Patent application number | Description | Published |
20130216177 | METHOD OF FABRICATION POLYMER WAVEGUIDE - A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region. | 08-22-2013 |
20130223789 | OPTICAL BENCH ON SUBSTRATE - An optical bench on substrate includes a substrate and a trench formed inside the substrate and having a sloping side. A reflector layer is formed over the sloping side. An optical component is mounted over the substrate. The reflector layer is configured to reflect an electromagnetic wave to or from the optical component. | 08-29-2013 |
20140084421 | Adhesion Promoter Apparatus and Method - A structure comprises a substrate having a plateau region and a trench region, a reflecting layer formed over a top surface of the trench region, a first adhesion promoter layer formed over the reflecting layer, a bottom cladding layer deposited over the first adhesion promoter layer, a core layer formed over the bottom cladding layer and a top cladding layer formed over the core layer. | 03-27-2014 |
20140204466 | OPTICAL ELEMENT STRUCTURE AND OPTICAL ELEMENT FABRICATING PROCESS FOR THE SAME - An optical element structure and a fabricating process for the same are provided. The optical element fabricating process includes providing a substrate forming thereon a protrusion; and forming an over coating layer over the protrusion and the substrate by a deposition scheme to form an optical element. | 07-24-2014 |
20140355929 | WAVEGUIDE STRUCTURE AND METHOD FOR FABRICATING THE SAME - Embodiments of forming a waveguide structure are provided. The waveguide structure includes a substrate, and the substrate has an interconnection region and a waveguide region. The waveguide structure also includes a trench formed in the substrate, and the trench has a sloping sidewall surface and a substantially flat bottom. The waveguide structure further includes a bottom cladding layer formed on the substrate, and the bottom cladding layer extends from the interconnection region to the waveguide region, and the bottom cladding layer acts as an insulating layer in the interconnection region. The waveguide structure further includes a metal layer formed on the bottom cladding layer on the sloping sidewall surface. | 12-04-2014 |
20150061126 | MANUFACTURE INCLUDING SUBSTRATE AND PACKAGE STRUCTURE OF OPTICAL CHIP - A manufacture includes a package structure, a first substrate, and a conductive member of a same material. The package structure includes a chip comprising a conductive pad, a conductive structure over the chip, and a passivation layer over the conductive structure. The passivation layer has an opening defined therein, and the opening exposes a portion of a planar portion of the conductive structure. The first substrate includes a first surface defining a first reference plane and a second surface defining a second reference plane. The conductive member extends across the first reference plane and the second reference plane and into the opening. The conductive member is electrically coupled to the exposed portion of the planar portion. | 03-05-2015 |
20150061137 | PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS - A package for holding a plurality of heterogeneous integrated circuits includes a first chip having a first conductive pad and a first substrate including a first semiconductor, and a second chip having a second conductive pad and a second substrate including a second semiconductor. The second semiconductor is different from the first semiconductor. The package also includes a molding structure in which the first chip and the second chip are embedded, a conductive structure over the first chip and conductively coupled to the first conductive pad and over the second chip and conductively coupled to the second conductive pad, and a passivation layer over the conductive structure. The passivation layer comprises an opening defined therein which exposes a portion of the second chip. | 03-05-2015 |
20150130045 | THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES - A method of forming a semiconductor package includes providing a substrate, wherein the substrate has at least one chip attached on an upper surface of the substrate. An insulating barrier layer is deposited above the substrate, wherein the at least one chip is at least partially embedded within the insulating barrier layer. A thermally conductive layer is formed over the insulating barrier layer to at least partially encapsulate the at least one chip. | 05-14-2015 |
20150130047 | THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES - A method of forming a semiconductor package includes forming a thermal conductivity layer and attaching the thermal conductivity layer to a chip. The chip has a first surface and a second surface. The thermal conductivity layer is attached to the first surface of the chip. The thermal conductivity layer provides a path through which heat generated from the chip is dissipated to the ambient. A substrate is attached to the second surface of the chip. A molding compound is formed above the substrate to encapsulate the chip and the thermal conductivity layer. | 05-14-2015 |
20150131938 | LIGHT COUPLING FORMATION IN A WAVEGUIDE LAYER - An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package. | 05-14-2015 |
20150131939 | APPARATUS AND METHOD OF FORMING CHIP PACKAGE WITH WAVEGUIDE FOR LIGHT COUPLING - An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding layer over the LD die and the adhesive layer. The method still further includes curing the molding layer and partially removing the molding layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure. | 05-14-2015 |