Patent application number | Description | Published |
20100236603 | Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Receivers and Methods of Forming Same - CPV modules include a back plate having an array of 1 mm | 09-23-2010 |
20100248484 | Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby - Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer. | 09-30-2010 |
20110279014 | OLED DEVICE WITH EMBEDDED CHIP DRIVING - An electroluminescent device having a plurality of current driven pixels arranged in rows and columns, such that when current is provided to a pixel it produces light, including each pixel having first and second electrodes and current responsive electroluminescent media disposed between the first and second electrodes; at least one chiplet having a thickness less than 20 micrometers; including transistor drive circuitry for controlling the operation of at least four pixels, the chiplet being mounted on a substrate and having connection pads; a planarization layer disposed over at least a portion of the chiplet; a first conductive layer over the planarization layer and connected to at least one of the connection pads; and a structure for providing electrical signals through the first conductive layer and at least one of the connection pads of the chiplet so that the transistor drive circuitry of the chiplet controls current to the four pixels. | 11-17-2011 |
20120126229 | INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRATED CIRCUIT ELEMENTS WITH IMPROVED INTERCONNECTION ALIGNMENT TOLERANCE - An electronic component array includes a backplane substrate, and a plurality of integrated circuit elements on the backplane substrate. Each of the integrated circuit elements includes a chiplet substrate having a connection pad and a conductor element on a surface thereof. The connection pad and the conductor element are electrically separated by an insulating layer that exposes at least a portion of the connection pad. At least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon. A plurality of conductive wires are provided on the backplane substrate including the integrated circuit elements thereon, and the connection pad of each of the integrated circuit elements is electrically connected to a respective one of the conductive wires notwithstanding the misalignment of the at least one of the integrated circuit elements. Related fabrication methods are also discussed. | 05-24-2012 |
20120228669 | HIGH-YIELD FABRICATION OF LARGE-FORMAT SUBSTRATES WITH DISTRIBUTED, INDEPENDENT CONTROL ELEMENTS - A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s). | 09-13-2012 |
20120313241 | METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS - A method for selectively transferring active components from a source substrate to a destination substrate includes pressing a first stamp having first pillars protruding therefrom against active components on the source substrate to adhere respective primary surfaces of the active components including electrical connections thereon to respective transfer surfaces of the first pillars. A second stamp having second pillars protruding therefrom is pressed against the active components on the first stamp to adhere respective secondary surfaces of the active components to respective transfer surfaces of the second pillars. The transfer surfaces of the second pillars have greater adhesive strength than the first pillars. The second stamp is pressed against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate. | 12-13-2012 |
20120314388 | SUBSTRATES WITH TRANSFERABLE CHIPLETS - A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the intermediate substrate. | 12-13-2012 |
20130153277 | ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS - An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed. | 06-20-2013 |
20130196474 | MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES - A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed. | 08-01-2013 |
20130221355 | STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS - A substrate includes an anchor area ( | 08-29-2013 |
20140034127 | SURFACE-MOUNTABLE LENS CRADLES AND INTERCONNECTION STRUCTURES FOR CONCENTRATOR-TYPE PHOTOVOLTAIC DEVICES - A concentrator-type photovoltaic (CPV) receiver includes a solar cell on a substrate. The solar cell includes a light receiving surface having a conductive terminal thereon. A conductive lens support frame is mounted on the substrate and includes an opening therein that exposes the light receiving surface of the solar cell. A lens element is provided on the support frame opposite the light receiving surface of the solar cell. The support frame is electrically connected to the conductive terminal on the light receiving surface and an electrical node on the substrate. The support frame also supports and self-aligns the lens element with the light receiving surface to concentrate incident light thereon. Related fabrication processes are also discussed. | 02-06-2014 |
20140048128 | SURFACE MOUNTABLE SOLAR RECEIVER WITH INTEGRATED THROUGH SUBSTRATE INTERCONNECT AND OPTICAL ELEMENT CRADLE - A concentrator-type photovoltaic (CPV) device includes a solar cell comprising a substrate including a light receiving surface and a mounting surface opposite the light receiving surface. A conductive through-substrate interconnect having insulated sidewalls extends through the substrate from the mounting surface to the light receiving surface to provide an electrical connection to a conductive terminal on the light receiving surface. A lens support structure is formed on the light receiving surface, and a lens element is provided on the support structure opposite the light receiving surface. The support structure supports and aligns the lens element with the light receiving surface to concentrate incident light thereon. Related fabrication processes are also discussed. | 02-20-2014 |
20140261628 | HIGH EFFICIENCY SOLAR RECEIVERS INCLUDING STACKED SOLAR CELLS FOR CONCENTRATOR PHOTOVOLTAICS - A solar receiver includes at least two electrically independent photovoltaic cells which are stacked. An inter-cell interface between the photovoltaic cells includes a multi-layer dielectric stack. The multi-layer dielectric stack includes at least two dielectric layers having different refractive indices. Related devices and fabrication methods are also discussed. | 09-18-2014 |
20140264937 | Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching - Provided are methods for making a through-silicon via feature in a silicon substrate and related systems, such as by forming a noble metal structure on a silicon substrate support surface to generate silicon substrate contact regions that are in contact with or proximate to the noble metal structure; exposing at least a portion of the silicon substrate support surface and noble metal structure to an etchant to preferentially etch the silicon substrate contact regions compared to silicon substrate non-contact regions until the etch front reaches the silicon substrate bottom surface. | 09-18-2014 |
20150079783 | Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby - Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer. | 03-19-2015 |