| Patent application number | Description | Published |
|---|
| 20100048755 | POROUS POLYMERIC MATERIAL WITH CROSS-LINKABLE WETTING AGENT - A porous material is provided which comprises a transparent polymer matrix defining interconnected pores and a wetting agent. At least a portion of the wetting agent is cross-linked with the polymer matrix. A process for forming a porous polymeric material is also provided. A bicontinuous microemulsion comprising water, a wetting agent, a monomer, and a surfactant copolymerizable with the monomer is polymerized, to form a polymer defining interconnected pores. The wetting agent comprises a cross-linkable wetting agent such that after polymerization, at least a portion of the cross-linkable wetting agent is cross-linked with the polymer. The wetting agent may comprise acrylated hyaluronic acid (AHA) such as methacrylated hyaluronic acid (MeHA). The wetting agent may also comprise a hyaluronic acid (HA). The wetting agent may include an unbonded portion that this releasable from the material. A contact lens may be made from the porous material. | 02-25-2010 |
| 20110129924 | Porous Polymeric Articles - Porous polymeric articles, and more specifically, porous polymeric articles for tissue engineering and organ replacement, are described. In some embodiments, methods described herein include use of a polymer-solvent system (e.g., phase inversion) to generate porosity in a structure. The process may include formation of a structure precursor material including a first crosslinkable component and a second component that can be precipitated in a precipitation medium. The structure precursor material may be shaped into a three-dimensional shape by a suitable technique such as three-dimensional printing. Upon shaping of the structure precursor material, at least a portion of the first component may be crosslinked. The structure may then be contacted with a precipitation medium to remove the precursor solvent from the structure, which can cause the second polymer component to precipitate and form a porous structure containing a network of uniform pores. In some embodiments, the porous structure is constructed and arranged for use as a template for ultrafiltration, cell growth, and/or for forming complex, biomimetic, porous biohybrid organs, where living cells can be immobilized and perform their normal physiological functions. | 06-02-2011 |
| 20120035288 | FORMING COPOLYMER FROM BICONTINUOUS MICROEMULSION COMPRISING MONOMERS OF DIFFERENT HYDROPHILICITY - A copolymer defines interconnected pores and comprises polymerized monomers. The monomers comprise a first monomer more hydrophilic than 2-hydroxyethyl methacrylate (HEMA), and a second monomer as hydrophilic as, or less hydrophilic than, HEMA. In a method of forming a polymer, a bicontinuous microemulsion comprising water, a surfactant, and a combination of monomers copolymerizable for forming a porous copolymer is provided. The combination of monomers comprises the first and second monomers. The monomers in the bicontinuous microemulsion are polymerized to form the porous copolymer. The first monomer may comprise N-vinylpyrrolidone (NVP) or methacrylic acid (MAA). The second monomer may comprise HEMA or methyl methacrylate (MMA). | 02-09-2012 |
| Patent application number | Description | Published |
|---|
| 20080292325 | HIGH IMMUNITY CLOCK REGENERATION OVER OPTICALLY ISOLATED CHANNEL - An optically isolated circuit device includes a first opto-isolator circuit that is driven by a first clock signal, and the output of the first opto-isolator circuit is used to drive a phase-locked loop (PLL) that is configured to synthesize a second clock signal having a frequency that is a multiple of the first clock signal frequency. The second clock signal is used as an input to a suitable clocked circuit of a type that benefits from optical isolation, such as an analog-to-digital converter (ADC). | 11-27-2008 |
| 20090206817 | High Voltage Drive Circuit Employing Capacitive Signal Coupling and Associated Devices and Methods - According to one embodiment, there is provided a high voltage drive circuit comprising drive and sense electrodes formed substantially in a single plane. The device effects signal transfer between drive and receive circuits through the drive and sense electrodes by capacitive means, and permits high voltage devices, such as IGBTs, to be driven thereby without the use of high voltage transistors, thereby eliminating the need to use expensive fabrication processes such as SOI when manufacturing high voltage gate drive circuits and ICs. The device may be formed in a small package using, by way of example, using CMOS or other conventional low-cost semiconductor fabrication and packaging processes. | 08-20-2009 |
| 20090206958 | High Voltage Isolation Semiconductor Capacitor Digital Communication Device and Corresponding Package - According to one embodiment, there is provided a semiconductor digital communication device comprising communication drive and sense electrodes formed in a single plane, where the electrodes have relatively high sidewalls. The relatively high sidewalls permit low electrical field densities to be obtained in the sense and drive electrodes during operation, and further permit very high breakdown voltages to be obtained between the electrodes, and between the drive electrode and an underlying ground plane substrate. The device effects communications between drive and receive circuits through the drive and sense electrodes by capacitive means, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The device may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes. | 08-20-2009 |
| 20090206960 | High Voltage Isolation Dual Capacitor Communication System - According to one embodiment, there is provided a high voltage isolation dual capacitor communication system comprising communication drive and sense electrodes and corresponding first and second capacitors that are formed in two separate devices. The two devices are electrically connected in series to provide a single galvanicly-isolated communication system that exhibits high breakdown voltage performance in combination with good signal coupling. The system effects communications between drive and receive circuits through the first and second capacitors, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The system may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes. | 08-20-2009 |
| 20100213874 | Optocoupler System with Reduced Power Consumption and Pulse Width Distortion - According to one embodiment, there is provided an optocoupler system configured to generate current signals having high, low and no amplitude portions in response to the receipt of logic high and low input signals. The varying amplitude portions of the current signals are used to drive other portions of the isolation circuitry, and result in reduced power consumption and dissipation, as well as reduced pulse width distortion. | 08-26-2010 |
| 20100329363 | Wake-Up Circuits, Devices and Methods for Galvanic Isolators - According to one embodiment, there is provided a method of reducing the amount of power consumed by a galvanic isolator. A transmitter transmits a wake-up signal to a receiver located across an isolation medium when the transmitter is ready or preparing to transmit data or power signals to a receiver, which is operably connected to a sensing circuit. The sensing circuit receives the wake-up signal through the isolation medium, which may be operably connected to and powered substantially continuously or intermittently by a first power source. In response to the sensing circuit receiving the wake-up signal, the receiver is powered up from a sleep mode to an operating mode. After a period of time t | 12-30-2010 |
| Patent application number | Description | Published |
|---|
| 20090073663 | Wrap-around overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly. | 03-19-2009 |
| 20090197478 | Interlocking overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector having a thermoplastic body and electrical conducting elements embedded in and extending through the thermoplastic body to define internal and external connectors, and an overmold body that is mechanically interlocked with protuberances integrally formed on the thermoplastic body of the electrical connector. The mechanical interlocking relationship between the overmold body and the thermoplastic body of the electrical connector eliminates or minimizes delamination problems that could otherwise occur during thermal cycling, reduces or eliminates stringent control on cleanliness and texture of surfaces of the thermoplastic body of the electrical connector that interface with the overmold body, and eliminate or reduce costs associated with overcoming problems associated with delamination during thermal cycling. | 08-06-2009 |
