| Patent application number | Description | Published |
|---|
| 20080239431 | MICROMECHANICAL DEVICE OF INCREASED RIGIDITY - A micromechanical device includes a deflectable micromechanical functional structure and a non-rigid biased suspension positioning the micromechanical functional structure in the micromechanical device. | 10-02-2008 |
| 20080239446 | MICROMECHANICAL DEVICE WITH TILTED ELECTRODES - A micromechanical device includes a micromechanical functional structure, which can be deflected about a main axis from a rest position, a movable electrode, which is mounted to the micromechanical functional structure, and a fixed electrode, which can be tilted about a tilting axis with respect to the movable electrode in the rest position, wherein the tilting axis is parallel to the main axis or is identical with the main axis. | 10-02-2008 |
| 20080241462 | DEFLECTABLE STRUCTURE, MICROMECHANICAL STRUCTURE COMPRISING SAME, AND METHOD FOR ADJUSTING A MICROMECHANICAL STRUCTURE - A deflectable structure includes a layer having a first area and a second area, a trench structure in the layer which penetrates the layer and separates the first area from the second area, a first junction between the first area and the second area, and a second junction between the first area and the second area, the first area being permanently moveable from a first, permanent position with regard to the second area to a second position, deflected as compared to the first position, with regard to the second area by applying a force. | 10-02-2008 |
| 20080242049 | METHOD FOR GENERATING A MICROMECHANICAL STRUCTURE - In a method for manufacturing a micromechanical structure, first a two-dimensional structure is formed in a substrate. The two-dimensional structure is deflected from the substrate plane by action of force and fixed in the deflected state. | 10-02-2008 |
| 20090250853 | TORSION RESILIENT ELEMENT FOR HANGING MICROMECHANICAL ELEMENTS WHICH CAN BE DEFLECTED - The invention relates to torsion spring elements for the suspension of deflectable micromechanical elements such as reflecting elements pivotable around a rotational axis. It is therefore the object of the invention to provide torsion spring elements for suspensions of deflectable micromechanical elements which can achieve improved properties in operation with respect to known spring elements. Torsion spring elements in accordance with the invention are made so that they have a changing geometrical design in the direction of their longitudinal axis and thereby have non-linear spring characteristics. The longitudinal axis is in this respect aligned between a clamping or support and the deflectable micromechanical element which is held by at least one torsion spring element. In this respect, a torsion spring element in accordance with the invention can have a straight-line region, which is aligned in the direction of the longitudinal axis, and a fork/branching at at least one end face into which the straight-line region merges. | 10-08-2009 |
| 20090302960 | Oscillating, deflectable micromechanical element and method for use thereof - The invention relates to micromechanical elements deflectable in an oscillating manner and to a method for the operation of such elements. In this respect, it is the object of the invention to be able to operate the micromechanical elements in a stable and simple manner on the oscillating deflection while taking account of the respective mechanical resonant frequency. A least one spring element is present on elements in accordance with the invention with which it is held. It is deflected between two reversal points using an electrical AC voltage. The one or more spring element(s) has/have non-linear spring characteristics so that a changed mechanical resonant frequency results in dependence on the respective deflection. | 12-10-2009 |
| 20090303563 | Method for Structuring a Device Layer of a Substrate - Method for structuring a device layer of a substrate, wherein the substrate includes a carrier layer, the device layer and an intermediate layer disposed between the carrier layer and the device layer. Thereby, the intermediate layer is structured for exposing, at least in one portion, a first surface of the carrier layer facing the device layer. Starting from a second surface of the carrier layer opposing the first surface, the thickness of the device layer is reduced to a predetermined thickness at those positions where the intermediate layer is removed. | 12-10-2009 |
| 20100295066 | SEMICONDUCTOR SUBSTRATE AND METHODS FOR THE PRODUCTION THEREOF - The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side. | 11-25-2010 |
