| Patent application number | Description | Published |
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| 20100029036 | THIN-FILM DEVICES FORMED FROM SOLID GROUP IIIA PARTICLES - Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form. | 02-04-2010 |
| 20100055901 | LASER MATERIAL REMOVAL METHODS AND APPARATUS - Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer. | 03-04-2010 |
| 20100132759 | CELL ISOLATION ON PHOTOVOLTAIC MODULES FOR HOT SPOT REDUCTION - Embodiments of the present invention provide methods for fabricating a solar cell on a substrate that have proportionally reduced current to minimize or reduce the likelihood of shading of a portion of the solar cell causing damage to the formed device. In one embodiment, a method for fabricating a series of solar cell arrays on a substrate includes providing a substrate having a TCO layer formed thereon, forming a first plurality of vertical scribing lines and a first plurality of horizontal scribing lines in the TCO layer, forming a film stack and a back metal layer on the scribed TCO layer, and forming a second plurality of the horizontal scribing lines in the film stack and the back metal layer, wherein the second plurality of horizontal scribing lines comprise pairs of scribing lines formed adjacent to each respective one of the first plurality of the horizontal scribing lines formed in the TCO layer. | 06-03-2010 |
| 20100190290 | SOLAR CELL PATTERNING AND METALLIZATION - Embodiments of the present invention generally provide methods for forming conductive structures on the surfaces of a solar cell. In one embodiment, conductive structures are formed on the front surface of a solar cell by depositing a sacrificial polymer layer, forming patterned lines in the sacrificial polymer via a fluid jet, depositing metal layers over the front surface of the solar cell, and performing lift off of the metal layers deposited over the sacrificial polymer by dissolving the sacrificial polymer with a water based solvent. In another embodiment, conductive structures are formed on the back surface of a solar cell by depositing a sacrificial polymer layer, forming patterned lines in the sacrificial polymer via a fluid jet, depositing a metal layer over the back surface of the solar cell, and performing lift off of the metal layer deposited over the sacrificial polymer by dissolving the sacrificial polymer with a water based solvent, and completing selective metallization of the remaining metal lines. | 07-29-2010 |
| 20100291758 | Thin-Film Devices Formed From Solid Particles - Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form. | 11-18-2010 |
| 20100313929 | CELL ISOLATION ON PHOTOVOLTAIC MODULES FOR HOT SPOT REDUCTION - Embodiments of the present invention provide methods for fabricating a solar cell on a substrate that have proportionally reduced current to minimize or reduce the likelihood of shading of a portion of the solar cell causing damage to the formed device. In one embodiment, a method for fabricating a series of solar cell arrays on a substrate includes providing a substrate having a TCO layer formed thereon, forming a first plurality of vertical scribing lines and a first plurality of horizontal scribing lines in the TCO layer, forming a film stack and a back metal layer on the scribed TCO layer, and forming a second plurality of the horizontal scribing lines in the film stack and the back metal layer, wherein the second plurality of horizontal scribing lines comprise pairs of scribing lines formed adjacent to each respective one of the first plurality of the horizontal scribing lines formed in the TCO layer. | 12-16-2010 |
| 20110023957 | PHOTOVOLTAIC CELLS INCLUDING PEAKS AND METHODS OF MANUFACTURE - Photovoltaic module and methods for the manufacture of photovoltaic modules are described. Operative layers of the photovoltaic cell are deposited onto a superstrate having one or more of at least one peak allowing for electrical isolation of a portion of a photovoltaic module and at least one ramp creating a series connection between individual photovoltaic cells with minimal loss of the efficiency due to dead space between the cells. | 02-03-2011 |
| 20110065227 | COMMON LASER MODULE FOR A PHOTOVOLTAIC PRODUCTION LINE - Embodiments of the present invention generally relate to an automated production line using a common laser scribe module for providing consistent scribe lines in multiple layers during the formation of thin film photovoltaic modules. The common laser scribe module includes a plurality of identical, programmable laser tools configured to emit radiation at a common wavelength. Substrates flowing through the production line are tracked by a system controller, which identifies available laser tools within the common laser scribe module and routes substrates to available tools for scribing features in one or more layers disposed on the substrates. The system controller also sets and controls laser parameters, such as power, pulse frequency, pulse width, and laser pattern, in order to accurately and consistently produce scribed lines in the appropriate material layer of the substrate. | 03-17-2011 |
| 20110114182 | THIN-FILM DEVICES FORMED FROM SOLID GROUP IIIA PARTICLES - Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form. | 05-19-2011 |
| 20110139251 | BANDGAP GRADING IN THIN-FILM DEVICES VIA SOLID GROUP IIIA PARTICLES - Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment, a method is provided for bandgap grading in a thin-film device using such particles. The method may be comprised of providing a bandgap grading material comprising of an alloy having: a) a IIIA material and b) a group IA-based material, wherein the alloy has a higher melting temperature than a melting temperature of the IIIA material in elemental form. A precursor material may be deposited on a substrate to form a precursor layer. The precursor material comprising group IB, IIIA, and/or VIA based particles. The bandgap grading material of the alloy may be deposited after depositing the precursor material. The alloy in the grading material may react after the precursor layer has begun to sinter and thus maintains a higher concentration of IIIA material in a portion of the compound film that forms above a portion that sinters first. | 06-16-2011 |
