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Chun-Chen
Chun-Chen Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110029814 | TEST SYSTEM AND TEST METHOD THEREOF - A test system and a test method thereof. The test system includes an electronic device and a test device. The electronic device includes a plurality of output interfaces and provides a corresponding test signal via the output interfaces according to a group of operation commands. The test device includes a transforming unit, a multiplexer unit, a processor unit and a plurality of test interfaces which are respectively coupled to the output interfaces. The transforming unit transforms the test signals received via the test interfaces. The multiplexer unit selects the transformed test signals. The processor unit controls the multiplexer unit to select one of the transformed test signals, and determines whether the transformed test signal being selected conforms a predetermine condition for generating a test result signal. The processor unit controls the communication unit to transmit the test result signal to the electronic device according to the test result signal. | 02-03-2011 |
Chun-Chen Liao, Baoshan Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100144734 | 1, 2, 3-Triazole derivatives as new cannabinoid-1 receptor antagonists - The present invention relates to 1,2,3-triazole derivatives which can be used as cannabinoid CB1 receptor antagonists. In addition, the compound of the 1,2,3-triazole derivatives in the present invention can be formulated into a pharmaceutical composition for treating indications relative to signal transduction of CB1 receptors. | 06-10-2010 |
Chun-Chen Liao, Hsin-Chu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080284454 | Test interface with a mixed signal processing device - The present invention relates to a test interface to which a mixed signal processing circuit is integrated, and more particularly to a test interface of a probe card or a DUT card to which a mixed signal processing circuit is integrated, and the mixed signal processing circuit is integrated to pin electronic channels of a tester and the operation process of the mixed signal processing circuit is integrated to the system software of the tester. | 11-20-2008 |
Chun-Chen Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20120042589 | DOOR FRAME STRUCTURE - A door frame structure, which includes a plurality of door frame units and locking elements. Each door frame unit has a main body and a door stop, where the door stop is at a surface of the main body. A notch is formed between the main body and the door stop to accommodate a buffer strip. The door frame unit can further include a plurality of set pieces for anchoring to the wall with different thicknesses. The door frame structure of the instant disclosure saves construction labor, improves visual appearance, increases structural stability and adaptability, and reduces door hitting noise. | 02-23-2012 |
Chun-Chen Liu, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090039483 | HEAT SLUG AND SEMICONDUCTOR PACKAGE - A heat slug includes a heat spreading member and a supporting member. The supporting member extends outwardly from the edge of the heat spreading member. The tips of the supporting member are formed with a plurality of contact portions, wherein each said contact portion has a bottom face inclined to the surface of the chip carrier at an angle of more than 5 degrees. The present invention further provides a semiconductor package. | 02-12-2009 |
Chun-Chen Wu, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090315567 | ELECTRICAL CONDITIONING OF MEMS DEVICE AND INSULATING LAYER THEREOF - A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer. | 12-24-2009 |