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Chun-Yuan
Chun-Yuan Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120069267 | DISPLAY MODULE AND ASSEMBLING METHOD THEREOF - A display module includes a backlight unit, a display panel, a fixing film, a covering plate, and a bezel. The backlight unit has a top portion, a bottom portion opposite to the top portion, a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side between the top and bottom portions. The display panel has a display surface and a back surface opposite to the display surface. The display panel is located on the top portion. The back surface of the display panel faces the top portion. The fixing film attached to the back surface extends toward the backlight unit and wraps the first and second sides and the bottom portion. The covering plate is disposed on the display surface of the display panel. The bezel connects the covering plate and exposes the first and second sides. | 03-22-2012 |
Chun-Yuan Chen, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090003004 | Backlight Module and the Method for Manufacturing the Same - A backlight module and a manufacture method thereof are provided. The backlight module includes a frame body and an optical plate. The frame body includes a first material frame and a second material frame, and the second material frame is embedded in the first material frame and the strength of the second material frame is higher than that of the first material frame. The first material frame enwraps part of the second material frame to form at least one connection part, and the optical plate is disposed in the frame body and is connected with at least one connection part. | 01-01-2009 |
| 20110037182 | Backlight Module and the Method for Manufacturing the Same - A backlight module and a manufacture method thereof are provided. The backlight module includes a frame body and an optical plate. The frame body includes a first material frame and a second material frame, and the second material frame is embedded in the first material frame and the strength of the second material frame is higher than that of the first material frame. The first material frame enwraps part of the second material frame to form at least one connection part, and the optical plate is disposed in the frame body and is connected with at least one connection part. | 02-17-2011 |
Chun-Yuan Chen, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120104194 | STAND STRUCTURE AND DISPLAY DEVICE - A display device includes a body, a supporting member and a fastening member. The body has an accommodating portion, and the supporting member assembled to the accommodating portion for supporting the body is in the first state or the second state. The supporting member in the first state is switched to the second state when pivoting in an angle. The fastening member is detachably assembled to a first position or a second position of the supporting member, such that the supporting member is fastened to the accommodating portion of the body by the fastening member. The fastening member is assembled to the first position of the supporting member when the supporting member assembled to the accommodating portion is in the first state, and the fastening member is assembled to the second position of the supporting member when the supporting member assembled to the accommodating portion is in the second state. | 05-03-2012 |
Chun-Yuan Cheng, Yunlin County TW
| Patent application number | Description | Published |
|---|---|---|
| 20120112810 | CLOCK DE-SKEWING DELAY LOCKED LOOP CIRCUIT - A clock de-skewing delay locked loop circuit is revealed. In the clock de-skewing delay locked loop circuit, a timing control circuit generates a first and a second clock signals according to an external and an internal clock signal. A clock delay line delays the first clock signal or the external clock signal to generate delay signals. A delay mirror circuit synchronizes the internal clock signal with the external clock signal. A phase adjustment circuit inverts the internal clock signal according to the phase difference. An inverting buffer circuit buffers the external clock signal or the first clock signal for adding an initial delay time so as to make a duty cycle of internal clock signal and of the external clock signal complement each other. Thus the duty cycle of the external clock signal in the proposed circuit is not necessarily 50%. | 05-10-2012 |
Chun-Yuan Cheng, Nantou County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100150357 | AMPLIFIER CIRCUIT AND METHOD OF SIGNAL AMPLIFICATION - An amplifier circuit and a method of signal amplification are provided. The amplifier circuit includes a first amplifier and a charge pump. The first amplifier includes a first terminal, a second terminal, and a third terminal. The first terminal is coupled to a first external voltage. The second terminal is coupled to a negative voltage. The third terminal is coupled to a ground reference voltage. The charge pump is coupled to the first amplifier for providing the negative voltage transformed from a second external voltage. | 06-17-2010 |
Chun-Yuan Chiu, Pingtung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090274085 | SYSTEM AND METHOD FOR PROVIDING MULTICAST AND/OR BROADCAST SERVICES - A method for a base station to provide a multicast and/or broadcast service (MBS) in a communication system. The method includes: transmitting system information on a system control information block (SCIB); transmitting MBS control information that is changed with relatively high frequency on a secondary multicast/broadcast control information block (S-MCIB); and transmitting MBS content data based on the MBS control information. | 11-05-2009 |
| 20090323564 | METHOD FOR OPERATION OF SYNCHRONOUS HARQ IN A WIRELESS COMMUNICATION SYSTEM - A method of operating synchronous Hybrid Automatic Repeat Request (HARQ) between a transmitting station and a receiving station in a Time-Division Duplex (TDD) communication system includes configuring, at the transmitting station, a plurality of HARQ processes; transmitting data packets to the receiving station using the plurality of HARQ processes, wherein the data packets do not include HARQ process identification information; receiving, from the receiving station, a plurality of HARQ feedback packets indicative of whether the data packets were correctly received at the receiving station, wherein the plurality of HARQ feedback packets do not include HARQ process identification information and wherein the plurality of HARQ feedback packets are received in a downlink slot; and mapping, by the transmitting station, the plurality of HARQ feedback packets to the plurality of HARQ processes. | 12-31-2009 |
| 20100067490 | SYSTEM AND METHOD FOR PROVIDING SERVICE CONTINUITY OF MULTICAST AND BROADCAST SERVICES IN A WIRELESS COMMUNICATION SYSTEM - There is provided a method of handing over a provided service from a serving base station to a target base station, the service including streaming content sent to a mobile station. The method includes receiving, at the target base station, a handover request from the serving base station, the handover request identifying the streaming content being provided to the mobile station by the serving base station, and an interrupt data packet, of the streaming content, last transmitted to the mobile station. The method includes sending a handover response to the serving base station and receiving a notification from the serving base station indicating that the target base station is selected for handover. The method includes receiving, from the serving base station, subsequent data packets of the streaming content that are later in time than the interrupt data packet and sending the received subsequent data packets to the mobile station. | 03-18-2010 |
| 20100131814 | Method for operation of synchronous HARQ in a wireless communication system - A method for operating synchronous HARQ between a transmitting station and a receiving station in a TDD communication system, includes configuring a plurality of HARQ processes at the transmitting station, and transmitting a data burst in a first subframe to the receiving station via one of the plurality of HARQ processes and using a frame structure including a plurality of regions of subframes. The method also includes receiving a second subframe transmitted from the receiving station and containing a HARQ feedback indicative of whether the data burst was correctly received at the receiving station. Further, the method includes determining whether the HARQ feedback is an acknowledgement (ACK) or a negative acknowledgement (NACK), and retransmitting, via the one of the plurality of HARQ processes, the data burst in a third subframe to the receiving station if it is determined that the HARQ feedback is a NACK. A total number of plurality of HARQ processes is determined based on a total number of uplink subframes between the first subframe and the third subframe. | 05-27-2010 |
| 20100278093 | Method and Apparatus for Multicast and Broadcast Retransmission in Wireless Communication Systems - Embodiments of method and apparatus for reception of multicast and broadcast (MBS) transmissions in a wireless communication system including a set of receiving devices is disclosed. A method embodiment includes encoding, by a transmission device, a plurality of MBS data bits to generate a plurality of MBS data versions, and transmitting, to the set of receiving devices, the plurality of MBS data versions, wherein the plurality of MBS data versions are transmitted in a predefined transmission pattern. The method also includes transmitting, to the set of receiving devices, identification and decoding information associated with each of the plurality of MBS data versions. | 11-04-2010 |
Chun-Yuan Chou, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090185399 | ACTIVE START JUDGMENT CIRCUIT - An active start judgment circuit is electrically connected to an AC/DC transforming power supply which has at least one standby power unit to transform AC to DC in regular conditions and a main power unit to transform the AC to the DC in an ON condition for operation of an electronic equipment. The start judgment circuit bridges the standby power unit and the main power unit, and generates a reference potential based on a voltage output from the standby power unit, and gets a power signal from the standby power unit to be compared with the reference potential to output a start signal to the main power unit to transform the AC to the DC. Thus the standby power unit can actively drive the main power unit to supply DC power to activate the electronic equipment. | 07-23-2009 |
Chun-Yuan Lee, Taichung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090102063 | Semiconductor package and method for fabricating the same - This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the dielectric layer to prevent delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost. | 04-23-2009 |
Chun-Yuan Lee, Zhudong Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100148993 | Ion-dielectric touch sensor and device using same - An ion-dielectric touch sensor detects a touching operation applied by a touching object thereto. The ion-dielectric touch sensor includes a base board, a first electrode, a second electrode, and a dielectric layer. The base board forms an electrode mounting surface on which the first and second electrodes are arranged in such a way that the second electrode is closed to but spaced from the first electrode. The dielectric layer is coated on the electrode mounting surface of the base board and encloses the first and second electrodes. When the touching object touches the dielectric layer of the ion-dielectric touch sensor, a variation of the electrical resistance between the first and second electrodes is caused. The variation of electrical resistance is detected by a detection circuit connected between the first and second electrodes. | 06-17-2010 |
Chun-Yuan Li, Taichung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080303134 | Semiconductor package and method for fabricating the same - A semiconductor package and a method for fabricating the same are disclosed, which includes: providing a carrier board, forming a plurality of metal bumps on the carrier board, forming a metal layer on the carrier board to encapsulate the metal bumps, having at least one semiconductor chip electrically connected to the metal layer, then forming an encapsulant on the carrier board to encapsulate the semiconductor chip, and next removing the carrier board and the metal bumps to correspondingly form a plurality of grooves on surface of the encapsulant, wherein bottom and sides of the grooves are covered with the metal layer to allow electroconductive components to be effectively positioned in the grooves and completely bonded with the metal layer. | 12-11-2008 |
Chun-Yuan Wang, Kuntien Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20120025706 | LED LAMP WITH REPLACEABLE LIGHT UNIT - An LED lamp with replaceable light unit according to the invention includes a heat dissipation housing, a metal connector, a driver circuit board, a light unit slice, a pad and a shade. The heat dissipation housing has an opening at one end and a joint portion at another end. The metal connector is disposed to the joint portion of the heat dissipation housing. The driver circuit board disposed inside the heat dissipation housing to electrically connect with metal connector. The light unit slice and the pad are disposed inside the opening, and the light unit slice is electrically connected with the driver circuit board. The shade is disposed inside the opening. The LED lamp with replaceable light unit can be realized by the assembly of the above elements according to the different preferred embodiment of the present invention. | 02-02-2012 |
Chun-Yuan Wang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090001567 | IC chip with finger-like bumps - A bumped chip has a plurality of finger-like bumps bonded on multiple openings of a chip. The chip primarily comprises a plurality of bonding pads and a passivation layer having a plurality of opening thereon. In one embodiment, the openings on each bonding pad are plural and disposed in linear, in parallel, or in an array. The finger-like bumps are protrusively disposed on the chip and each has a bump core and an extension finger. The bump cores are disposed within the corresponding bonding pads and cover the openings, and the extension fingers are disposed outside the corresponding bonding pads to maintain the bonding strengths of the bumps even at fine pitches. In an embodiment, the extension fingers overlap at least a trace of the chip. | 01-01-2009 |
| 20100140318 | STAPLER - A stapler includes a main body, a light-emitting module, and an optical module. The main body has a stapling portion. The light-emitting module is disposed in the main body. The optical module faces the light-emitting module. Light emitted from the light-emitting module is converted into a light spot with a linear shape by the optical module to mark a stapling position of the stapling portion. | 06-10-2010 |
| 20110100726 | LUGGAGE CASE ACCESSORY - This invention provides a luggage case accessory for measuring weight of a luggage case. In the invention, the luggage case accessory includes a main body, a weight sensing unit, a control unit, and an output unit. The main body has an embedding structure for being detachably embedded with a handle. The weight sensing unit is disposed in the main body for sensing weight borne by the handle to output a weight signal. The control unit is coupled with the weight sensing unit for receiving the weight signal and outputting a control signal according to the weight signal. The output unit is coupled with the control unit for receiving the control signal and outputting a weight state of the luggage case according to the control signal. | 05-05-2011 |
Chun-Yuan Wang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100171388 | Pressure-Laminated Stator Ring and Method of Manufacture - A method for manufacturing a pressure-laminated stator ring includes forming a plurality of stator ring elements, and electrically insulating each of the stator ring elements. The electrically-insulated stator ring elements are pressure-laminated together to form a multi-layered stator ring. | 07-08-2010 |
| 20100325874 | Method for Making Wound Stator of Automotive Generator - A method for making a wound stator of an automotive generator is provided for replacing the conventional winding technique. The method includes: forming a stator ring provided with a plurality of annularly arranged radial through slots; cutting a copper wire into a plurality of wire units each having a rectangular cross section; inserting the wire units into the through slots in an interlacing manner; and soldering wire ends of the wire units sequentially so as to form a connected loop. | 12-30-2010 |