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Chu, San Francisco

Clifford D. Chu, San Francisco, CA US

Patent application numberDescriptionPublished
20100293523Development environment configured to generate application source code from database objects - Development tools are disclosed that connect various artifacts in a database aware fashion. For example, the development environment may integrate SQL query builders across multiple application development interfaces (e.g., a source code editor, XML editor, database scripting tools, etc.), significantly improving developer productivity, reducing development cost and time. Thus, the process of consuming heterogeneous artifacts in an application (or creating them for consumption) becomes a very productive experience, eliminating the need to manually cut/paste information in multiple project files in many cases.11-18-2010
20100293524DEVELOPMENT ENVIRONMENT FOR MANAGING DATABASE AWARE SOFTWARE PROJECTS - Embodiments of the invention introduce development tools that connect various artifacts in a database aware fashion. For example, embodiments of the invention integrate SQL query builders across multiple application development interfaces (e.g., a source code editor, XML editor, database scripting tools, etc.), significantly improving developer productivity, reducing development cost and time. Thus, the process of consuming heterogeneous artifacts in an application (or creating them for consumption) becomes a very productive experience, eliminating the need to manually cut/paste information in multiple project files in many cases.11-18-2010

Daniel Y. Chu, San Francisco, CA US

Patent application numberDescriptionPublished
20100099581LOCALIZED TEMPERATURE CONTROL FOR SPATIAL ARRAYS OF REACTION MEDIA - Individual temperature control in multiple reactions performed simultaneously in a spatial array such as a multi-well plate is achieved by thermoelectric modules with individual control, with each module supplying heat to or drawing heat from a single region within the array, the region containing either a single reaction vessel or a group of reaction vessels.04-22-2010

Enlai Chu, San Francisco, CA US

Patent application numberDescriptionPublished
20110021220METHODS AND DEVICES FOR INCLUDING A PLURALITY OF USERS IN A CONVERSATION OVER A COMMUNICATION NETWORK - Methods and devices are disclosed for including a plurality of users in a conversation over a communication network. A conversation is initiated when a text message is received requesting the conversation. A conversation is established using conversation gateways currently unused by users to be included in the conversation. Communication may occur across gateways in order to conserve conversation gateway resources.01-27-2011

Peter Chu, San Francisco, CA US

Patent application numberDescriptionPublished
20080260719EDG: Modulators of lymphocyte activation and migration - The present invention relates to regulation of lymphocyte activation and migration. More particularly, the present invention is directed to nucleic acids encoding EDG family GPCR proteins, e.g., EDG-1, 2, 3, 4, 5, 6, 7, or 8, which are involved in modulation of lymphocyte activation and migration. The invention further relates to methods for identifying and using agents, including small organic molecules, antibodies, peptides, cyclic peptides, nucleic acids, antisense nucleic acids, sphingolipid analogs, and ribozymes, that modulate lymphocyte activation or migration via modulation of EDG GPCRs and EDG related signal transduction; as well as to the use of expression profiles and compositions in diagnosis and therapy related to lymphocyte activation and suppression, and lymphocyte migration.10-23-2008

Patent applications by Peter Chu, San Francisco, CA US

Schubert S. Chu, San Francisco, CA US

Patent application numberDescriptionPublished
20080268171APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION - Embodiments of the invention provide an apparatus configured to form a material during an atomic layer deposition (ALD) process, such as a plasma-enhanced ALD (PE-ALD) process. In one embodiment, a plasma baffle assembly for receiving a process gas within a plasma-enhanced vapor deposition chamber is provided which includes a plasma baffle plate containing an upper surface to receive a process gas and a lower surface to emit the process gas, a plurality of openings configured to flow the process gas from above the upper surface to below the lower surface, wherein each opening is positioned at a predetermined angle of a vertical axis that is perpendicular to the lower surface, and a conical nose cone on the upper surface. In one example, the openings are slots positioned at a predetermined angle to emit the process gas with a circular flow pattern.10-30-2008
20090078916TANTALUM CARBIDE NITRIDE MATERIALS BY VAPOR DEPOSITION PROCESSES - Embodiments of the invention generally provide compositions of tantalum carbide nitride materials. In one embodiment, a composition of a tantalum carbide nitride material is provided which includes the chemical formula of TaC03-26-2009
20090081868VAPOR DEPOSITION PROCESSES FOR TANTALUM CARBIDE NITRIDE MATERIALS - Embodiments of the invention generally provide methods for depositing and compositions of tantalum carbide nitride materials. The methods include deposition processes that form predetermined compositions of the tantalum carbide nitride material by controlling the deposition temperature and the flow rate of a nitrogen-containing gas during a vapor deposition process, including thermal decomposition, CVD, pulsed-CVD, or ALD. In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating the substrate to a temperature within a process chamber, and exposing the substrate to a nitrogen-containing gas and a process gas containing a tantalum precursor gas while depositing a tantalum carbide nitride material on the substrate. The method further provides that the tantalum carbide nitride material is crystalline and contains interstitial carbon and elemental carbon having an interstitial/elemental carbon atomic ratio of greater than 1, such as about 2, 3, 4, or greater.03-26-2009
20090084317ATOMIC LAYER DEPOSITION CHAMBER AND COMPONENTS - An atomic layer deposition chamber comprises a gas distributor comprising a central cap having a conical passageway between a gas inlet and gas outlet. The gas distributor also has a ceiling plate comprising first and second conical apertures that are connected. The first conical aperture receives a process gas from the gas outlet of the central cap. The second conical aperture extends radially outwardly from the first conical aperture. The gas distributor also has a peripheral ledge that rests on a sidewall of the chamber.04-02-2009
20090314370CHEMICAL DELIVERY APPARATUS FOR CVD OR ALD - Embodiments are related to ampoule assemblies containing bypass lines and valves. In one embodiment, ampoule assembly is provided which includes inlet and outlet lines coupled with and in fluid communication to an ampoule body, a bypass line connected between the inlet and outlet lines and containing a bypass valve disposed therein. The ampoule assembly further contains a shut-off valve disposed in the inlet line between the ampoule body and a connection point of the bypass line and the inlet line, a shut-off valve disposed in the outlet line between the ampoule body and a connection point of the bypass line and the outlet line, another shut-off valve disposed in the inlet line between the ampoule body and a disconnect fitting disposed on the inlet line, and another shut-off valve disposed in the outlet line between the ampoule body and a disconnect fitting disposed on the outlet line.12-24-2009
20100006167CHEMICAL DELIVERY APPARATUS FOR CVD OR ALD - Embodiments described herein provide ampoule assemblies to contain, store, or dispense chemical precursors. In one embodiment, an ampoule assembly is provided which includes an ampoule containing a first material layer disposed on the outside of the ampoule and a second material layer disposed over the first material layer, wherein the first material layer is thermally more conductive than the second material layer, an inlet line in fluid communication with the ampoule and containing a first manual shut-off valve disposed therein, an outlet line in fluid communication with the ampoule and containing a second manual shut-off valve disposed therein, and a first bypass line connected between the inlet line and the outlet line. In some embodiments, the ampoule assembly may contain disconnect fittings. In other embodiments, the first bypass line has a shut-off valve disposed therein to fluidly couple or decouple the inlet line and the outlet line.01-14-2010
20100129535Vapor Deposition Processes for Tantalum Carbide Nitride Materials - Embodiments of the invention generally provide methods for depositing and compositions of tantalum carbide nitride materials. The methods include deposition processes that form predetermined compositions of the tantalum carbide nitride material by controlling the deposition temperature and the flow rate of a nitrogen-containing gas during a vapor deposition process, including thermal decomposition, CVD, pulsed-CVD, or ALD. In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating the substrate to a temperature within a process chamber, and exposing the substrate to a nitrogen-containing gas and a process gas containing a tantalum precursor gas while depositing a tantalum carbide nitride material on the substrate. The method further provides that the tantalum carbide nitride material is crystalline and contains interstitial carbon and elemental carbon having an interstitial/elemental carbon atomic ratio of greater than 1, such as about 2, 3, 4, or greater.05-27-2010
20110124192PROCESS FOR FORMING COBALT-CONTAINING MATERIALS - Embodiments of the invention described herein generally provide methods and apparatuses for forming cobalt silicide layers, metallic cobalt layers, and other cobalt-containing materials. In one embodiment, a method for forming a cobalt silicide containing material on a substrate is provided which includes exposing a substrate to at least one preclean process to expose a silicon-containing surface, depositing a cobalt silicide material on the silicon-containing surface, depositing a metallic cobalt material on the cobalt silicide material, and depositing a metallic contact material on the substrate. In another embodiment, a method includes exposing a substrate to at least one preclean process to expose a silicon-containing surface, depositing a cobalt silicide material on the silicon-containing surface, expose the substrate to an annealing process, depositing a barrier material on the cobalt silicide material, and depositing a metallic contact material on the barrier material.05-26-2011

Patent applications by Schubert S. Chu, San Francisco, CA US