi-layered glass structure has a flat vacuum structure to enhance the heat insulation and separating effect and the noise insulation effect of the multi-layered glass structure. | 11-04-2010 |
Chung-Hsien Lin, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100039424 | METHOD OF REDUCING OFFSET VOLTAGE IN A MICROELECTROMECHANICAL DEVICE - A method of conditioning a microelectromechanical device is disclosed. In one embodiment the method comprises applying a conditioning signal to a microelectromechanical device having an offset voltage of a first sign, the conditioning signal having an average that is of a second sign which is opposite the first sign. In another embodiment the method comprises applying a conditioning signal to a microelectromechanical device having an offset voltage of a first value, the conditioning signal having an average of a second value which differs from the first value. | 02-18-2010 |
Chung-Hsien Lin, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20080298198 | OPTICAL RECORDING APPARATUS AND METHOD FOR OPTIMIZING RECORDING SIGNAL - An exemplary method for optimizing a recording signal of an optical recording apparatus to record data onto a disc, the recording signal having a first pulse-width parameter, the method includes selecting an initial value of the first pulse-width parameter; generating adjusted values based on the initial value to record test data onto the disc respectively; measuring mark lengths of lands; determining average lengths of the mark lengths of lands; determining differences between the average lengths and a predetermined standard length; linear curve fitting the adjusted values and the differences employing the following linear curve fitting equation: Y=AX+B to obtain the constants A and B, wherein X represents the adjusted values, Y represents the differences; determining and storing an optimum value of the first pulse-width parameter to be used for recording the data onto the disc, this optimum value equals to −B/A. An optical recording apparatus is also provided. | 12-04-2008 |
Chung-Hsien Lin, Ta-Li City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100060580 | Computer mouse with less friction - A mouse includes a casing with a curved top and at least one click pad is located on the curved top of a front end of the casing. A sensing means such as a roller or an optical sensor is connected to an underside of the casing and a plurality of support members are connected to the underside of the casing. Each support member includes a semi-sphere protrusion which is in contact with a desk top by a small area so that the friction between the mouse and the desk top or mouse pad is reduced. | 03-11-2010 |
Chung-Hsien Lin, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120025389 | Hermetic Wafer Level Packaging - Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers. | 02-02-2012 |
Chung-Hsien Lin, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080320196 | COMPUTER SYSTEM WITH PROCESSOR EXPANSION DEVICE - In a computer system, a processor expansion device is disposed in an expansion slot conforming to a bus agreement to expand processors. The processor expansion device includes one or more processors and corresponding memories. When the processor expansion device is disposed at the computer system, a BIOS of the computer system ports a bus routing of the processors on the processor expansion device and addresses the memories thereon. Therefore the number of the processors and the memories is expanded when the processor expansion device is disposed at the computer system. | 12-25-2008 |
Chung-Hsien Lu, Jhubei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090309741 | THERMAL DETECTION SYSTEM AND DETECTION METHOD THEREOF - A thermal detection method comprises steps of providing a rotation device, disposing a thermal sensor on the rotation device, rotating the rotation device, and using the thermal sensor to detect a temperature of an object without contacting the object. A thermal detection system comprises a rotation device and a thermal sensor disposed on the rotation device for detecting a temperature of an object without contacting the object. | 12-17-2009 |
| 20100097474 | SMOKE DETECTING METHOD AND SYSTEM - A smoke detecting method and system are provided. The smoke detecting method and system capture a plurality of images; determine whether a moving object exists in the plurality of images; select the images having the moving object to be analyzed; analyze whether the moving object is moving toward a specific direction and a displacement of a base point of the moving object; and determine the moving object as a smoke when the moving object is moving toward the specific direction and the displacement is less than a threshold value. | 04-22-2010 |
| 20100142822 | METHOD AND SYSTEM FOR DETECTING FLAME - A method and system for detecting flames are provided. The flame detection method based on image processing techniques performs the following steps to detecting flames. It first finds one or more bright objects in the images that are captured from videos. A flickering state of a bright object is then determined. To verify the existence of a flame, additionally subsequent images from the instant that a bright object first appears are utilized and the similar steps are applied to them. Finally a flame could be detected if the analyzed results are positive after the aforementioned steps have been performed. | 06-10-2010 |
Chung-Hsien Tsai, Chia Yi TW
| Patent application number | Description | Published |
|---|---|---|
| 20110285583 | PERCEPTIVE GLOBAL POSITIONING DEVICE AND METHOD THEREOF - A perceptive global positioning device is disposed on or carried by a carrier (vehicle, pedestrian, etc.) for receiving positioning signals transmitted from satellites, to detect various behavioral states related to movement and correct errors in positioning data for positioning the carrier. The positioning device includes a sensor for receiving positioning data related to the global position of the carrier transmitted from satellites, a database for storing the positioning data received by the sensor and a preset behavioral transition matrix of the carrier, an analysis module for analyzing the positioning data and behavioral transition matrix to obtain predictable behavior data, and a correction module for comparing the predictable behavior data with the positioning data so as to correct errors of the positioning data of the carrier, thereby overcoming the defect of inaccurate data as encountered in the prior art. | 11-24-2011 |
| 20110313662 | NAVIGATION APPARATUS AND SYSTEM - A navigation apparatus and system provided on a mobile carrier performs error correction for positioning information and orienting information of the carrier through a position sensing module and an orientation sensing module and analyzes the corrected positioning information and orienting information by the usage of a route planning module, so as to generate corresponding route planning information, while simultaneously showing an instruction label having the route planning information correspondingly and a real image of the location surrounding the carrier. Thereby, the invention may provide not only an accurate carrier positioning function but also correct navigation information according to the behavior mode of a user. | 12-22-2011 |
Chung-Hsien Tseng, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090232335 | CONDENSER MICROPHONE - A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground. | 09-17-2009 |
Chung-Hsien Wu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100329967 | FABRICATION METHOD FOR CHALCOPYRITE POWDER - The invention provides a fabrication method for a chalcopyrite powder. The fabrication method includes: (a) mixing a Group IB compound and a Group IIIA compound in a solvent; (b) drying or precipitating the solution of step (a) to obtain a precursor containing Group IB and Group IIIA elements; (c) mixing a solution or powder containing a Group VIA compound with the precursor; and (d) heating the mixture of step (c) to obtain the chalcopyrite powder. | 12-30-2010 |
Chung-Hsien Wu, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080256376 | MULTI-THREAD POWER-GATING CONTROL DESIGN - The invention relates to a multi-thread power gating control design, setting idle components into a sleep mode to reduce power consumption due to current leakage. Based on compiler techniques, the invention arranges predicted-power-gating instructions into every thread of a may-happen-in-parallel region. A predicted-power-on instruction determines whether the corresponding component has been powered on, and powers on the component when it has not been powered on yet. A predicted-power-off instruction determines whether the component is required in the rest of the may-happen-in-parallel region, and powers off the component when it is required later. | 10-16-2008 |
Chung-Hsien Yang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100132736 | Test Cell Conditioner (TCC) Surrogate Cleaning Device - A test cell conditioner (TCC) surrogate cleaning device for cleaning the pin elements in a socket or electrical interface receptacle of a load board includes a main testing frame, a plurality of trays, testing chip receptacles and one or more pick up devices. Chips to be tested (electronic elements) are entrained on a tray, and a plurality of adhesive cleaning chips are entrained on another tray. The adhesive cleaning chip contains a solid layer and an adhesive layer, and an abrasive material is mingled in the adhesive layer. The pick up device removes the adhesive cleaning chip to a position above the testing chip receptacle and cleans up the oxides and other foreign materials sticking on the receptacle by absorption or abrasion. Interrupting the operation of the apparatus to clean the test probe by etching can be excluded so as to improve the working efficiency. | 06-03-2010 |
Chung-Hsien Zah, Kennesaw, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20080213529 | System and Method for Floor Covering Installation - Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on an underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface. Additionally, the tiles need not be installed directly on the floor surface. Rather, an underlayment, such as a film or cushion or cushion composite, may be positioned on the floor surface prior to the installation of tiles. | 09-04-2008 |
| 20100024329 | System and Method for Floor Covering Installation - Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on an underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface. Additionally, the tiles need not be installed directly on the floor surface. Rather, an underlayment, such as a film or cushion or cushion composite, may be positioned on the floor surface prior to the installation of tiles. | 02-04-2010 |
| 20100176189 | SYSTEM AND METHOD FOR FLOOR COVERING INSTALLATION - Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on an underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface. Additionally, the tiles need not be installed directly on the floor surface. Rather, an underlayment, such as a film or cushion or cushion composite, may be positioned on the floor surface prior to the installation of tiles. | 07-15-2010 |