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Chun-Wei
Chun Wei Chen, Science - Based Industrial Park Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110150363 | DISPLACEMENT DETECTION APPARATUS AND METHOD - A displacement detection method includes the steps of: capturing a first frame and a second frame; selecting a first block with a predetermined size in the first frame and selecting a second block with the predetermined size in the second frame; determining a displacement according to the first block and the second block; comparing the displacement with at least one threshold; and adjusting the predetermined size according to a comparison result of comparing the displacement and the threshold. The present invention further provides a displacement detection apparatus. | 06-23-2011 |
Chun Wei Chen, Science - Based Industrial Park Hs TW
| Patent application number | Description | Published |
|---|---|---|
| 20110261231 | DISPLACEMENT DETECTION DEVICE AND DISPLACEMENT DETECTION METHOD THEREOF - A displacement detection method includes the steps of: acquiring an image frame; calculating a characteristic index of the image frame; maintaining the image frame when the characteristic index is larger than a threshold value; and adding a fixed pattern to the image frame when the characteristic index is smaller than the threshold value. The present invention further provides a displacement detection device. | 10-27-2011 |
Chun Wei Huang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090248907 | Method for automatically identifying an operating system for a USB device - A method for automatically identifying an operating system for a USB device begins at initializing the USB device, and recording USB commands sent from the operating system. The USB device determines the operating system as a first operating system when there are two successive USB commands of Get Product String, there is one USB command of Get Vender String, there is no USB command of Reset ahead of a USB command of Set Address, there is no USB command of Get Language ID, or there is no USB command of Set Feature Report. The USB device determines the operating system as a second operating system when there is no USB command of Get Vender String, there are two USB commands of Get Language ID and two USB commands of Get Product String, there is one USB command of Get Device Descriptor following a USB command of Get Product String, or there is one USB command of Set Interface Report. | 10-01-2009 |
| 20110261016 | Optical touch screen system and method for recognizing a relative distance of objects - An optical touch screen system for recognizing a relative distance of an object based on optical sensors includes a display screen to display visual prompts to solicit actions from a user; first and second lighting and sensing modules mounted on two adjacent corners of the display screen for forming first and second visual fields above the display screen respectively, wherein the first and the second visual fields intersect to form a touch area on the display screen, and the first and the second lighting and sensing modules detect an object entering the touch area and generate a first electrical position signal and a second electrical position signal respectively; and a processor for calculating a position of the object based on the first electrical position signal and the second electrical position signal. | 10-27-2011 |
Chun-Wei Chang, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090236707 | ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING - An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer. | 09-24-2009 |
| 20100283141 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package includes a chip; first and second connection pads arranged in a matrix and disposed about the chip, and the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body. | 11-11-2010 |
Chun-Wei Chang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090268907 | Optical Media Recording Device for Protecting Device Keys and Related Method - To protect device keys, an optical media recording device capable of performing AACS encryption on data does not have any device keys, and the optical media recording device performs AACS encryption by activating recording software stored in a memory the optical media recording device, and utilizing a pre-calculated media key stored in the memory of the optical media recording device to perform AACS encryption on the data. | 10-29-2009 |
Chun-Wei Chang, Chung Li TW
| Patent application number | Description | Published |
|---|---|---|
| 20110181890 | IMAGING AND MEASURING APPARATUS FOR SURFACE AND INTERNAL INTERFACE OF OBJECT - The present invention provides an imaging and measuring apparatus for the surface and the internal interface of an object, which comprises a broadband wave source, a wave-splitting structure, a wave-delaying device, a reflecting component, and a sensor. The broadband wave source transmits a broadband incident wave. The wave-splitting structure splits the broadband incident wave into a first incident beam, a second incident beam, and a third incident beam. The first incident beam is illuminated on an object under test, which reflects a measuring beam. The wave-delaying device receives the second incident beam and reflects a reference beam. The reflecting component receives the third incident beam and reflects a calibration beam. The sensor receives a first interference signal of the measuring beam and the reference beam, and a second interference signal of the reference beam and the calibration beam. By means of the broadband incident wave, the morphologies of the surface and the internal interface of the object can be imaged and measured in a non-destructive way. In addition, by means of the calibration beam, the accuracy of imaging and measuring the surface and the internal interface of the object can be improved. | 07-28-2011 |
Chun-Wei Chang, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110248394 | LEADFRAME PACKAGE FOR HIGH-SPEED DATA RATE APPLICATIONS - A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm. | 10-13-2011 |
Chun-Wei Huang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090189925 | LIQUID CRYSTAL DISPLAY AND DRIVING METHOD THEREOF - A liquid crystal display (LCD) and a driving method thereof are provided. The driving method includes the steps of: transmitting video data to the LCD according to a first frequency, and processing the video data according to a first gamma look-up table to obtain a bright region image; transmitting the video data to the LCD according to the first frequency, and processing the video data according to a second gamma look-up table to obtain a dark region image; and stacking the bright region image and the dark region image in sequence so as to display an image displayed on an LCD panel of the LCD. | 07-30-2009 |
Chun-Wei Huang, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110298770 | ACTIVE MATRIX DISPLAY DEVICE - An exemplary active matrix display device includes a plurality of gate signal lines, a plurality of data signal lines and a plurality of pixel rows. The gate signal lines are independently driven from one another. Each of the pixel rows is electrically coupled to one of the gate signal lines and a part of the data signals lines. The pixel rows include a first pixel row and a second pixel row. The first pixel row and the second pixel row are not neighboring with each other. The gate signal line electrically coupled with the first pixel row and the gate signal line electrically coupled with the second pixel row are synchronously enabled. | 12-08-2011 |
Chun-Wei Huang, Chang Hwa TW
| Patent application number | Description | Published |
|---|---|---|
| 20120118115 | DUAL-PURPOSE PLIERS FOR CONNECTING AND DISCONNECTING A MASTER LINK OF A CHAIN - A pair of dual-purpose pliers for connecting and disconnecting a master link of a chain comprises a single jaw handle and a double-jaw handle. The single jaw handle is formed with a grip at a first end thereof and a single jaw at a second end thereof. The double jaw handle is formed with a grip at a first end thereof and a left jaw and a right jaw at a second end thereof. After the single jaw handle and the double jaw handle are pivotally connected, the single jaw is located between the left and the right jaws, a groove of the single jaw and a groove of the left jaw are arranged in a face-to-face manner, and the groove of the single jaw and a groove of the right jaw are arranged in back-to-back manner. | 05-17-2012 |
Chun-Wei Kuo, Dasi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090309481 | Field emission device and method for fabricating cathode emitter and zinc oxide anode - The present invention relates to methods for fabricating a cathode emitter and a zinc oxide anode for a field emission device to improve the adhesion between emitters and a substrate and enhance the luminous efficiency of a zinc oxide thin film so that the disclosed methods can be applied in displays and lamps. In comparison to a conventional method for fabricating a field emission device, the method according to the present invention can reduce the cost and time for manufacture and is suitable for fabricating big-sized products. In addition, the present invention further discloses a field emission device comprising a zinc oxide/nano carbon material cathode, a zinc oxide anode and a spacer. | 12-17-2009 |
Chun-Wei Li, Chu-Nan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100035380 | Method for fabricating package structure of stacked chips - The invention relates to a method for fabricating a package structure of stacked chips, comprising the following steps: firstly, providing a substrate; attaching a first chip and a second chip on the upper surface of the substrate, in which the second chip is stacked on the upper side of the first chip; then connecting a first bonding wire between a second solder pad of the second chip and a first region of a first solder pad of the first chip; and connecting a second bonding wire between a second region of the first solder pad of the first chip and the metal contact of the substrate, whereby the invention is capable of tremendously reducing the volume as a whole, effectively solving the problem of having much bonding wire circuit, and reducing the volume and quantity occupied by the solder pads on the substrate, thereby reducing complexity of the circuit layout on the substrate. | 02-11-2010 |
Chun-Wei Lin, Daxi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110099133 | Systems and methods for capturing and managing collective social intelligence information - A method for capturing and managing training data collected online includes: receiving a first dataset from one or more online sources; sampling the first dataset and generating a second dataset, the second dataset including the data sampled from the first dataset; receiving an annotated second dataset with predefined labels; and dividing the annotated second dataset into a training dataset and a test dataset. The disclosed method further includes: configuring a machine learning based classifier based on the training dataset; predicting at least one data point based on the training dataset and calculating a confidence score; comparing the at least one predicted data point to the test dataset; sorting the at least one predicted data point based on its confidence score; and receiving corrected training data associated with the at least one predicted data point. | 04-28-2011 |
| 20110112995 | Systems and methods for organizing collective social intelligence information using an organic object data model - A method for capturing and organizing intelligence data using an organic data model includes: receiving one or more webpages containing social intelligence data; segmenting content of the one or more webpages containing social intelligence data; identifying named entities in the segmented content of the one or more webpages; identifying topics in the segmented content of the one or more webpages; identifying opinions in the segmented content of the one or more webpages; integrating the identified named entities, topics, and opinions to construct an organic object data model; and storing organic object data associated with the constructed organic object data model in an organic object database. | 05-12-2011 |
Chun-Wei Lin, Wu-Jih Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20090297794 | LAMINATE AND ARTICLE FOR DAILY USE - A laminate includes a base layer being made from one of woven fabrics, knitted fabrics, and non-woven fabrics, and having two surfaces, and a thin film layer made of a polyvinyl butyral-based composition and covering one of the two surfaces of the base layer. An article for daily use, at least one part of which is made of the laminate, is also disclosed. | 12-03-2009 |
Chun-Wei Lin, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090284491 | METHOD FOR FILTERING SIGNALS OF TOUCH SENSITIVE DEVICE - A method for filtering signals of a touch sensitive device is used to judge whether or not a touch signal output from a touch sensitive device is noise by utilize the arrangement pattern of sensing areas. If the sensing areas corresponding to the touch signal are arranged partially conforming to a noise arrangement pattern the touch signal will be discarded. The present invention uses a scheme of comparing the arrangement diagram of a touch signal with a plurality of noise arrangement patterns to decide whether or not to discard the touch signal so as to increase the accuracy and the stability of a capacitive touch sensitive device. | 11-19-2009 |
Chun-Wei Lin, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080219829 | Conveying and stacking device for corrugated boards - The present invention discloses a conveying and stacking device for corrugated boards, which is used in a conveyor of a corrugated board production line to stack corrugated boards by a specified number and comprises an exhaust facing the downstream of the conveyor and a sucker arranged at the upstream of the exhaust and facing the procession of the corrugated boards. The sucker and the exhaust are arranged in an elevator for elevating the corrugated boards and respectively suck air and exhaust air simultaneously. | 09-11-2008 |
Chun-Wei Peng, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090297919 | GAS DIFFUSION LAYER OF PROTON EXCHANGE MEMBRANE FUEL CELL SYSTEM - A fuel cell unit of a proton exchange membrane fuel cell system includes a pair of flow field plates and a membrane electrode assembly. The membrane electrode assembly is interposed between the pair of flow field plates to define respective reactant flow channels with the pair of flow field plates. The membrane electrode assembly includes an anode catalyst layer, a cathode catalyst layer, a proton exchange membrane and a pair of gas diffusion layers. The gas diffusion layers are respectively disposed adjacent to the anode catalyst layer and the cathode catalyst layer and face to the flow field plates. At least one of the gas diffusion layers has a fluid permeability distribution profile increasing first and then decreasing from an inlet to an outlet of the reactant flow channel. The gas diffusion layer has the maximum fluid permeability at the site with the highest rate of reaction. | 12-03-2009 |
Chun-Wei Su, Yonghe City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100143708 | RELEASE LAYER MATERIALS, SUBSTRATE STRUCTURES COMPRISING THE SAME AND FABRICATION METHOD THEREOF - A release layer material of cyclic olefin copolymers (COC) applied in flexible electrical devices represented by Formula (I) or (II) is provided. The invention also provides a substrate structure including the release layer. The substrate structure includes a carrier, a release layer overlying the carrier with one or more blocks with a first area, wherein the release layer includes cyclic olefin copolymers (COC) represented by the disclosed Formula (I) or (II), and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention further provides a method for fabricating the substrate structure. | 06-10-2010 |
Chun-Wei Tsai, Hualien County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080213937 | METHOD OF FABRICATING OPTICAL DEVICE CAPS - A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the concave cavities corresponding to the through holes of the wafer so that a part of the plate corresponding to the through holes is not in contact with the glass wafer. A voltage source is provided, and two electrodes thereof respectively have electrical connections to the wafer and the plate. The wafer and the glass wafer are bonded to each other by the anodic bonding method so that a plurality of optical device caps are formed. | 09-04-2008 |
| 20090061598 | WAFER-LEVEL PACKAGING CUTTING METHOD CAPABLE OF PROTECTING CONTACT PADS - A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies. | 03-05-2009 |
Chun-Wei Wang, Hukou TW
| Patent application number | Description | Published |
|---|---|---|
| 20090250709 | LED PACKAGE AND LIGHT SOURCE DEVICE USING SAME - An exemplary LED package includes a dielectric plate, a heat conductor, a first planar electrode and a second planar electrode, a LED chip, and metal wires. The dielectric plate comprises a receiving groove defined therein. The heat conductor is positioned in the dielectric plate opposite to the receiving groove, and the heat conductor comprises a holding portion exposed on bottom of the receiving groove. The first and second planar electrodes are respectively received in the dielectric plate extending to the receiving groove and are spaced from the heat conductor. The first and second electrodes are respectively electrically connected to the LED chip by the metal wires. The LED chip is mounted on the holding portion of the heat conductor. | 10-08-2009 |
| 20100001299 | LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES - A light emitting diode illuminating apparatus for emitting colorful light includes a substrate, a first lighting element, a second lighting element, a third lighting element. The first, second and third lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating it. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The third lighting element includes a third LED chip and a third filling layer encapsulating it. All of the first, the second and the third LED chips are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitting from the filling layers are capable of mixing to produce light of a uniform color. | 01-07-2010 |
| 20110193110 | LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES - A light emitting diode illuminating apparatus includes a substrate, a first lighting element and a second lighting element. The first and second lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating the first LED chip. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The second filling layer includes two different phosphor materials respectively doped therein. The first LED chip and the second LED chip are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitted from the first filling layer and the second filling layer is capable of mixing to produce light of a uniform color. | 08-11-2011 |
Chun-Wei Wang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090267090 | COLOR MIXING LIGHT EMITTING DIODE DEVICE - An exemplary color mixing light emitting diode (LED) device includes a substrate, LED dies, an encapsulating body, and a light mixing structure. The substrate has a main surface. The LED dies are arranged adjacent the main surface of the substrate. The light mixing structure is arranged adjacent an outer portion of the main surface of the substrate, around the LED dies. The encapsulating body encapsulates the LED dies and the light mixing structure. The light mixing structure is made of light transmissive material, and the light mixing structure has light scattering particles doped therein. | 10-29-2009 |
Chun-Wei Wang, Sanxia Town TW
| Patent application number | Description | Published |
|---|---|---|
| 20100315716 | Microstructure diffuser - A microstructure diffuser includes a light-entering surface, a light-emitting surface, and a plurality of microstructure portions having a first microstructure unit and a second microstructure unit. The first microstructure unit includes a first side surface, a second side surface, a top surface, a first pitch (P | 12-16-2010 |
Chun-Wei Wang, Yongkang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090310852 | Method for Constructing Three-Dimensional Model and Apparatus Thereof - Disclosed are a method and an apparatus for constructing an accurate three-dimensional model. The apparatus includes a plurality of light sources, an image-capturing element and an image-processing unit. The present invention is used to integrate the two-dimensional images from different views of an object into a high accurate three-dimensional model. Compared with conventional apparatuses, the apparatus of the present invention is useful without safety problems, relatively easily manipulated, and capable of quick image reconstruction. | 12-17-2009 |
Chun-Wei Yang, Chia-Yi City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090286577 | Communication System Capable of Adjusting Power Consumed Thereby - A communication system capable of adjusting power consumed thereby is adapted for receiving connection information. The communication system includes first and second transceiving devices. The first transceiving device includes a transmitting end and a service end for receiving the connection information. The second transceiving device includes a receiving end capable of forming a communications link with the transmitting end. A power state of each of the first and second transceiving devices is switchable between a power-supplied mode and a power-saving mode. The power state alters status of the communications link. | 11-19-2009 |
Chun-Wei Yang, Hsien-Shi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090191770 | CONDUCTING TERMINAL CONNECTOR AND MANUFACTURING METHOD THEREOF - There is disclosed a conducting terminal connector which comprises an insulating tube, a conducting terminal and a soldering sleeve. The conducting terminal has a first end received in the insulating tube and a second end opposite to said first end, and the second end is exposed outwardly for connecting an external conducting contact point so that the first end is bent to form a longitudinal elongation with an opening facing upward. The soldering sleeve is formed by a casting method so as to form a corrugated surface on the outer periphery thereof, and has a melting point in which a heat source is applied to an outer part of the insulating tube so that an inner part of the insulating tube is shrunken to lodge in the outer corrugated surface of the soldering sleeve thereby forming the conducting terminal connect. | 07-30-2009 |