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Chuang, Kaohsiung City
Bing-Juo Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100014621 | Synchronization Determining Circuit, Receiver Including the Synchronization Determining Circuit, and Method of the Receiver - A receiver includes; a recovery circuit for receiving an input signal, and generating a data signal and a recovery clock; a processing circuit for processing the data signal to generate a processed signal; and a synchronization determining circuit for determining a synchronization state of the recovery clock according to the processed signal and a first reference value. The data signal includes a synchronous pattern, and the first reference value corresponds to at least a portion of a value in the synchronous pattern processed by the processing circuit. A method of the receiver is also disclosed. | 01-21-2010 |
Chau-Chin Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100252940 | POLYIMIDE SHIELD AND INTEGRATED CIRCUIT STRUCTURE HAVING THE SAME - A polyimide shield includes a base film layer that is made from polyimide, and a colored film layer that overlies the base film layer and that contains a coloring agent dispersed in a polymer. A method of making the polyimide shield includes forming the base film layer from polyimide and applying a liquid composition onto the base film layer. The liquid composition contains a polymer and the coloring agent that is dispersed in the polymer. An integrated circuit structure includes a circuitry substrate and the polyimide shield that covers the circuitry substrate. | 10-07-2010 |
Chen-Jung Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110254397 | POSITIONING STRUCTURE FOR STATOR ASSEMBLY OF FAN MOTOR - A positioning structure for a stator assembly of a fan motor has a fan base and a stator assembly. The fan base has a central hub projected thereon for connecting to one end of an axial tube. The fan base is further formed with a plurality of first engagement portions surrounding a hub base of an outer peripheral surface of the central hub. The stator assembly has an axial hole sleeved on the axial tube and a plurality of second engagement portions which can be engaged with the first engagement portions. Thus, the stator assembly can be rapidly and stably installed on the fan base. | 10-20-2011 |
Chia-Cheng Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090000106 | METHOD OF FORMING VERTICAL COUPLING STRUCTURE FOR NON-ADJACENT RESONATORS - A method for forming a vertical coupling structure for non-adjacent resonators is provided to have a first and a second resonators, a dielectric material layer, a first and a second high-frequency transmission lines and at least one via pole. The first and the second resonators respectively have a first and a second opposite metal surfaces. The dielectric material layer is disposed between the opposite second metal surfaces of the first and the second resonators. The first and the second transmission lines are respectively arranged at sides of the first metal surfaces of the first resonator and the second resonator. The first high-frequency transmission line is vertically connected to the second high-frequency transmission line by the via pole. | 01-01-2009 |
| 20090002104 | VERTICAL COUPLING STRUCTURE FOR NON-ADJACENT RESONATORS - A vertical coupling structure for non-adjacent resonators is provided to have a first and a second resonators, a dielectric material layer, a first and a second high-frequency transmission lines and at least one via pole. The first and the second resonators respectively have a first and a second opposite metal surfaces. The dielectric material layer is disposed between the opposite second metal surfaces of the first and the second resonators. The first and the second transmission lines are respectively arranged at sides of the first metal surfaces of the first resonator and the second resonator. The first high-frequency transmission line is vertically connected to the second high-frequency transmission line by the via pole. | 01-01-2009 |
| 20090045890 | FILTERING CIRCUIT AND STRUCTURE THEREOF - A filtering circuit and a structure thereof are provided. The filtering circuit includes an input terminal, an output terminal, a resonant circuit, a first coupling portion, and a second coupling portion. The resonant circuit is coupled between the input terminal and the output terminal and includes M resonators which are arranged in sequence. A signal received by the input terminal can be transmitted to the output terminal by the resonant circuit through inter-coupling between adjacent resonators. The first coupling portion and the second coupling portion are respectively coupled to non-adjacent resonators. A part of the signal received by the input terminal is transmitted to the second coupling portion via the first coupling portion through cross-couple. Thereby, sideband interference can be further suppressed. | 02-19-2009 |
| 20100117768 | VERTICAL COUPLING STRUCTURE FOR NON-ADJACENT RESONATORS - A vertical coupling structure for non-adjacent resonators is provided. The vertical coupling structure has a first resonator and a second resonator. At least one side of the first resonator is formed as a first bent extension structure, and the first bent extension structure includes a slot. The second resonator is not adjacent to the first resonator, and the side of the second resonator opposite to the first bent extension structure of the first resonator further includes a slot, such that the two sides are electrically connected. | 05-13-2010 |
Chiao-Shun Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110115015 | TRENCH DEVICES HAVING IMPROVED BREAKDOWN VOLTAGES AND METHOD FOR MANUFACTURING SAME - In one embodiment, the present invention includes a semiconductor power device. The semiconductor power device comprises a trenched gate and a trenched field region. The trenched gate is disposed vertically within a trench in a semiconductor substrate. The trenched field region is disposed vertically within the trench and below the trenched gate. A lower portion of the trenched field region tapers to disperse an electric field. | 05-19-2011 |
| 20110133271 | Trench MOS Device with Schottky Diode and Method for Manufacturing Same - In one embodiment the present invention includes a semiconductor device. The semiconductor device comprises a first semiconductor region, a second semiconductor region and a trench region. The first semiconductor region is of a first conductivity type and a first conductivity concentration. The trench region includes a metal layer in contact with the first semiconductor region to form a metal-semiconductor junction. The second semiconductor region is adjacent to the first semiconductor region that has a second conductivity type and a second conductivity concentration. The second semiconductor region forms a PN junction with the first semiconductor region, and the trench region has a depth such that the metal-semiconductor junction is proximate to the PN junction. | 06-09-2011 |
Chieh-Yao Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120081826 | Poly Fuse Burning System - This invention provides a poly fuse burning system comprising a poly fuse, a controllable power source supplying power for burning the poly fuse, and a monitor circuit monitoring the burning state of the poly fuse, wherein when a targeted burning state is reached, a control signal is output to shut down the controllable power source to stop the burning. | 04-05-2012 |
Ching-Hong Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120025363 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure includes first and second substrates, a sealant and a filler. The first substrate has a surface including an active region and a bonding region. The first substrate has a component in the active region and a pad in bonding region. The pad is electrically connected to the component. The sealant is disposed on the surface surrounding the active region. The sealant has a breach at a side of the active region. The second substrate is bonded to the first substrate via the sealant. The second substrate has a first opening corresponding to the pad, and a second opening corresponding to the breach. The filler fills the second opening, covers the breach such that the first substrate, the second substrate, the sealant and the filler together form a sealed space for accommodating the component. | 02-02-2012 |
Ching Wen Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110173994 | COOLING SYSTEM FOR SEMICONDUCTOR MANUFACTURING AND TESTING PROCESSES - A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products. | 07-21-2011 |
Chun-Te Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100168594 | DETECTION METHOD FOR DETECTING QRS WAVE - A detection method for detecting a QRS wave is disclosed. An electrocardiogram (ECG) signal is provided. The ECG signal is enhanced to generate a processed signal. A first crest of the processed signal is determined. Each crest following the first crest is defined as a second crest. The level of each second crest is higher than a first threshold value. The result of defining the second crest is utilized to determine whether the QRS wave has occurred and approached a first crest. | 07-01-2010 |
Hui-Ching Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090259393 | NAVIGATION METHODS AND SYSTEMS - Navigation methods and systems are provided. First, an electronic device generates a route planning result according to at least a destination, and performs a navigation process according to the route planning result. It is determined whether at least one navigation condition has occurred. When the navigation condition has occurred, a position schematic diagram is displayed, wherein the position schematic diagram comprises the destination and a current position of the electronic device. | 10-15-2009 |
Hui-Ju Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110310237 | Facial Expression Recognition Systems and Methods and Computer Program Products Thereof - A facial expression recognition system includes a facial database, an image capture unit, an expression recognition data generation unit and an expression recognition unit. The facial database includes a plurality of expression information and expression features of optical flow field, wherein each of the expression features of optical flow field corresponds to one of the expression information. The image capture unit captures a plurality of facial images. The expression recognition data generation unit is coupled to the image capture unit and the facial database for receiving a first facial image and a second facial image from the image capture unit and calculating an expression feature of optical flow field between the first facial image and the second facial image corresponding to each of the expression information. The expression recognition unit is coupled to the expression recognition data generation unit for determining a facial expression corresponding to the first and second facial images according to the calculated expression feature of optical flow field for each of the expression information and the variation features in optical flow in the facial database. | 12-22-2011 |
Hui-Yen Chuang, Kaohsiung City TW
I-Lung Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100176414 | PACKAGING STRUCTURE OF LIGHT-EMITTING COMPONENTS - The present invention provides a packaging structure of light-emitting components, comprising at least a light-emitting component, at least a connection wire, a base, at least a reflection surface, and an insulator, and characterized in that: the light-emitting component produces a light source and corresponding heat energy; the connection wire is coupled to the light-emitting component and at least an electrode; the electrode is disposed on the base; the light-emitting component is disposed on the base; the light-emitting component includes a heat-conducting base; the reflection surface reflects the light source produced by the light emitting component; the insulator insulates the electrode from the reflection surface; and the reflection surface is formed integrally with the heat-conducting base. | 07-15-2010 |
Jiann-Hsing Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110207550 | Method for Surface Treating a Golf Club Head - A method for surface treating a golf club head, includes: (a) forming a depression unit in the golf club head, the depression unit being indented inwardly from an outer surface of the golf club head, the outer surface being divided into a working area and a non-working area, the depression unit being formed in the working area; (b) filling the depression unit with a shielding material and covering the non-working area with a covering material; and (c) sandblasting the golf club head after step (b) and removing subsequently the shielding material from the depression unit and the covering material from the non-working area so as to form the working area into sandblasted and non-sandblasted regions that differ in gloss intensity. | 08-25-2011 |
Mao-Chang Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110174529 | STRUCTURE HAVING MULTI-TRACE VIA SUBSTRATE AND METHOD OF FABRICATING THE SAME - A method of fabricating a multi-trace via substrate is disclosed. A substrate at least having a first surface and a hole is provided, wherein the hole has a hole wall. A first conductive layer is formed on the entire surface of the substrate and the hole wall. A photoresist layer applied over the entire surface of the first conductive layer is selectively patterned to define a plurality of laterally separated regions on the first conductive layer. A patterned photoresist layer is used as a mask and a second conductive layer substantially thicker than the first conductive layer is electroplated on the laterally separated regions. The patterned photoresist layer is removed. The portion of the first conductive layer not covered by the second conductive layer is substantially removed to form a plurality of laterally separated traces extended on the first surface and through the hole. | 07-21-2011 |
Ming-Ching Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120117910 | PANEL ASSEMBLY AND ACCESSORIES - A panel assembly includes multiple base boards, multiple cover panels, multiple shelves and multiple accessories so as to be fixed to a wall. The multiple base boars and the multiple cover panels define a path, a space and a gap. The path, the space and the gap communicate with each other. Sand the shelves or the accessories are inserted into the path, the space and gap. The panel assembly can be quickly assembled and replaced to change the arrangements and suitable for decoration and display or storage. | 05-17-2012 |
Ta-Hsien Chuang, Kaohsiung City TW
Tsung-Hsien Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120099044 | LIQUID CRYSTAL DISPLAY MODULE - A liquid crystal display (LCD) module includes a back bezel, a backlight module, a frame, an LCD panel, a circuit board, an assembling element, and a gasket. The frame has a top part and a bottom part opposite to the top part, and the bottom part faces the back bezel. The circuit board is configured on the top part of the frame and has a first surface and a second surface opposite to the first surface. The second surface faces the frame, and the circuit board has a ground area on the second surface. The assembling element pierces through the frame and connects the frame to the back bezel. The gasket leans against the ground area of the circuit board and the assembling element to form a conductive path from the ground area, the gasket, the assembling element to the back bezel. | 04-26-2012 |
Wei-Ping Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080260085 | Method and device for estimating integer carrier frequency offset - The method disclosed in the invention comprises setting a plurality of subcarrier position hypotheses for a received preamble according to a plurality of ideal subcarrier positions and the maximum amount of integer carrier frequency offset (ICFO), generating a plurality of preamble pattern hypotheses by retrieving the received preamble according to the subcarrier position hypotheses, calculating the correlation between the preamble pattern hypotheses and a plurality of specified preamble patterns, determining to which sector the received preamble belongs according to a correct preamble pattern, the specified preamble pattern having the highest correlation with the preamble pattern hypotheses, obtaining a correct subcarrier position according to the sector to which the received preamble belongs; and estimating the ICFO by calculating the offset between the correct subcarrier position and the subcarrier position hypothesis of the preamble pattern hypothesis having the highest correlation with the correct preamble pattern. | 10-23-2008 |
| 20080310525 | FFT-size detector and FFT-size detection method and cell search apparatus and cell search method in cellular system - An apparatus and method for cell acquisition and downlink synchronization acquisition in an OFDMA wireless communication system are provided. In an SS apparatus in a broadband wireless communication system, a preamble subcarrier acquirer extracts subcarrier values having a preamble code from an FFT signal. A multiplier code-demodulates the subcarrier values by multiplying the subcarrier values by a preamble code. A correlator calculates a plurality of differential correlations in the code-demodulated signal. An IFFT processor IFFT-processes the differential correlations by mapping the differential correlations to subcarriers. A maximum value detector detects a maximum value from the IFFT signal and calculates a timing offset using an IFFT output index having the maximum value. | 12-18-2008 |
| 20100056082 | COMMUNICATION SYSTEM WITH FREQUENCY-ADAPTIVE PREDISTORTER DESIGN - A communication system comprises a predistorter for distorting an input signal according to at least one parameter to generate a distorted signal, an amplifier for amplifying the distorted signal according to an input-output characteristic to generate an output signal, and a frequency-domain adaptive calibration module for adaptively adjusting the parameter of the predistorter according to a frequency characteristic of the output signal. Because the calibration is performed in the frequency domain, there is no need to precisely estimate the group delay formed by the feedback path. The system complexity is therefore reduced without loss of performance. | 03-04-2010 |
| 20110164568 | FFT-SIZE DETECTOR AND FFT-SIZE DETECTION METHOD AND CELL SEARCH APPARATUS AND CELL SEARCH METHOD IN CELLULAR SYSTEM - An apparatus and method for cell acquisition and downlink synchronization acquisition in an OFDMA wireless communication system are provided. In an SS apparatus in a broadband wireless communication system, a preamble subcarrier acquirer extracts subcarrier values having a preamble code from an FFT signal. A multiplier code-demodulates the subcarrier values by multiplying the subcarrier values by a preamble code. A correlator calculates a plurality of differential correlations in the code-demodulated signal. An IFFT processor IFFT-processes the differential correlations by mapping the differential correlations to subcarriers. A maximum value detector detects a maximum value from the IFFT signal and calculates a timing offset using an IFFT output index having the maximum value. | 07-07-2011 |
Wen-Yuen Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100184255 | MANUFACTURING METHOD FOR PACKAGE STRUCTURE - A manufacturing method for package structure is provided. The manufacturing method includes the follow steps. Firstly, a substrate is provided. Next, a number of chips are provided. Then, the chips are electrically connected with the substrate. After that, the chips are encapsulated with a sealant, so that the chips and the substrate form a package. Then, the package is adhered by a vacuum force. Afterwards, the adhered package is singulated to form many package structures along the portion between adjacent two of airways. | 07-22-2010 |
Yao-Kai Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090267210 | INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF - An integrated circuit package and a manufacturing method thereof are provided. The package includes a die pad, a plurality of first and second contact pads, a first die, a second die and a molding compound. The contact pads adjacent to at least one side of the die pad are arranged along an inner row and an outer row with respect to the die pad. The first die is fixed on the first die and electrically connected to the first contact pads by wire-bonding. The second die is fixed on the first die and electrically connected to the second contact pads by wire-bonding. The molding compound covers the second die, the first die, the die pad, the first contact pads and the second contact pads. The bottoms of the die pad, the first contact pads and the second contact pads are exposed at the bottom surface of the molding compound. | 10-29-2009 |
| 20090278242 | STACKED TYPE CHIP PACKAGE STRUCTURE - A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip. | 11-12-2009 |
| 20090278243 | STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads. | 11-12-2009 |
Ye Lin Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100205498 | Method for Detecting Errors and Recovering Video Data - A method of processing video data includes providing a bit-stream; and decoding the bit-stream. The step of decoding the bit-stream includes extracting a data portion from the bit-stream; extracting a first backup copy of the data portion from the bit-stream; and determining correct values of syntaxes in the data portion from the data portion itself and the first backup copy of the data portion. A second backup copy of the data portion may be extracted from the bit-stream and cross-examined with the data portion and the first backup copy of the data portion. | 08-12-2010 |
Ying-Te Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090279247 | HEAT DISSIPATION DEVICE OF NOTEBOOK COMPUTER - A heat dissipation device is provided for dissipating heat from a heat source inside a notebook computer, and includes a hood, a bottom board, a thermal insulation layer, and at least one fan. The hood and the bottom board together define a heat dissipation channel. The bottom board integrally forms a plurality of fins and pegs. The bottom board is set above the heat source. The fan is set above the bottom board to efficiently expel heat from the inside to the outside. With the plurality of fins and pegs, the heat dissipation surface area of the bottom board and the heat source is increased and the overall heat dissipation performance is enhanced. | 11-12-2009 |
| 20100091497 | LIGHT-EMITTING DIODE LIGHTING DEVICE WITH MULTIPLE-LAYERED SOURCE - A lighting device includes a cover, a cap, a central post having opposite ends coupled to the cover and the cap respectively, and a plurality of first and second frames. The cover and the cap both form a plurality of circumferentially distributed slots opposite to each other. The first and second frames have ends respectively fit into the slots of the cover and the cap and each frame carries at least one light-emitting diode. As such, a light-emitting diode lighting device that is hollow, light-weighted, and exhibiting excellent heat dissipation is formed. | 04-15-2010 |
| 20100157608 | STRUCTURE OF LIGHT-EMITTING DIODE LIGHTING TUBE - A light-emitting diode lighting tube includes a casing, an aluminum base board, which is fit into the casing and carries a plurality of light-emitting diodes, at least two reflective members respectively arranged on opposite sides of the light-emitting diodes, and first and second end caps respectively mounted to opposite ends of the casing. The casing has a radial cross-section forming an opening extending in an axial direction of the casing. The aluminum base board is fit to retention sections formed beside the opening. The two reflective members are arranged on opposite sides of the LEDs for reflecting lights emitting from the LEDs. | 06-24-2010 |
| 20110169392 | LED PROJECTION LAMP - A light emitting diode (LED) projection lamp includes a lamp body and a plurality of LEDs. The lamp body includes an inverted conical shaped external cover, an electric contact base formed at the tip of the external cover, and a plurality of protrusions arranged on an internal wall of the external cover with a circular distribution, and each protrusion has at least one fixing surface. The LEDs are installed separately on each fixing surface, and an inclination is formed between lights emitted by the LEDs and a projection plane for reducing reflective lights, and the LEDs are electrically coupled to the electric contact base, such that heat produced by using the LEDs is conducted directly to the external cover for its dissipation to improve the heat dissipating efficiency and lifespan of the lamp, and the angular arrangement of the LEDs also improves the saturation and reflection of the light. | 07-14-2011 |
Yu-Jen Chuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100033985 | LED Luminescent Device and Vehicle Lamp Comprising the Device - An LED luminescent device comprises an LED light source, a reflector, a light shade and a projecting lens. The LED light source comprises at least one LED element having a light-emitting surface emitting light. The reflector faces the light-emitting surface of the at least one LED element and has multiple reflection surfaces of different curvatures reflecting the light form the light-emitting surface of the at least one LED element. The light shade adjusts the light reflected by the reflector to provide a required light distribution pattern. The projecting lens projects the required light distribution pattern. Thus the device and a vehicle lamp comprising the device can prevent light energy from losing. | 02-11-2010 |
| 20110305029 | Illuminating system and thin plate shield illuminating apparatus - An illuminating system having an electronic shield illuminating apparatus comprises a semiconductor light-emitting source, a reflector, an electronic shield, a shield driving control circuit, and a projection lens. The reflector is intended for reflecting a portion of the light reflected by the semiconductor light-emitting source, and has a reflecting surface facing the semiconductor light-emitting source. The electronic shield is intended for generating different shield patterns to mask the light emitted by the semiconductor light-emitting source, and the light reflected by the reflector, and has a main surface facing the semiconductor light-emitting source and the reflecting surface of the reflector. The shield driving control circuit drives the electronic shield to generate different shield patterns in response to a signal information. The projection lens projects the light passing through the electronic shield. | 12-15-2011 |