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Chun-Hung Lin
Chun-Hung Lin, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080278540 | ATMOSPHEREIC PLASMA INKJET PRINTING APPARATUSES AND METHODS FOR FABRICATING COLOR FILTER USING THE SAME - Atmospheric plasma inkjet printing apparatus and methods for fabricating color filters using the same. The atmosphere plasma inkjet printing apparatus includes a nozzle plate having a first column of nozzles and a second column of nozzles. An inkjet printhead module corresponds to the first column of nozzles. An atmospheric plasma module is corresponds to the second column of nozzles. | 11-13-2008 |
| 20090064933 | FILM COATING SYSTEM AND ISOLATING DEVICE THEREOF - A film coating system for coating an object includes a working station and an isolating device. The object is disposed on the working station, and the isolating device is utilized to isolate the object. The isolating device includes a body generating a first power, a first working fluid, a second working fluid, a first guiding portion and a second guiding portion. The first guiding portion guides the first working fluid to pass through the body, thereby forming a first working region to coat the object thereon. The second guiding portion guides the second working fluid excited by the first power of the body to pass through the body, thereby forming a second working region to separate the first working region from the object. | 03-12-2009 |
| 20090133742 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - A solar cell includes a substrate, a conductor layer and an anti-reflection coating (ARC) layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer is disposed on the front side of the substrate, the second portion of the conductor layer is disposed in the ARC layer, and the conductor layer has an exposed surface exposed out of the ARC layer. The exposed surface of the conductor layer is substantially flush with an exposed surface of the ARC layer. A method of manufacturing the solar cell is also disclosed. | 05-28-2009 |
| 20100025022 | FAN ASSEMBLY - A fan assembly for use in an electronic device is provided. The fan assembly includes a housing, a fan, a throttle valve, and a regulator. The housing has an outlet. The fan is disposed in the housing and adapted to provide an air current. The air current generates an air volume through the outlet. The throttle valve is movably disposed in the housing at the outlet. The regulator is connected to the throttle valve to control the movement of the throttle valve to adjust the size of the outlet. | 02-04-2010 |
| 20110094571 | SOLAR CELL WITH UPPER AND LOWER CONDUCTOR LAYERS STACKED TOGETHER - A solar cell includes a substrate, a lower conductor layer, an anti-reflection coating (ARC) layer and an upper conductor layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The lower conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer is disposed on the front side of the substrate and covers the lower conductor layer such that the second portion of the lower conductor layer is disposed in the ARC layer. The upper conductor layer has a first portion embedded into the ARC layer and a second portion other than the first portion of the upper conductor layer. The second portion of the upper conductor layer is exposed out of the ARC layer, and the upper conductor layer is electrically connected to the lower conductor layer. | 04-28-2011 |
| 20110120372 | PLASMA DEPOSITION APPARATUS AND DEPOSITION METHOD UTILIZING SAME - A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle θ | 05-26-2011 |
| 20120282724 | METHOD OF MANUFACTURING SOLAR CELL WITH UPPER AND LOWER CONDUCTOR LAYERS STACKED TOGETHER - A method of manufacturing a solar cell comprises the steps of: forming a lower conductor layer on a front side of a substrate; firing the lower conductor layer at a first temperature to form a first portion embedded into a doped region of the substrate and a second portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the lower conductor layer such that the second portion is disposed in the ARC layer; forming an upper conductor layer, corresponding to the lower conductor layer and electrically connected to the lower conductor layer, on the ARC layer; and firing the upper conductor layer at a second temperature to form a first portion embedded into the ARC layer and a second portion, which is exposed out of the ARC layer. | 11-08-2012 |
| 20120288981 | METHOD OF MANUFACTURING SOLAR CELL WITH TWO EXPOSED SURFACES OF ARC LAYER DISPOED AT DIFFERENT LEVELS - A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer. | 11-15-2012 |
Chun-Hung Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080267991 | IMMUNO-MODULATING ANTITUMOR ACTIVITIES OF GANODERMA LUCIDUM (REISHI) POLYSACCHARIDES - The present invention provides methods of modulating an immune response in an organism by administering medicinally active extracts and fractions, and a method for preparing the same by extracting and fractioning constituents from the tissue of components of | 10-30-2008 |
| 20090075397 | Method for characterizing sugar-binding interactions of biomolecules - This invention provides a donor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a photosensitizer which, upon excitation by laser light of a suitable wavelength, converts ambient oxygen to singlet state oxygen. This invention also provides an acceptor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a chemiluminescer and a fluorophore, whereby when the bead is contacted with singlet state oxygen, the singlet state oxygen reacts with the chemiluminescer which in turn activates the fluorophore so as to cause the emission of light of a predetermined wavelength. This invention further provides related kits, detection methods and characterization methods. | 03-19-2009 |
| 20100057356 | NAVIGATION SYSTEM CAPABLE OF UPDATING MAP DATA AND METHOD THEREOF - A navigation system includes a plurality of navigation devices and a server. The plurality of navigation devices is used for generating a plurality of position data respectively. Each navigation device generates at least one path data according to the plurality of position data and at least one corresponding electronic map and transmits the path data to the server. Then, the server calculates at least one optimum path data and updates the plurality of navigation devices according to the optimum path data. | 03-04-2010 |
| 20100113519 | 1,5-Dideoxy-1,5-imino-D-glucitol Compounds - 1,5-Dideoxy-1,5-imino-D-glucitol compounds as shown in the specification. Also disclosed is a method of treating a hexosaminidase-associated disease. | 05-06-2010 |
| 20110065758 | Compositions and assays for treatment and diagnosis of helicobacter pylori infection and conditions - Methods of diagnosing | 03-17-2011 |
Chun-Hung Lin, Tucheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110021104 | PH-ADJUSTING TEXTILE CONTAINING AMPHOTERIC POLYMER COMPOSITE NANOPARTICLES - Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value. | 01-27-2011 |
| 20110146039 | PH-Adjusting Textile Containing Amphoteric Polymer Composite Nanoparticles - Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value. | 06-23-2011 |
| 20120114949 | pH-Adjusting Textile Containing Amphoteric Polymer Composite Nanoparticles - Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value. | 05-10-2012 |
| 20120189958 | IMAGE TRANSFER PROCESS - The present invention relates to an image transfer process. The process includes the steps of: a) providing an image carrying device including at least one photoluminescent surface; b) displaying a luminous image on a display surface of a light-emitting medium; and c) positioning the display surface of the light-emitting medium that is displaying the luminous image at a distance from the at least one photoluminescent surface of the image carrying device shorter than a predetermined effective distance, for a predetermined period of time. | 07-26-2012 |
Chun-Hung Lin, Taoyuan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100219175 | ROTATABLE PLATE AND HEATING/COOLING ELEMENT IN PROXIMITY THERETO - An apparatus for selectively heating/cooling one or more substrates and establishing an approximately uniform temperature in the one or more substrates during a heating or cooling event is described. In one embodiment, the apparatus comprises a rotatable hot/cold plate onto which the one or more substrates are placed and a heating/cooling element disposed in close proximity to the rotatable hot/cold plate for selectively elevating/lowering the temperature of the one or more substrates. | 09-02-2010 |
| 20110115057 | DESIGN STRUCTURE FOR INTEGRATED CIRCUIT ALIGNMENT - A method and device for pattern alignment are disclosed. The device can include an exposure field; a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region; and a die alignment mark disposed between the seal ring region and the corner stress relief region. | 05-19-2011 |
| 20120045192 | SYSTEM AND METHOD FOR IMPROVING IMMERSION SCANNER OVERLAY PERFORMANCE - System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner comprising a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method comprises providing a water tank at at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level. | 02-23-2012 |
| 20120168751 | Integrated Circuit Test Units with Integrated Physical and Electrical Test Regions - A device includes a test unit in a die. The test unit includes a physical test region including an active region, and a plurality of conductive lines over the active region and parallel to each other. The plurality of conductive lines has substantially a uniform spacing, wherein no contact plugs are directly over and connected to the plurality of conductive lines. The test unit further includes an electrical test region including a transistor having a gate formed of a same material, and at a same level, as the plurality of conductive lines; and contact plugs connected to a source, a drain, and the gate of the transistor. The test unit further includes an alignment mark adjacent the physical test region and the electrical test region. | 07-05-2012 |
| 20120264063 | METHOD AND SYSTEM FOR FEED-FORWARD ADVANCED PROCESS CONTROL - A method including providing a present wafer to be processed by a photolithography tool, selecting a processed wafer having a past chip design from a plurality of processed wafers, the processed wafer being previously processed by the photolithography tool, selecting a plurality of critical dimension (CD) data points extracted from a plurality of fields on the processed wafer, modeling the plurality of CD data points with a function relating CD to position on the processed wafer, creating a field layout on the present wafer for a new chip design, creating an initial exposure dose map for the new chip design using the function and the field layout, and controlling the exposure of the photolithography tool according to the initial exposure dose map to form the new chip design on the present wafer. | 10-18-2012 |
Chun-Hung Lin, Gueishan Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100099252 | Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturing - A method for the improved electroplating of copper onto a copper seed layer provides burnishing the surface of the copper seed layer. The burnishing treatment is used to enhance the platability of the copper seed layer. The burnishing may be a reverse electroplating or a sputter etching process. Following the burnishing of the seed layer, the copper layer that is electroplated onto the seed layer exhibits improved quality. | 04-22-2010 |
Chun-Hung Lin, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100044850 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An advanced quad flat non-leaded package structure includes a carrier, a chip and a molding compound. The carrier includes a die pad and a plurality of leads. The die pad has a central portion, a peripheral portion disposed around the central portion and a plurality of connecting portions connecting the central portion and the peripheral portion. The central portion, the peripheral portion, and the connecting portions define at least two hollow regions. The leads are disposed around the die pad. The chip is located within the central portion of the die pad and electrically connected to the leads via a plurality of wires. The molding compound encapsulates the chip, the wires, inner leads and a portion of the carrier. | 02-25-2010 |
Chun-Hung Lin, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090284694 | FLAT DISPLAY DEVICE - A flat display device includes a flat display panel, an upper polarizing plate disposed on a light exit plane of the flat display panel, and a lower polarizing plate disposed on a light entrance plane of the flat display panel. The upper polarizing plate includes a wide view film, and its absorption axis and a horizontal view direction of the flat display panel have an included angle of about 15 degrees. The absorption axis of the lower polarizing plate and the horizontal view direction of the flat display panel have an included angle of about 105 degrees. | 11-19-2009 |
Chun-Hung Lin, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090140022 | Bicycle power unit case - A bicycle power unit case includes a controller received therein and a power unit is inserted into the case from a top of the case and electrically connected to the controller. The case includes a bottom-bracket hole through which the bottom bracket and crank extend. The case is connected to a low and central portion of the bicycle. The down tube, the seat tube and the chain stays are respectively inserted and fixed to the case. The power unit case does not affect the center of weight of the bicycle and the power unit can be easily replaced from a top of the case. | 06-04-2009 |
| 20090188285 | Auto lock system for bicycles - An auto lock system for bicycles includes a leveling detection member for detecting level status of the bicycle, a locking member for locking a rotational part of the bicycle, at least one detection member for detecting one of the rotational parts of the bicycle, and a control member which receives information from the leveling detection member and the at least one detection member so as to activate the locking member. The locking member can be installed to lock the front or rear wheels or the handlebar. | 07-30-2009 |
| 20090243256 | Bicycle frame with a receiving space - A bicycle frame includes a head tube, a seat tube and at least one tube connected between the head tube and the seat tube. The at least one tube includes a first longitudinal tube connected to the head tube and a second longitudinal tube connected to the seat tube, a transverse tube is connected between the first and second longitudinal tubes. The transverse tube includes a receiving space in which a lock or a light device is received. | 10-01-2009 |
Chun-Hung Lin, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090212526 | Bicycle frame - A bicycle frame includes a front part and a rear part. The front part includes head tube, a seat tube and a down tube connected between the head tube and the seat tube. A first connection portion is connected to the conjunction portion of the seat tube and the down tube. The rear part includes a second connection portion, a connection plate extending from a top end of the second connection portion, and two chain stays and two seat stays extending from the connection plate. The connection plate is fixed to the seat tube by at least one bolt, and the first and second connection portions are connected to each other by at least two bolts. The first connection portion includes a ridge which is engaged with the groove defined in the second connection portion. | 08-27-2009 |
Chun-Hung Lin, Pingtung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090185374 | LIGHTING DEVICE HAVING LED LIGHT BARS - A lighting device has a light-bar mount and multiple light bars. The light-bar mount is integrally formed from a board. The light bars are mounted on the light-bar mount and each light bar has a heat sink, a circuit board and multiple high-power LED modules. The heat sink is detachably mounted in the light-bar mount. The circuit board is mounted in the heat sink. The high-power LED modules are mounted on the heat sink and electrically connected to the circuit board for providing outward illumination. | 07-23-2009 |
Chun-Hung Lin, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080283981 | Chip-On-Lead and Lead-On-Chip Stacked Structure - A chip-stacked package structure comprises a lead frame, a first chip, and a second chip. The led frame is composed of a plurality of inner leads and a plurality of outer leads. The plurality of inner leads comprises a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, wherein the ends of first inner leads and the ends of second inner leads are arranged in rows facing each other at a distance. The active surface of first chip is fixedly connected to the lower surface of first inner leads and second inner leads via a first adhesive layer. A plurality of metal pads is provided near the central area of the active surface of first chip and is exposed. A second adhesive layer is formed on the back surface of second chip for fixedly connecting the back surface of second chip and the upper surface of first inner leads and second inner leads. The gap formed by the thickness of second adhesive layer prevents the bonding wires connecting the first chip from contacting the back surface of second chip. | 11-20-2008 |
| 20080310235 | SENSING CIRCUIT FOR MEMORIES - A memory apparatus includes a plurality of memory units, a sensing circuit and a bias-generating circuit. The plurality of memory units respectively outputs a data current to the sensing circuit, while the sensing circuit further includes a plurality of first transistors, a plurality of second transistors and a plurality of sensing amplifiers. In order to speed up the access time of the memory units, the bias-generating circuit rapidly provides a bias signal to the sensing circuit to turn on the first transistors of the sensing circuit. In the present invention, the sensing circuit uses a common reference voltage to reduce the circuit utilization area of the memory apparatus. | 12-18-2008 |
| 20090004620 | Surface treating device and surface treating method - A surface treating method for treating a tooth surface and a surface treating device thereof are provided. First, a working gas is filled into a tube. Next, a voltage is provided to the working gas for exciting the working gas into plasma. After that, the plasma is discharged through an opening of the tube for contacting the tooth surface. | 01-01-2009 |
| 20090169822 | ANTI-REFLECTION PLATE AND METHOD FOR MANUFACTURING ANTI-REFLECTION STRUCTURE THEREOF - A method for manufacturing an anti-reflection structure is provided. The method includes the following steps: First, a to-be-treated object is provided in a reactive area. Next, a plasma source is provided in the reactive area. Then, the plasma source is ionized to form plasma in atmospheric pressure. Next, the surface of the to-be-treated object is treated by plasma so as to form a plurality of micro-protuberances on the surface of the to-be-treated object. | 07-02-2009 |
Chun-Hung Lin, Tainan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090026632 | CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF - A wafer treating method for making adhesive chips is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform an adhesive film having B-stage property which has a glass transition temperature between −40 and 175 degree C., for example. After positioning the wafer, the wafer is singulated to form a plurality of chips with adhesive for chip-to-chip stacking, chip-to-substrate or chip-to-lead frame attaching. | 01-29-2009 |
Chun-Hung Lin, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080280384 | SOLID-STATE LIGHT EMITTING DISPLAY AND FABRICATION METHOD THEREOF - A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements. | 11-13-2008 |
Chun-Hung Lin, Jhubel City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080236412 | Nano-imprinting method using material having surface energy - A mold release agent of polybenzoxazine is used in an imprinting process. With the novel mold release agent used, a surface energy of a template is greatly reduced, so that an excel lent imprinted image is obtained. Besides, the mold release agent is totally resolved in a solution with no pollution produced. In short, the present invention has a high stability and a low cost with easy-obtained source materials. | 10-02-2008 |
Chun-Hung Lin, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20110132578 | HEAT-DISSIPATING PLATE - A heat-dissipating plate has a casing and a supporting structure, where the casing has surrounding walls to define a receiving compartment therein confined by an inner wall. The inner wall is integrated with a capillary structure. Disposed inside the receiving compartment, the supporting structure includes a meshed partition and a plurality of columns. The meshed partition has a plurality of holes and joined-openings. The columns are fixed in the joined-openings and abut against the inner surface of the walls. The associated manufacturing process for the heat-dissipating plate is easily to accomplish. | 06-09-2011 |
| 20110168359 | HEAT-DISSIPATING PLATE - A heat-dissipating plate includes a casing and partition insert. The casing has surrounding walls with wick structures therein, and the inner surface of the walls defines a receiving compartment. The partition is disposed in the receiving compartment. The partition has a plurality of hole, a plurality of flanges protruding from an edge of the holes respectively. Each of flanges has a plurality of arc-shaped flange-rim extending outward to support the inner surface of the surrounding wall. | 07-14-2011 |
Chun-Hung Lin, Hsinchu Hsieh TW
| Patent application number | Description | Published |
|---|---|---|
| 20110171426 | HARD WATER-REPELLENT STRUCTURE AND METHOD FOR MAKING THE SAME - A hard water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hard coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the hard water-repellent structure includes the hard coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the hard water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the disclosure adopts the APPD technique to form the hard water-repellent structure, the cost of production is reduced dramatically. Thus, the disclosure can solve drawbacks of prior art. | 07-14-2011 |
Chun-Hung Lin, Yunlin County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110216475 | STACKED SOLID-STATE ELECTROLYTIC CAPACITOR WITH MULTI-DIRECTIONAL PRODUCT LEAD FRAME STRUCTURE - A stacked solid-state electrolytic capacitor with multi-directional product lead frame structure includes a plurality of capacitor units, a substrate unit and a package unit. The capacitor units are stacked onto each other. Each capacitor unit has a positive electrode and a negative electrode, the positive electrode of each capacitor unit has a positive pin extended outwards, the positive pins are electrically stacked onto each other, and the negative electrodes are electrically stacked onto each other. The substrate unit has at least one positive guiding substrate electrically connected to the positive pins of the capacitor units and a plurality of negative guiding substrates electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit in order to expose an end of the at least one positive guiding substrate and an end of each negative guiding substrate. | 09-08-2011 |
Chun-Hung Lin, Redmond, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20120036566 | AUTOMATIC CONFIGURATION AND CONTINUATION OF FEDERATION RELATIONSHIPS - Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack. | 02-09-2012 |
Chun-Hung Lin, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120318480 | HEAT SINK HAVING JUXTAPOSED HEAT PIPES AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat sink having juxtaposed heat pipes and a method for manufacturing the same. The heat sink includes a base, a plurality of heat pipes and a pair of side strips. The base has a surface on which an open trough and an insertion trough on both sides of the open trough are provided. Each heat pipe has an evaporating section. The evaporating sections are juxtaposed in the open trough and adhered to each other. Each evaporating section has a planar surface. The side strips are fixed into the insertion troughs and protrude from the surface of the base. The planar surface of each evaporating section and the outer surface of each side strip are coplanar. By this structure, the thermal contact surface between the heat pipes and electronic heat-generating sources is increased, so that the heat-dissipating efficiency of the heat sink is improved. | 12-20-2012 |