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Chun-Yan
Chun-Yan Wang, Hefei CN
| Patent application number | Description | Published |
|---|---|---|
| 20080234931 | ELECTRONIC DEVICE FOR INDICATING POI ACCORDING TO ROAD SEGMENT AND METHOD THEREOF - An electronic device for indicating a POI corresponding to a new road segment when arriving at the new road segment includes an interface unit, for providing a setting of the POI to be displayed; a positioning system, for identifying the position of the electronic device; and a processor, for determining whether the electronic device is arriving at a new road segment according to the position of the electronic device, and retrieving information of a specific POI corresponding to the new road segment from a database if the electronic device is arriving at the new road segment, wherein the electronic device accesses the database and transmits the specific POI to the interface unit to indicate to a user only when it arrives at the new road segment. | 09-25-2008 |
Chun-Yan Zhang, Suzhou Industrial Park CN
| Patent application number | Description | Published |
|---|---|---|
| 20090084136 | MOLDING DIE FOR MOLDING GLASS AND METHOD OF REPAIRING THE SAME - The present invention provides a molding die for molding glass, which includes a base member, on which a first buffer layer and a protective film are provided in order. The first buffer layer is made of titanium or any material which is easily attacked by a first attack solution. The first attack solution includes hydrofluoric acid. The protective film is made of platinum-iridium alloy, iridium-rhenium alloy, tantalum-ruthenium alloy, molybdenum-ruthenium alloy, molybdenum-rhenium alloy, or molybdenum-hafnium alloy. The method of repairing the molding die includes using the first attack solution to remove the first buffer layer that causes no damage on the base member, and then operating a sputtering process to build a new first buffer layer and a new protective layer on the base member. | 04-02-2009 |
| 20110011732 | METHOD OF REPAIRING A MOLDING DIE FOR MOLDING GLASS - The present invention provides a method of repairing a molding die for molding glass, the molding die for molding glass comprising a base member, a first buffer layer on the base member, which is made of titanium or any material which is easily attacked by a first attack solution, wherein the first attack solution includes hydrofluoric acid, a protective film on the first buffer layer; the method comprising the steps of using the first attack solution to remove the first buffer layer that causes no damage on the base member, and then operating a sputtering process to build a new first buffer layer and a new protective layer on the base member. | 01-20-2011 |
Chun-Yan Zhao, Yushan Town CN
| Patent application number | Description | Published |
|---|---|---|
| 20080301427 | BASIC INPUT/OUTPUT SYSTEM MEMORY SIMULATION MODULE - A basic input/output system (BIOS) memory simulation module includes a first transmission interface unit adapted to receive an updated BIOS data from an external source, a second transmission interface unit adapted to be connected electrically to a computer under test, a memory unit, and a control unit connected electrically to the first transmission interface unit, the second transmission interface unit and the memory unit. The control unit is operable to store the updated BIOS data from the first transmission interface unit into the memory unit, and to output the updated BIOS data stored in the memory unit to the computer under test via the second transmission interface unit. | 12-04-2008 |