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Chun-Tai
Chun-Tai Chen, San-Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110225332 | Data transmission device and control method - The present invention provides a data transmission device with high speed serial transmission interfaces and control method thereof, and includes a control unit, at least one first storage device connected to the control unit and at least one second storage device, at least one switching device, which is used to switch data transmission lines; each of the switching devices being connected to the control unit, the second storage device and a computer. Accordingly, the switching devices enable the storage devices to connect to the computer to implement data transmission, or the switching devices switch connection to form an independently operable data transmission control system to enable implementing data transmission between the storage devices. Moreover, an automatic detection mode and a manual mode can be used to control connection to the computer or enable independent operation of the data transmission device. | 09-15-2011 |
| 20110225654 | Write-Proof Protection Method of a Storage Device - The present invention is a write-proof protection method of a storage device. The storage device includes a buffer to store data temporarily, with a capacity of the buffer being adjustable; and a write-proof control unit. The write-proof protection method includes transmitting a write-in protection signal to the write-proof control unit from an operating unit; the write-proof control unit writing a file that is written into a computer into the buffer of the storage device, rather than a file system. When a stand-alone write-proof condition has been set by a user, an unknown program that has been written in can be a virus pattern, and the unknown program in the buffer can be analyzed to discover a new virus early, so as to achieve an antivirus effect. | 09-15-2011 |
Chun-Tai Lee, Luchu Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20090021960 | Luminescent decorating panel assembly and electronic device using the same - A luminescent decorating panel assembly and an electronic device using the luminescent decorating panel are disclosed. The luminescent decorating panel assembly includes a light guide plate, a light source and a reflecting element, and a microstructure is formed on a light exit plane of the light guide plate and applied in the electronic device, and the luminescent decorating panel assembly is disposed between an upper casing and a lower casing of the electronic device, and the microstructure corresponds to a transparent portion of the upper casing, such that when a user views the microstructure on the light guide plate through the transparent portion, a luminescent effect is produced on the electronic device. | 01-22-2009 |
| 20100188339 | Light-emitting device for keyboard - The light-emitting device of the creation comprises a light guide plate and at least one flexible carrier plates disposed below the light guide plate; wherein each of said flexible carrier plate has a supporting portion equipped with a plurality of light emitting diodes (LEDs), and a wire for electrically connecting each of the LEDs and the control terminal of the keyboard in order to obtain a light-emitting device for a keyboard, in which the material costs can be significantly lowered and the LEDs or circuits can be renewed or replaced as long as the flexible carrier plates for loading said LEDs are replaced. | 07-29-2010 |
Chun-Tai Wu, West Jordan, UT US
| Patent application number | Description | Published |
|---|---|---|
| 20080242029 | METHOD AND STRUCTURE FOR MAKING A TOP-SIDE CONTACT TO A SUBSTRATE - A method for forming a semiconductor structure includes the following steps. A starting semiconductor substrate having a top-side surface and a back-side surface is provided. A recess is formed in the starting semiconductor substrate through the top-side of the starting semiconductor substrate. A semiconductor material is formed in the recess. A vertically conducting device is formed in and over the semiconductor material, where the starting semiconductor substrate serves as a terminal of the vertically conducting device. A non-recessed portion of the starting semiconductor substrate allows a top-side contact to be made to portions of the starting semiconductor substrate extending beneath the semiconductor material. | 10-02-2008 |
| 20090194812 | Structure for Making a Top-side Contact to a Substrate - A semiconductor structure includes a starting semiconductor substrate having a recessed portion. A semiconductor material is formed in the recessed portion and has a higher resistivity than the starting semiconductor substrate. A body region extends in the semiconductor material, and has a conductivity type opposite that of the semiconductor material. Source regions extend in the body region, and have a conductivity type opposite that of the body region. A gate electrode extends adjacent to but is insulated from the body region. A first interconnect layer extends over and is in contact with a non-recessed portion of the starting semiconductor substrate. The first interconnect layer and the non-recessed portion provide a top-side electrical contact to portions of the starting semiconductor substrate underlying the semiconductor material. | 08-06-2009 |