Choonghwan
Choonghwan Kwon, Seoul KR
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20100237500 | Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site - A semiconductor substrate includes a first conductive layer formed over the semiconductor substrate. The first conductive layer has first and second portions which are electrically isolated during formation of the first conductive layer. A solder resist layer is formed over the first conductive layer and semiconductor substrate. An opening is formed in the solder resist layer to expose the first conductive layer. A seed layer is formed over the semiconductor substrate and first conductive layer within the opening. A second conductive layer is formed over the seed layer within the opening. The opening may expose the second portion of the first conductive layer due to solder resist registration shifting causing a defect condition. The second conductive layer electrically contacts the first and second portions of the first conductive layer. By testing the first and second portions of the first conductive layer, the defect condition can be identified. | 09-23-2010 |
20110298106 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MAGNETIC FILM AND METHOD OF MANUFACTURE THEREOF - An integrated circuit packaging system including: connecting a first integrated circuit device and a package substrate; attaching a support bump to the package substrate; providing a second integrated circuit device having an inner encapsulation; applying a magnetic film on the inner encapsulation of the second integrated circuit device; and mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump. | 12-08-2011 |
Choonghwan Kwon, Seosan-Si KR
Patent application number | Description | Published |
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20080315374 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM - An integrated circuit package-in-package system comprising: connecting a first integrated circuit device and a package substrate; applying a magnetic film over the first integrated circuit device; mounting a second integrated circuit device having an inner encapsulation over the magnetic film; and forming a package encapsulation over the first integrated circuit device, the magnetic film, and the second integrated circuit device. | 12-25-2008 |
Choonghwan Shin, Seoul KR
Patent application number | Description | Published |
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20130148277 | ELECTRONIC DEVICE - Provided is an electronic device. The electronic device include a first panel having a first surface, a second surface facing the first surface, and a hole connecting the first surface to the second surface, a sealing member passing through the hole, the sealing member being exposed to the first and second surfaces, and a second panel coupled to the first or second surface, the second panel contacting the exposed portion of the sealing member. | 06-13-2013 |
20130308282 | MOBILE TERMINAL AND APPARATUS FOR MOLDING BATTERY EQUIPPED THEREIN - A mobile terminal is provided. The mobile terminal includes a front case, a flat panel having a front side facing the front case and a back side, a main printed circuit board supported by the back side of the flat panel, the main circuit printed circuit board having a back side, a battery having a first surface located at a first side thereof and a second surface located at a second side thereof, the battery being located at the back side of the main printed circuit board to form a separation gap between the first curved surface and the back side of the main printed circuit board and at least a portion of an electronic component being mounted on the main printed circuit board and extending into the separation gap. An apparatus for forming a curved battery for the mobile terminal is also provided. | 11-21-2013 |
20140078708 | MOBILE TERMINAL - A mobile terminal including a camera module mounted in a terminal body and configured to capture an image; a frame mounted onto the terminal body to cover at least part of the camera module, the frame having a locking hole; and a cover coupled to the terminal body to cover the frame. Further, the cover includes a locking hook locked in the locking hole to fix a position of the frame when the cover is coupled to the terminal body. | 03-20-2014 |
20140347330 | MOBILE TERMINAL - The present disclose provides a mobile terminal, including a terminal body having a front surface and a rear surface, a front display unit disposed on the front surface and configured to output visual information thereon, and a rear input unit disposed on the rear surface and configured to be manipulated to input a control command, wherein the rear input unit includes a frame installed on a case of the terminal body to be manipulated in a pressing manner, and having a mounting portion, and a rear display mounted onto the mounting portion, and configured to output visual information toward the rear surface, the visual information being related to an event generated in the mobile terminal. | 11-27-2014 |
Choonghwan Yi, Anyang-Si KR
Patent application number | Description | Published |
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20130288604 | METHOD AND SYSTEM FOR BLUETOOTH COMMUNICATION - Disclosed are a Bluetooth communication method and system which enable a Bluetooth device to be connected to other terminals without a pairing process and data to be transmitted through Bluetooth communication when the Bluetooth device is paired with any of a plurality of terminals having the same device information. The Bluetooth communication method includes receiving, by a receiving unit in a central communication server, communication information from a first terminal when the first terminal and a Bluetooth device are paired, transmitting, by a transmitting unit in the central communication server, the communication information to a second terminal having the same device information as the first terminal, and establishing, by the second terminal, a communication channel with the Bluetooth device, without the pairing process, on the basis of the received communication information. | 10-31-2013 |