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| 20100005430 | DDCC and FDCCII-Grounded Resistor and Capacitor Filter Structures - A voltage-mode nth-order differential difference current conveyor (DDCC) and fully differential current conveyor (FDCCII)-resistor and capacitor filter structures are proposed using a new effective analytical synthesis method (ASM), a succession of innovative algebra operations until a set of simple equations are produced, which are then realized using n integrators and a constraint sub-circuitry, A new ASM can effectively carry out (i) use of all the grounded capacitors and grounded resistors, and (ii) employment of the minimum number of active and passive components and then enjoys the low sensitivities, lower parasitics, power consumption, noise, and smaller chip area leading to simultaneously achieving two important features: (i) higher output performance and (ii) lower cost, without tradeoff. Moreover, the component value variations of all the relative sensitivities have the same incremental percentage or decrement. | 01-07-2010 |
| 20100031205 | ANALYTICAL SYNTHESIS METHOD AND OTA-BASED CIRCUIT STRUCTURE - An analytical Synthesis Method (ASM) is clearly and effectively demonstrated in the realization of current/voltage-mode Operational Trans-conductance Amplifier and Capacitor (OTA-C) circuits, where a complicated nth-order transfer function is manipulated and decomposed by a succession of innovative algebra operations until a set of simple equations are produced, which are then realized using n integrators and a constraint circuitry. The circuits realized includes voltage-mode nth-order OTA-C universal filter structures, tunable voltage/current-mode OTA-C universal biquad filters, voltage-mode odd/even-nth-order OTA-C elliptic filter structures, voltage/current-mode odd-nth-order OTA-C elliptic high-pass filter structures, and OTA-C quadrature oscillators. Some realized OTA-C circuits can be simplified to be OTA-only (OTA-parasiic C) circuits which fit for the operation at high frequencies. | 02-04-2010 |
| 20100264996 | Nth-Order Arbitrary-Phase-Shift Sinusoidal Oscillator Structure and Analytical Synthesis Method of Making the same - Nth-order voltage- and current-mode arbitrary phase shift oscillator structures are synthesized using n operational trans-conductance amplifiers (OTAs) or second-generation current controlled conveyors (CCCIIs) and n grounded capacitors. Linking up the I/O characteristics of the OTA and the CCCII and the reactance of grounded capacitor, the step of synthesis is first based on the algebraic analysis to oscillatory characteristic equations, resulting in a quadrature oscillator structure. Secondly, instead of the quadrature characteristic, to control each output signal with one another by a desired phase difference > or <90°, selectively superposing any of two fundamental OTA/CCCII-C sub-circuitries benefits the transformation of quadrature to arbitrary-phase-shift characteristic for the sinusoidal oscillator structure. Furthermore, several compensation schemes are presented for reducing the output parameter deviation due to the non-ideal effects. | 10-21-2010 |
| 20110316628 | COMPLIMENTARY SINGLE-ENDED-INPUT OTA-C UNIVERSAL FILTER STRUCTURES - A complimentary single-ended-input OTA-C universal filter structures in terms of integrated circuits is provided. The integrated circuit comprises a plurality of amplifiers and a plurality of capacitors. In some capacitors, one electrode is electrically connected to the positive input of its corresponding amplifier, and the other electrode can be electrically connected to an electrical source. In addition, the negative input of one amplifier is electrically connected to the negative input of another amplifier. Besides, there are a head amplifier and a tail amplifier. The output of the head amplifier is electrically connected to the negative input of the head amplifier, and the positive input of the tail amplifier can be electrically connected to an electrical source. | 12-29-2011 |
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| 20080251910 | Fabricating method of semiconductor package and heat-dissipating structure applicable thereto - A method for fabricating semiconductor packages is disclosed, including mounting and electrically connecting a semiconductor chip onto a chip carrier; mounting a heat-dissipating structure on the semiconductor chip; placing the heat-dissipating structure into a mold cavity for filling therein a packaging material to form an encapsulant, wherein the heat-dissipating structure has a heat spreader having a size larger than that of the predetermined size of the semiconductor package, a covering layer formed on the, and a plurality of protrusions formed on edges of the covering layer that are free from being corresponding in position to the semiconductor chip, such that the protrusions can abut against a top surface of the mold cavity to prevent the heat spreader from being warped; and finally performing a singulation process according to the predetermined size and removing the encapsulant formed on the covering layer to form the desired semiconductor package. Also, this invention discloses a heat-dissipating structure applicable to the method described above. | 10-16-2008 |
| 20080277777 | Heat dissipation semiconductor package - A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination. | 11-13-2008 |
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| 20090161396 | Synchronous rectifier control device and forward synchronous rectifier circuit - Disclosed are a synchronous rectifier control device and a forward synchronous rectifier circuit. The synchronous rectifier control device is coupled with the secondary side of the forward synchronous rectifier circuit, comprising a condition detecting unit, a reference time circuit and a synchronous signal generator. The condition detecting unit receives at least one reference signal and a detecting signal in response to the condition of the secondary side of the forward synchronous rectifier circuit, and accordingly generates a first synchronous control signal. The reference time circuit is coupled with the condition detecting unit, and generates a reference time signal in response to the first synchronous control signal. The synchronous signal generator generates a second synchronous control signal in response to the first synchronous control signal and the reference time signal. | 06-25-2009 |
| 20090168464 | Synchronous rectifier control device and a forward synchronous rectifier circuit - A synchronous rectifier control device comprises a status detecting unit, an analog circuit, a first counter, a second counter and a signal process unit. The status detecting unit receives at least one reference signal and a detecting signal to generate a first synchronous control signal. The analog circuit generates a delay signal in accordance with the first synchronous control signal. The first counter receives a clock signal and generates a first counter signal in accordance with the first synchronous control signal, the clock signal, and the delay signal. The second counter receives the clock signal and generates a second counter signal in accordance with the first synchronous control signal, the clock signal, and the first counter signal. The signal process unit generates a second synchronous control signal in accordance with the first synchronous control signal and the second signal. | 07-02-2009 |
| 20090244932 | Synchronous Rectifying Apparatus and Forward Synchronous Converter - A synchronous rectifying apparatus suitable for use in a forward synchronous converter having a transforming unit with a primary and secondary side, and a first and second rectifying switches coupled to the secondary side is provided. The synchronous rectifying apparatus has a condition detecting unit and a synchronous rectifying controller. The condition detecting unit; coupled to the secondary side of the transforming unit, for detecting if the operation condition of the forward synchronous converter is at boundary between discontinuous current mode and continuous current mode or under discontinuous current mode based on the rising slope of the secondary side voltage of the transforming unit. If so, the condition detecting unit outputs a reset signal. The synchronous rectifying controller, coupled to the secondary side of the transforming unit and the condition detecting unit, to turn off the second rectifying switch for a predetermined time period in response to the reset signal. | 10-01-2009 |
| 20100044803 | SEALING STRUCTURE FOR HIGH-K METAL GATE AND METHOD OF MAKING - The present disclosure provides a semiconductor device that includes a semiconductor substrate and a transistor formed in the substrate. The transistor includes a gate stack having a high-k dielectric and metal gate, a sealing layer formed on sidewalls of the gate stack, the sealing layer having an inner edge and an outer edge, the inner edge interfacing with the sidewall of the gate stack, a spacer formed on the outer edge of the sealing layer, and a source/drain region formed on each side of the gate stack, the source/drain region including a lightly doped source/drain (LDD) region that is aligned with the outer edge of the sealing layer. | 02-25-2010 |
| 20110057638 | PULSE WIDTH MODULATION REGULATOR IC AND CIRCUIT THEREOF - A pulse width modulation regulator IC is provided for controlling a duty cycle of at least one switch to convert one input voltage signal into an output voltage. An input pin is provided for receiving an input signal different from the input voltage signal. The input signal has a lasting time substantially the same as the time that input voltage signal situated at a high level, but the waveforms of the two signals are different. The input signal is converted into a square wave signal by a conversion unit, and a PWM signal is generated by a PWM controller according to the square wave signal to control the duty cycle of the switch. Therefore, the input pin can be saved by adjusting an internal or external circuit of the IC for the usage of the different kinds of input signals without increasing the number of input pins of the IC. | 03-10-2011 |
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| 20100254161 | STRUCTURE FOR CHRISTMAS LIGHT - A structure for LED Christmas light is provided, including a light holder, being a hollow body having a separating part connected to the inner wall of the light holder to divide the hollow interior of the light holder into two cavities. Each of the two opposite sides of the inner wall of the light holder connected to the separating part forms a slot and face the surface of the separating part of the two cavities, with each having a guiding channel. Two wire sets are fixed inside the two cavities. An LED light bulb has a positive pin and a negative pin inserted inside the guiding channel, respectively, and being electrically connected to the wire sets. A light cap has a holding part passing the LED light bulb to tightly engage to the top of the light holder so as to fix the LED light bulb to the light holder. | 10-07-2010 |
| 20120033439 | Structure Of Plug-In Light String - A structure of plug-in light string is provided, including a light shell, a separation element, an LED and a plurality of wires. The two metal leads extended from the LED are soldered to respective wires. The top of the separation element presses against the bottom of the LED, and the separation element and the LED are plugged into the light shell. The LED extends partially from the top opening of the light shell, and the separation element is buckled to the light shell to fasten the position of each component. Inside the light shell, the separation element separates the connection segments of the two metal leads and the wires. In this manner, the structure of plug-in light string is constituted to achieve advantages of easy assembly, water-proof effect, safe usage and small size. | 02-09-2012 |
