| Patent application number | Description | Published |
|---|
| 20080293203 | Semiconductor device having a fin structure and method of manufacturing the same - A semiconductor device may include a fin structure having source/drain regions and channel fins connected between source/drain patterns. A gate insulation layer may be provided on the channel fins. A gate electrode may include lower gate patterns and an upper gate pattern. The lower gate patterns may extend in a vertical direction and contact the gate insulation layer. The upper gate pattern may extend in a second horizontal direction substantially perpendicular to the first horizontal direction. The upper gate pattern may be connected to upper portions of the lower gate patterns. | 11-27-2008 |
| 20080303085 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN WITH CHANNEL RECESS, AND METHOD OF FABRICATING THE SAME - A semiconductor device including an active pattern having a channel recess portion, and a method of fabricating the same, are disclosed. In one embodiment, the semiconductor device includes an active pattern including first active regions and a second active region interposed between the first active regions. The active pattern protrudes above a surface of a semiconductor substrate and includes a channel recess portion above the second active region and between the first active regions. A device isolation layer surrounds the active pattern and has a groove exposing side walls of the recessed second active region. A distance between opposing side walls of the first active regions exposed by the channel recess portion is greater than a distance between side walls of the groove. A gate pattern is located in the channel recess portion and extends along the groove. | 12-11-2008 |
| 20080315282 | Semiconductor Devices Including Transistors Having Three Dimensional Channels - Semiconductor devices including a gate electrode crossing over a semiconductor fin on a semiconductor substrate are provided. A gate insulating layer is provided between the gate electrode and the semiconductor fin. A channel region having a three-dimensional structure defined at the semiconductor fin under the gate electrode is also provided. Doped region is provided in the semiconductor fin at either side of the gate electrode and an interlayer insulating layer is provided on a surface of the semiconductor substrate. A connector region is coupled to the doped region and provided in an opening, which penetrates the interlayer insulating layer. A recess region is provided in the doped region and is coupled to the connector region. The connector region contacts an inner surface of the recess region. Related methods of fabricating semiconductor devices are also provided herein. | 12-25-2008 |
| 20090170271 | TRANSISTOR AND METHOD OF FORMING THE SAME - According to some embodiments of the invention, a fin type transistor includes an active structure integrally formed with a silicon substrate. The active structure includes grooves that form blocking regions under source/drain regions. A gate structure is formed to cross the upper face of the active structure and to cover the exposed side surfaces of the lateral portions of the active structure. An effective channel length of a fin type transistor may be sufficiently ensured so that a short channel effect of the transistor may be prevented and the fin type transistor may have a high breakdown voltage. | 07-02-2009 |
| 20090186471 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE FOR REDUCING THERMAL BURDEN ON IMPURITY REGIONS OF PERIPHERAL CIRCUIT REGION - A method of fabricating a semiconductor device for reducing a thermal burden on impurity regions of a peripheral circuit region includes preparing a substrate including a cell active region in a cell array region and peripheral active regions in a peripheral circuit region. A cell gate pattern and peripheral gate patterns may be formed on the cell active region and the peripheral active regions. First cell impurity regions may be formed in the cell active region. A first insulating layer and a sacrificial insulating layer may be formed to surround the cell gate pattern and the peripheral gate patterns. Cell conductive pads may be formed in the first insulating layer to electrically connect the first cell impurity regions. The sacrificial insulating layer may be removed adjacent to the peripheral gate patterns. First and second peripheral impurity regions may be sequentially formed in the peripheral active regions adjacent to the peripheral gate patterns. | 07-23-2009 |
| 20090189217 | Semiconductor Memory Devices Including a Vertical Channel Transistor - Semiconductor memory devices include a semiconductor substrate and a plurality of semiconductor material pillars in a spaced relationship on the semiconductor substrate. Respective surrounding gate electrodes surround ones of the pillars. A first source/drain region is in the semiconductor substrate between adjacent ones of the pillars and a second source/drain region is in an upper portion of at least one of the adjacent pillars. A buried bit line is in the first source/drain region and electrically coupled to the first source/drain region and a storage node electrode is on the upper portion of the at least one of the adjacent pillars and electrically contacting with the second source/drain region. | 07-30-2009 |
| 20110095350 | VERTICAL TYPE INTEGRATED CIRCUIT DEVICES, MEMORY DEVICES, AND METHODS OF FABRICATING THE SAME - A vertical type integrated circuit device includes a substrate and a pillar vertically protruding from the substrate. The pillar includes a lower impurity region and an upper impurity region therein and a vertical channel region therebetween. A portion of the pillar including the lower impurity region therein includes a mesa laterally extending therefrom. The device further includes a first conductive line extending on a first sidewall of the pillar and electrically contacting the lower impurity region, and a second conductive line extending on a second sidewall of the pillar adjacent the vertical channel region. The second conductive line extends in a direction perpendicular to the first conductive line and is spaced apart from the mesa. Related devices and methods of fabrication are also discussed. | 04-28-2011 |
| 20110171800 | METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES AND DEVICES FORMED BY THE SAME - A polycrystalline semiconductor layer is formed on a cell active region and a peripheral active region of a substrate. A buried gate electrode is formed in the substrate in the cell active region at a level below the polycrystalline semiconductor layer after forming the polycrystalline semiconductor layer. A gate electrode is formed on the substrate in the peripheral active region from the polysilicon semiconductor layer after forming the buried gate electrode. | 07-14-2011 |
| 20110210421 | TRENCH-TYPE CAPACITOR, SEMICONDUCTOR DEVICE HAVING THE SAME, AND SEMICONDUCTOR MODULE HAVING THE SEMICONDUCTOR DEVICE - Provided is a trench-type capacitor. To form the capacitor, first and second active regions are disposed in a semiconductor substrate. Node patterns are disposed in the first active region. Each node pattern may have a conductive pattern and an insulating pattern, which are sequentially stacked. Impurity diffusion regions are disposed in the vicinity of the node patterns. Substrate connection patterns in electrical contact with the first and second active regions are disposed. Node connection patterns in electrical contact with the node patterns are disposed in the vicinity of the first and second active regions. In addition, a semiconductor device having the trench-type capacitor and a semiconductor module having the semiconductor device is provided. | 09-01-2011 |
| 20120017517 | ELECTRICAL DOOR - LOCKING DEVICE - An electrical door-locking device includes screws which are rotatable in a forwards and backwards direction, and are placed in line on one side of a door frame in the direction in which the electrical door main body slides; locking hooks located adjacent to the screws; and a sliding unit equipped with a rotatably-provided locking lever having a latch for latching onto the locking hooks when the electrical door main body is closed and is equipped with a locking-lever-pressing part for pressing the locking lever such that the latch of the locking lever unlatches from the locking hooks, and one end of which is rotatably linked to the screws and the other end of which is linked to the electrical door main body. | 01-26-2012 |
| Patent application number | Description | Published |
|---|
| 20100125697 | COMPUTING DEVICE HAVING STORAGE, APPARATUS AND METHOD OF MANAGING STORAGE, AND FILE SYSTEM RECORDED RECORDING MEDIUM - A storage management apparatus and a file system for a storage device are provided. The storage management apparatus allocates a portion of storage for writing a file to the storage, including a table storing unit storing an allocation unit table that includes information of a unit of allocation of the storage according to a file extension of a file to be written. A storage management unit manages the storage based on the allocation unit table. | 05-20-2010 |
| 20100299513 | MEMORY APPARATUS AND METHOD THEREFOR - A memory apparatus and an operation of the memory apparatus which allow quick booting are provided. The memory apparatus includes a volatile memory, a non-volatile memory, and a memory control unit to control input/output of data stored in the volatile memory and the non-volatile memory. The memory control unit restores data, according to a control command input from outside of the memory apparatus, from the non-volatile memory to the volatile memory in an on-demand fashion during booting. | 11-25-2010 |
| 20120072657 | SYSTEM AND METHOD TO WRITE DATA USING PHASE-CHANGE RAM - A data recording system includes a file system configured to manage block-based input/output of data, a phase-change random access memory (PRAM) configured to write first data among the data in units of sub blocks, and a block abstract layer configured to receive a write command of the first data to a first particular block in the PRAM from the file system and log changed data information to a second particular block in the PRAM in units of sub blocks, and a method to provide the same. | 03-22-2012 |
