| Patent application number | Description | Published |
|---|
| 20080219806 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219807 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219808 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219809 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219810 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219811 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080219812 | SEMICONDUCTOR MANUFACTURING PROCESS MODULES - A variety of process modules are described for use in semiconductor manufacturing processes. | 09-11-2008 |
| 20080232933 | Robotic Chamber Support Pedestal - Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency. | 09-25-2008 |
| 20080232947 | SEMICONDUCTOR WAFER HANDLING AND TRANSPORT - Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency. | 09-25-2008 |
| 20080232948 | SEMICONDUCTOR WAFER HANDLING AND TRANSPORT - Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency. | 09-25-2008 |
| 20110093237 | WAFER CENTER FINDING WITH CHARGE-COUPLED DEVICES - A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances. | 04-21-2011 |
