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Chu, Kaohsiung
Cheng-Jye Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20120024369 | PHOTO-CHEMICAL SOLAR CELL WITH NANONEEDLE ELECTRODE AND METHOD MANUFACTURING THE SAME - A photo-chemical solar cell with nanoneedle electrode and a method manufacturing the same includes at least a working electrode, a counter electrode, an electrolyte layer and a photosensitized dye layer. The working electrode is an nanoneedle electrode formed from an nanoneedle semiconductor layer, wherein the nanoneedle semiconductor layer is prepared by sol-gel method at a low temperature to increase the specific surface area, adsorb more dye, increase the conductive ratio of the electrode, and thus improve the photo-current and the conversion efficiency. | 02-02-2012 |
Cheng-Ming Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080255211 | Oxadiazole Compounds - A compound of formula (I): | 10-16-2008 |
Chi-Chih Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100171207 | STACKABLE SEMICONDUCTOR DEVICE PACKAGES - In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate. | 07-08-2010 |
| 20110156251 | Semiconductor Package - The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least one opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors. Whereby, the solder mask contacts the first pads directly, and thus results in higher bonding strength, so as to avoid the bridge between the first conductors caused by the first conductors permeating into the interface between the solder mask and the first pads. | 06-30-2011 |
Jenn-Lien Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100184425 | Automatic Fall Behind Warning Method And System - Disclosed relates to an automatic fall behind warning method and system applied in a group activity environment. Each individual in the group corresponds to a node and all of such nodes form an independent network. The method initializes an outside node table for the group and gets a link quality index table (LQI table) among the nodes on the network. A table specifying outside and inside nodes for the network topology is generated via an algorithm. Then the method checks if there is a node being disappeared from the outside nodes of the generated table. If not, it updates the outside node table and continues to get a newest LQI table. If so, the node falls behind is confirmed and a warning notice is automatically generated once the disappeared node is not an inside node is verified. Otherwise, the method returns to the step of updating the outside node table. | 07-22-2010 |
Linabel Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100231530 | TOUCH PAD FOR MULTIPLE SENSING - A touch pad for multiple sensing configured to receive touch and pressed-pressure made from at least one finger, conductor or object, comprising an upper conductive layer and a lower conductive layer underneath the upper conductive layer. The upper conductive layer has a plurality of upper sensor members and a plurality of upper joint members. The lower conductive layer has a plurality of lower sensor members and a plurality of lower joint members. The distance-related capacitance on upper sensor members and lower sensor members are detected through the electrically coupled upper joint members and the electrically coupled lower joint members respectively. Besides, an overlapped portion of the upper sensor members and the lower sensor members are electrically conducted by the pressed-pressure. Meanwhile, at least one electrical signal is generated from voltage difference between the upper joint members or between the lower joint members, which the strength of electrical signal is related to the distance of pressed-pressure from the upper joint members or from the lower joint members. | 09-16-2010 |
Wei-Te Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090073632 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor - A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer. | 03-19-2009 |
Wen-Ting Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090023255 | Method for Reshaping Silicon Surfaces with Shallow Trench Isolation - A method for making a semiconductor device by reshaping a silicon surface with a sacrificial layer is presented. In the present invention the steps of forming a sacrificial dielectric layer and removing the sacrificial dielectric layer are repeated multiple times in order to remove sharp edges from the silicon surface near the field oxides. Another aspect of the present invention includes making a MOSFET transistor that incorporates the forming and removing of multiple sacrificial layers into the process. | 01-22-2009 |
| 20110309417 | Method for Reshaping Silicon Surfaces with Shallow Trench Isolation - A method for making a semiconductor device by reshaping a silicon surface with a sacrificial layer is presented. In the present invention the steps of forming a sacrificial dielectric layer and removing the sacrificial dielectric layer are repeated multiple times in order to remove sharp edges from the silicon surface near the field oxides. Another aspect of the present invention includes making a MOSFET transistor that incorporates the forming and removing of multiple sacrificial layers into the process. | 12-22-2011 |
Yen-Chuan Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090279306 | Lighting Apparatus - A lighting apparatus is disclosed. The lighting apparatus comprises a casing, at least one light source and a microstructure cover. The light source is disposed on one side of the casing. The microstructure cover is mounted on the casing opposite to the reflective face thereof. The microstructure cover has a plurality of guiding micro-structures to guide light and a plurality of dispersing micro-structures to disperse light. | 11-12-2009 |
Yung-Cheng Chu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090201186 | CURRENT STEERING DAC AND VOLTAGE BOOSTER OF SAME - A digital-to-analog converter is coupled to a first voltage source and used for converting a digital input into an analog output. The DAC includes a voltage booster providing a first gate-source voltage and a second gate-source voltage to generate a voltage of a first level according to the first voltage source and the first gate-source voltage, and to generate a voltage of a second level according to the voltage of the first level and the second gate-source voltage; and a current-guiding circuit selectively receiving the voltage of the first level or the second level according to the digital input to generate the analog output. The first level and the second level vary with the first voltage source. | 08-13-2009 |