| Patent application number | Description | Published |
|---|
| 20080259577 | FLEXIBLE BIOMONITOR WITH EMI SHIELDING AND MODULE EXPANSION - A flexible biomonitor comprises: a flexible substrate having a circuit apparatus, a hybrid sensor, a plurality of IC devices, a central processing module, a RF transmitter circuit, an antenna, and a power supply. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area, providing comfortable wear and achieve compactness, module expansion and EMI shielding. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care. | 10-23-2008 |
| 20080278337 | URINE DETECTION SYSTEM AND METHOD - A urine detection system is provided for detecting degree of wetness of a diaper, comprising a plane printing electrode, a sensor, and a display unit. The plane printing electrode comprises a first electrode area and a second electrode area. The sensor comprises a first sensor electrode, a second sensor electrode and a processor. Wherein the first sensor electrode and the first electrode area forms a first capacitor, and the second sensor electrode and the second electrode area forms a second capacitor. The processor, detects capacitance of the first and second capacitors, and determines a signal representing degree of wetness of the diaper. The display unit receives the signal and displays the degree of wetness corresponding to the signal. | 11-13-2008 |
| 20080315433 | SELF-ALIGNED WAFER OR CHIP STRUCTURE, SELF-ALIGNED STACKED STRUCTURE AND METHODS FOR FABIRCATING THE SAME - A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface. | 12-25-2008 |
| 20090020862 | DEVICE STRUCTURE WITH PREFORMED RING AND METHOD THEREFOR - A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process. | 01-22-2009 |
| 20090121299 | Wafer level sensing package and manufacturing process thereof - A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer. | 05-14-2009 |
| 20090124074 | WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF - A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer. | 05-14-2009 |
| 20090129622 | MEMS MICROPHONE MODULE AND MANUFACTURING PROCESS THEREOF - A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined. | 05-21-2009 |
| 20090133903 | ELECTRODE AND METHOD FOR FORMING THE SAME - An electrode and a method for forming the electrode. The electrode comprises: a substrate; and a plurality of metal particles adhering to the substrate. The method comprises steps of: providing a substrate; providing a solution including a solvent and a plurality of metal particles on the substrate; removing the solvent; and making the plurality of metal particles adhere to the substrate. | 05-28-2009 |
