| Patent application number | Description | Published |
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| 20100297348 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus that can be simply applied to manufacture large-sized display devices on a mass scale and that improves manufacturing yield includes: a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; a barrier wall assembly including a plurality of barrier walls that are arranged in the first direction in order to partition a space between the first nozzle and the second nozzle; and an alignment member including an interval control member that adjusts an interval between the second nozzle and the substrate, and/or an alignment control member that adjusts alignment between the second nozzle and the substrate. | 11-25-2010 |
| 20100307409 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus to form a fine pattern on a large substrate. The thin film deposition apparatus includes a deposition source, a first nozzle that is disposed at a side of the deposition source and includes a plurality of first slits, a second nozzle that is disposed opposite to the deposition source and includes a plurality of second slits, and a second nozzle reinforcement unit that is disposed on the second nozzle and crosses the second nozzle. | 12-09-2010 |
| 20100310759 | METHOD AND APPARATUS FOR CLEANING ORGANIC DEPOSITION MATERIALS - A method of cleaning off organic deposition material accumulated on a mask includes forming an organic deposition material pattern on a substrate using the mask, which includes a plurality of slots, in a deposition chamber including a deposition source; transporting the mask to a stock chamber that is maintained at a vacuum and adjacent to the deposition chamber; and partially cleaning off the organic deposition material accumulated along the boundaries of the slots of the mask in the stock chamber. A system to clean off an organic deposition material accumulated on a mask having a plurality of slots, includes a deposition chamber including a deposition source; and a stock chamber that is maintained at substantially the same vacuum as the deposition chamber and includes a cleaning device that cleans off the organic deposition material accumulated on the mask. | 12-09-2010 |
| 20100310768 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus capable of forming a precise deposition pattern on a large substrate includes a deposition source; a first nozzle disposed at a side of the deposition source having a plurality of first slits; a second nozzle disposed opposite to the first nozzle having a plurality of second slits; and a second nozzle frame bound to the second nozzle so as to support the second nozzle. The second nozzle frame includes two first frame portions spaced apart from each other and disposed in a direction in which the plurality of second slits are arranged, and two second frame portions each connecting the two first frame portions to each other, wherein the second frame portions are curved in the direction in which the plurality of second slits are arranged, so as to form arches. | 12-09-2010 |
| 20100316801 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus that can be simply applied to produce large substrates on a mass scale and that improves manufacturing yield includes a deposition source; a first nozzle that is disposed at a side of the deposition source and includes a plurality of first slits arranged in a first direction; a second nozzle that is disposed opposite to the first nozzle and includes second slits arranged in the first direction; and a barrier wall assembly that is disposed between the first nozzle and the second nozzle in the first direction, and includes barrier walls that partition a space between the first nozzle and the second nozzle into sub-deposition spaces. A distance between the adjacent second slits is different. | 12-16-2010 |
| 20100328197 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND THIN FILM DEPOSITION APPARATUS FOR MANUFACTURING THE SAME - A thin film deposition apparatus that can be used to manufacture large substrates on a mass scale and that improves manufacturing yield, and an organic light-emitting display device manufactured using the thin film deposition apparatus. The organic light-emitting display device includes: a substrate including a plurality of sub-deposition areas arranged parallel to each other; at least one thin film transistor formed on the substrate, the at least one thin film transistor comprising a semiconductor active layer, a gate electrode insulated from the semiconductor active layer, and source and drain electrodes contacting the semiconductor active layer; a plurality of pixel electrodes formed on the thin film transistor; a plurality of organic layers formed on each of the pixel electrodes; and a counter electrode formed on the organic layers, wherein the plurality of organic layers lie in each of the sub-deposition areas and have a larger shadow zone the further a distance from a center of the corresponding deposition area. | 12-30-2010 |
| 20100330265 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus that can be simply applied to manufacture a thin film on a large substrate on a mass scale and that improves manufacturing yield includes a deposition source; a first nozzle disposed at a side of the deposition source and including first slits arranged in a first direction; a second nozzle assembly disposed opposite to the deposition source and including strings arranged in the first direction; and a barrier wall assembly including barrier walls disposed between the first nozzle and the second nozzle assembly to partition a space between the first nozzle and the second nozzle assembly into a plurality of sub-deposition spaces. The second nozzle assembly is movable relative to the target along a plane parallel to a surface of the target, or the target is movable relative to the second nozzle along the plane. | 12-30-2010 |
| 20100330712 | THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE BY USING THE SAME - A thin film deposition apparatus and a method of manufacturing an organic light emitting device (OLED) using the thin film deposition apparatus. The thin film deposition apparatus includes a deposition source; a first nozzle in which a plurality of first slits are formed in one direction; a second nozzle in which a plurality of second slits are formed in the one direction; a second nozzle frame combined with the second nozzle to support the second nozzle; a first barrier wall assembly including a plurality of first barrier walls disposed in the one direction to form a space between the first nozzle and the second nozzle; and a second barrier wall assembly having a plurality of second barrier walls disposed in the one direction and a second barrier wall frame to support the second barrier walls, the second barrier wall assembly disposed at one side of the first barrier wall assembly, wherein the second barrier walls are mounted on the second barrier wall frame in the one direction and the second barrier walls slide on the second barrier wall frame. | 12-30-2010 |
| 20110033619 | THIN FILM DEPOSITION APPARATUS INCLUDING DEPOSITION BLADE - A thin film deposition apparatus includes a deposition source that is disposed opposite to a substrate and holds a deposition material that is vaporized; a first nozzle unit disposed between the substrate and the deposition source and having first slit units arranged in a first direction of the substrate; a second nozzle unit disposed between the first nozzle unit and the substrate and having second slit units arranged in the first direction of the substrate; and at least one barrier member assembly disposed between the first nozzle unit and the second nozzle unit and partitioning the space between the first nozzle unit and the second nozzle unit. A deposition blade is optionally disposed in any space formed between the first nozzle unit and the second nozzle unit during a stand-by mode to prevent the deposition of the deposition material from being deposited onto undesirable regions of the chamber. | 02-10-2011 |
| 20110033621 | THIN FILM DEPOSITION APPARATUS INCLUDING DEPOSITION BLADE - A thin film deposition apparatus for use with a substrate having deposition regions separated by non-deposition regions includes a deposition source, a first nozzle assembly disposed in front of the deposition source, at least one barrier wall assembly disposed in front of the first nozzle assembly, and a second nozzle assembly disposed between the barrier wall assembly and the substrate. At least one deposition blade is disposed between the deposition source and the first nozzle assembly, the first nozzle assembly and the barrier wall assembly, the barrier wall assembly and the second nozzle assembly, or the second nozzle assembly and the substrate. Using the deposition blade, the deposition of the deposition material on the non-deposition regions of the substrate may be minimized during a deposition process. | 02-10-2011 |
| 20110049192 | Apparatus for dispensing resin fluid - A resin fluid dispensing apparatus includes a container arranged to receive a resin fluid, a first connection unit connected to the container, a pressure chamber arranged configured to contain the resin fluid transported from the first volume through the first connection unit from the first volume received into a second volume in a pressure chamber. A pressure unit comprising a pressure plate directly pressurizing the resin fluid in the second volume. A dispenser arranged to receive the pressurized resin fluid transported from the second volume through a second connection unit connected to the pressure chamber. The dispenser dispensing the received pressurized resin fluid through a syringe. | 03-03-2011 |
| 20110068346 | DISPLAY DEVICE - A display device includes a wire substrate including a wire unit for driving the display device, an integrated circuit chip mounted at the wire substrate, and a pad unit extended from the wire unit to be disposed between the wire substrate and the integrated circuit chip. The pad unit is connected to the integrated circuit chip. The pad unit includes a first conductive layer extended from the wire unit, and a second conductive layer disposed on the first conductive layer. The hardness of the second conductive layer is less than the hardness of the first conductive layer. | 03-24-2011 |
| 20110079799 | ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE HAVING THE SAME - An anisotropic conductive film (ACF) is disclosed. The ACF includes a film, an adhesive layer positioned on the film, and one or more conductive balls within the adhesive layer. The conductive balls include a first core part having a first hardness, a second core part covering the first core part and having a second hardness that is greater than the first hardness, and a conductive part covering the second core part, respectively. | 04-07-2011 |
| 20110123707 | THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - A thin film deposition apparatus including a deposition source having a crucible to contain a deposition material and a heater to heat and vaporize the deposition material; a nozzle unit disposed at a side of the deposition source along a first direction and having a plurality of nozzle slits to discharge the deposition material that was vaporized; a plurality of emission coefficient increasing units disposed toward the nozzle unit within the deposition source and increasing a quantity of motion of the deposition material that is discharged toward the nozzle unit; a patterning slit sheet disposed opposite to the nozzle unit and having a plurality of patterning slits arranged along the first direction; and a barrier plate assembly disposed between the nozzle unit and the patterning slit sheet along the first direction, and having a plurality of barrier plates that partition a space between the nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces. | 05-26-2011 |
| 20110129596 | Deposition apparatus and method of manufacturing organic light emitting device using the same - A deposition apparatus that improves deposition characteristics and the uniformity of a deposited layer, and a method of manufacturing an organic light emitting device using the deposition apparatus. The deposition apparatus includes: a base; a heat blocking layer formed on the base; a heat emitting layer patterned into stripes and formed on the heat blocking layer to heat a deposition material to be deposited; and a barrier rib formed and patterned on the heat blocking layer to define a space in which the deposition material is disposed. | 06-02-2011 |
| 20110139357 | MASK, METHOD OF MANUFACTURING MASK AND APPARATUS FOR MANUFACTURING MASK - A method of efficiently manufacturing a large-sized mask is disclosed. In one embodiment, the method includes: 1) providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit and 2) providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit. The method may further include contacting the first bonding unit and the second bonding unit; and connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member. | 06-16-2011 |
| 20110140373 | FRIT SEALING SYSTEM AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY (OLED) APPARATUS USING THE SAME - A frit sealing system and a method of manufacturing an organic light-emitting display (OLED) using the frit sealing system are disclosed. In one embodiment, the frit sealing system includes: a thermal expansion film formed on the second substrate to pressurize the second substrate when heat is applied to the frit and thermal expansion film, wherein the frit is interposed between the first and second substrates and a mask formed on the thermal expansion film. | 06-16-2011 |
