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Chung-Chuan
Chung-Chuan Chou, Bade City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100156792 | MOUSE - A mouse is disclosed and includes a wheel assembly which includes a first wheel and a second wheel. The second wheel is disposed adjacent to the first wheel. There is a predetermined distance between the first wheel and the second wheel. Particularly, a user can selectively roll the first wheel, roll the second wheel, or both of roll the first wheel and the second wheel at a time by only one finger. | 06-24-2010 |
Chung-Chuan Hsieh, Panchiao City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090014913 | METHOD FOR FABRICATING LENS OF LIGHT EMITTING DIODE AND DEVICE THEREOF - A method for fabricating lens of light emitting diode and device thereof is disclosed, and the method includes providing a lead frame with multiple light emitting diode modules, positioning a mold releasing member on the lead frame, connecting a lens pattern device with the lead frame, injecting a resin into each lens mold, and curing the resin to lenses on the light emitting diodes modules. | 01-15-2009 |
| 20090085051 | Light emitting diode device - A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes. | 04-02-2009 |
Chung-Chuan Hsieh, Tucheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20110229993 | METHOD OF FABRICATING A LIGHT EMITTING DIODE CHIP HAVING PHOSPHOR COATING LAYER - A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive bump on at least one of the plurality of light emitting diodes; forming a phosphor coating layer over the substrate and the light emitting diodes; cutting the phosphor coating layer by a point cutter to remove an upper portion of the phosphor coating layer, so as to reduce a thickness of the phosphor coating layer and expose the conductive bump; and forming a plurality of individual light emitting diode chips having the phosphor coating layer by separating the plurality of light emitting diodes. | 09-22-2011 |
Chung-Chuan Hsieh, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110248289 | LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE - A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad. | 10-13-2011 |
Chung-Chuan Lin, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20100053839 | ELECTRONIC DEVICE WITH ELECTROSTATIC PROTECTION STRUCTURE - An electronic device includes a circuit board and an electrostatic protection structure. The circuit board has a top surface and a bottom surface opposite to the top surface. The electrostatic protection structure is positioned on the top surface of the circuit board. The electrostatic protection includes an insulating layer and a conducting layer coating on the insulating layer. Four ground terminals are formed on the bottom surface of the circuit board. The insulating layer includes a main portion and four first connecting portions extending from the main portion. The conducting layer on the four first connecting portion are connected to the four first ground terminal. | 03-04-2010 |
Chung-Chuan Lin, Taiping Tichung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100032242 | Pressure Relief Device for a Gear Box - A pressure relief device for a gear box which is disposed in the gear box and comprises a body, a blocking member and a spring. The body is defined with a penetrating hole. The spring pushes the blocking member and makes it seal the penetrating hole. When the pressure rises since the temperature therein is risen, and when the gas pressure in the gear box is larger than the force of the spring, the gas can push the blocking member and compress the spring, and then discharge from the penetrating hole of the body, thus reducing the pressure and the temperature of the gear box. | 02-11-2010 |