Patent application number | Description | Published |
20090260569 | CHEMICAL VAPOR DEPOSITION APPARATUS - There is provided a chemical vapor deposition apparatus improved in structure such that a reaction gas introduced into a reactor where deposition is performed flows at a substantially uniform rate to ensure a thin film is grown substantially uniformly on the deposition object. The chemical vapor deposition apparatus includes: a chamber; a reactor provided in the chamber to have a deposition object deposited therein; and a reservoir storing a reaction gas fed from the outside to introduce the reaction gas to the reactor, the reservoir having a cross-sectional area changing according to a flow path of the introduced reaction gas. | 10-22-2009 |
20120306296 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor in which an outer rotor provided with a plurality of salient poles protruded at equidistance along an inner peripheral surface thereof; and a stator provided in the outer rotor, provided with a plurality of stator cores including main salient poles protruded toward the salient poles of the outer rotor and including coils wound therearound and auxiliary salient poles positioned at both sides of the main salient poles, and having phase windings in which the coils are wound around the main salient poles are provided, a magnetic flux is bisected in the main salient pole and flows into the auxiliary salient poles of adjacent phase windings, such that a short magnetic flux route is implemented, thereby making it possible to reduce core loss, and a magnet is also provided, thereby making it possible to improve torque characteristics. | 12-06-2012 |
20120306297 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor, including: a rotor provided with a plurality of salient poles protruded along an outer peripheral surface thereof; and a stator including a plurality of stator cores in a pi (Ļ) shape that have the rotor rotatably accommodated therein, are opposite to the plurality of salient poles, and have coils wound therearound, wherein a magnetic flux path is formed along the stator cores in the pi shape and the salient pole opposite thereto. | 12-06-2012 |
20120306298 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor comprising: an outer rotor provided with a plurality of salient poles protruded at equidistance along an inner peripheral surface thereof; and a stator provided in the outer rotor, including a plurality of stator cores including a pair of stator salient poles protruded toward the salient pole of the outer rotor and a stator yoke connecting and supporting stator salient poles to each other, and having phase windings in which coils are wound around the stator salient poles, wherein a magnetic flux generated by applying a current to the phase winding flows through the pair of stator salient poles and the salient pole of the outer rotor. | 12-06-2012 |
20130015741 | TRANSVERSE SWITCHED RELUCTANCE MOTORAANM KIM; Changsung SeanAACI Gyunggi-doAACO KRAAGP KIM; Changsung Sean Gyunggi-do KRAANM CHOI; Chang HwanAACI Gyunggi-doAACO KRAAGP CHOI; Chang Hwan Gyunggi-do KRAANM BAE; Han KyungAACI Gyunggi-doAACO KRAAGP BAE; Han Kyung Gyunggi-do KRAANM LEE; Guen HongAACI SeoulAACO KRAAGP LEE; Guen Hong Seoul KR - Disclosed herein is a transverse switched reluctance motor including: a rotor including a plurality of rotor disks each having a shaft fixedly coupled to an inner portion thereof, having a plurality of rotor poles fixedly coupled thereto along an outer peripheral surface thereof, and arranged in a direction of a shaft; and a stator assembly including a plurality of stators each facing the plurality of rotor poles, having coils wound therearound, and arranged in a circumferential direction of the plurality of rotor disks so that the plurality of rotor disks are rotatably received therein, wherein magnetic flux paths are formed so that magnetic fluxes move in the direction of the shaft by the plurality of stators and the plurality of rotor poles facing the plurality of stators to circulate the stators. | 01-17-2013 |
20130026859 | LINEAR MOTOR - Disclosed herein is a linear motor including: a first stator part including a plurality of stator cores having coils wound therearound multiple times and arranged to be spaced apart from each other by predetermined intervals in a longitudinal direction; a second stator part arranged to be spaced apart from the first stator part by a predetermined interval in a transversal direction so as to face the first stator part and including a plurality of stator cores having coils wound therearound multiple times and arranged to be spaced apart from each other by predetermined intervals in the longitudinal direction so that the second stator part is in parallel with the first stator part; and a mover arranged in an interval formed by the first and second stator parts and moving linearly. | 01-31-2013 |
20130026864 | TRAVERSAL SWITCHED RELUCTANCE MOTOR - Disclosed herein is a transversal switched reluctance motor including: a rotor assembly formed by arranging a plurality of rotors including a rotor pole mounting part having a shaft coupled to an inner portion thereof and a plurality of rotor poles coupled to the rotor pole mounting part along an outer peripheral surface thereof in a direction of the shaft; and a stator assembly including a plurality of stators each including a coil enclosing an outer peripheral surface of the rotor assembly so that the rotor assembly is rotatably received in an inner portion thereof and a plurality of stator cores fitted with the coil from one side direction thereof along an outer peripheral surface thereof to thereby face the plurality of rotor poles, wherein the stator core has a C shaped cross section with respect to the direction of the shaft around which the rotor assembly rotates. | 01-31-2013 |
20130043763 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a shaft rotatably supporting the switched reluctance motor in an axial direction; a cylindrical part provided at a central portion of the shaft and movable vertically; an elastic member formed to enclose the shaft, formed from an upper portion of the shaft to an upper portion of the cylindrical part to thereby support a rise of the cylindrical part, and having elasticity; commutator segments attached to an outer peripheral surface of the cylindrical part and having a cylindrical shape; brushes contacting or not contacting the commutator segments according to vertical movement of the cylindrical part; and a propeller provided on a lower portion of the cylindrical part and pushing air at the to time of rotation to thereby move the cylindrical part upwardly. | 02-21-2013 |
20130057091 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor having a double rotor structure. An out stator salient pole corresponding to an out rotor salient pole is formed to have an āEā shape by sequentially disposing a main salient pole, a first auxiliary salient pole, and a second auxiliary salient pole and an in stator salient pole corresponding to an in rotor salient pole is formed to have a pi (Ļ) shape by sequentially disposing a first salient pole and a second salient pole, such that a magnetic flux path is reduced, thereby making it possible to prevent the loss of magnetic force. | 03-07-2013 |
20130076193 | LAMINATED CORE AND FABRICATION METHOD THEREOF - Disclosed herein is a laminated core used for a motor including an electric motor, wherein the core is formed of a soft magnetic composite and has a structure in which one or more unit laminates are laminated. Since the core is fabricated by laminating soft magnetic composites, the mechanical strength of the core formed of the soft magnetic composites can be improved. | 03-28-2013 |
20130093269 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor in which a shaft of the motor and a shaft of a load are aligned with each other so that maximum torques of the motor and the shaft coincide with each other. | 04-18-2013 |
20130175891 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a rotor part including a rotor core of which a shaft is fixedly coupled to a central portion and a plurality of rotor poles protruding from the rotor core; a stator part including a stator yoke rotatably receiving the rotor part therein and a plurality of stator salient poles protruding from the stator yoke so as to face the rotor poles; and auxiliary rotor poles coupled to outer portions of the rotor poles to rotate integrally with the rotor part. | 07-11-2013 |
20130285584 | MOTOR DRIVING APPARATUS AND METHOD - Disclosed herein are a motor driving apparatus and method. The motor driving apparatus includes: an inverter including a main driver sequentially activating N phases and a spare driver activating a spare phase substituting for a faulted phase among the activated N phases; a detecting unit detecting the respective output signals of the N phases; a switching unit performing switching so that the spare phase is connected to the faulted phase of the exited N phases; and a controlling unit driving the inverter to determine whether or not a fault is generated and control the switching unit so that the faulted phase is connected to the spare phase. Therefore, since the motor may be driven without replacing the inverter, a cost may be reduced, and since the motor may be driven without a change in the number of phases, the motor may be efficiently and stably driven. | 10-31-2013 |
Patent application number | Description | Published |
20120043126 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film. | 02-23-2012 |
20120055901 | SUBSTRATE FABRICATING APPARATUS AND SUBSTRATE FABRICATING METHOD - Disclosed herein are a substrate fabricating apparatus and a substrate fabricating method. The substrate fabricating apparatus includes: a first injector that injects a first etchant to a circuit layer formed as an outermost layer of a base substrate to form first type of ruggedness; and a second injector that injects a second etchant to the circuit layer formed with the first type of ruggedness to form second type of ruggedness. The present invention provides the substrate fabricating apparatus and the substrate fabricating method that inject different etchants to the circuit layer to form different ruggedness, thereby making it possible to widen the specific surface area of the circuit layer to improve adhesion between the circuit layer and the protective layer. | 03-08-2012 |
20120266463 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film. | 10-25-2012 |
20120285924 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads. | 11-15-2012 |
20130175238 | ETCHING SOLUTION AND METHOD OF MANUFACTURING PRINTED WIRING SUBSTRATE USING THE SAME - This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material. | 07-11-2013 |
20140037862 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes. | 02-06-2014 |
Patent application number | Description | Published |
20120060887 | ASYMMETRIC THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates. | 03-15-2012 |
20140083758 | MAGNETIC BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a magnetic board including a composite film including a rigidity film and a ductility film, and a magnetic sheet attached to one surface of the composite film and having fracture lines formed on portions joined with the ductility film. | 03-27-2014 |
20140175702 | DOUBLE-LAYER COMPOSITE METAL POWDER PARTICLE, MANUFACTURING METHOD THEREOF, AND METHOD OF MANUFACTURING SOFT MAGNETIC CORE - There is provided a method of manufacturing a double-layer composite metal powder particle, the method including preparing an iron (Fe)-based powder particle, forming an insulating layer on a surface of the iron (Fe)-based powder particle, and forming a lubricating wax coating layer on the insulating layer. | 06-26-2014 |
Patent application number | Description | Published |
20110121903 | POWER AMPLIFIER - There is provided a power amplifier that can increase power efficiency by preventing power consumption caused by DC components from an RF input signal. A power amplifier according to an aspect of the invention may include: an inverter amplification section amplifying an input signal according to an inverter method to thereby remove DC components from the input signal; an impedance matching section matching an impedance of a transmission path of the input signal amplified by the inverter amplification section; and an amplification section amplifying an impedance-matched signal from the impedance matching section according to a gain set beforehand. | 05-26-2011 |
20110127636 | INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an insulating material, and having an integrated passive device mounted on an upper surface thereof; a conductive pattern disposed inside the mounting part; and a connecting part disposed on the substrate and electrically connected to the integrated passive device. The connecting part and the conductive pattern are electrically connected to the wiring pattern. | 06-02-2011 |
20110156203 | INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly. An integrated passive device assembly according to an aspect of the invention may include: a board having a wiring pattern provided thereon; an integrated passive device mounted on an upper surface of the board and having conductive patterns provided on upper and lower surfaces thereof; a first connection portion electrically connecting the conductive pattern, provided on the upper surface of the integrated passive device, and the wiring pattern to each other; and a second connection portion electrically connecting the conductive pattern, provided on the lower surface of the integrated passive device, and the wiring pattern to each other. | 06-30-2011 |
20110215865 | POWER AMPLIFIER - Disclosed herein is a power amplifier. The power amplifier includes N power amplification means, a transformer, and a harmonic elimination unit. Each of the N power amplification means amplifies an input signal into a predetermined level. The transformer includes N/2 primary windings respectively connected to the output terminals of the power amplification means and a secondary winding configured such that coil elements are connected in series between an output terminal and a ground, and sums power transmitted from the primary windings. The harmonic elimination unit is disposed across both ends of the secondary winding of the transformer, and eliminates the output of the harmonic frequencies of a preset frequency. | 09-08-2011 |
Patent application number | Description | Published |
20130107417 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
20140048750 | CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE AND MULTILAYERED CERAMIC ELECTRONIC COMPONENT CONTAINING THE SAME - There is provided a conductive paste composition for an internal electrode of a multilayered ceramic electronic component including: a metal powder; and a chrome (Cr) or cobalt (Co) powder having a melting point higher than that of the metal powder. In the conductive paste composition for the internal electrode, the sintering shrinkage temperature of the internal electrode may be increased, and the connectivity of the internal electrode may be improved. | 02-20-2014 |
20140111300 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a multilayer ceramic electronic component including: preparing a ceramic body including internal electrodes; forming electrode layers including at least one conductive metal selected from a group consisting of copper (Cu), silver (Ag), palladium (Pd), and platinum (Pt), an alloy thereof, or a coating material and electrically connected to the internal electrodes on external surfaces of the ceramic body; forming nickel (Ni) layers on external surfaces of the electrode layers by a firing method; and forming tin (Sn) layers on external surfaces of the nickel (Ni) layers by a firing method. | 04-24-2014 |
20140125194 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance. | 05-08-2014 |
20140126110 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer | 05-08-2014 |
20140160616 | MULTILAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes having first and second lead-out portions overlapped with each other, respectively, and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out portions, respectively; and an insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out portions, wherein the first lead-out portion has a first overlap increase part of which a forward edge has an inclined surface, and the second lead-out portion has a second overlap increase part of which a forward edge has an inclined surface. | 06-12-2014 |
Patent application number | Description | Published |
20110062801 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator. The linear vibrator includes a casing, a vibration unit, a bracket, a circuit board, a coil unit, a lead wire and a soldering part. The casing defines an internal space therein. The vibration unit is provided in the casing and vibrates upwards and downwards. The bracket supports the casing and the vibration unit. The circuit board is provided on the bracket. An electric circuit and a plurality of electronic devices are provided on the circuit board. The coil unit is mounted to the central portion of the circuit board in a perpendicular direction, so that power is applied from the circuit board to the coil unit. The lead wire extends from the lower end of the coil unit and is electrically connected to the circuit board. The soldering part is formed on the circuit board to connect the lead wire to the circuit board and disposed at a position other than the position corresponding to the direction in which external tension is applied to the circuit board when power is applied to the coil unit. | 03-17-2011 |
20120032534 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator, including: a stator including a coil; and a vibrator including a magnet opposite to the coil, wherein the linear vibrator is linearly vibrated due to electromagnetic induction of the coil and the magnet, the magnet is formed in a disc shape in which a cut part is formed by cutting a portion thereof, a magnetic fluid band is formed on an outer peripheral surface of the magnet, and a portion of the magnetic fluid band is in contact with the coil. According to the present invention, there is provided the linear vibrator capable of suppressing weak vibration generated at the time of external impact or movement, previously preventing noise generated as the vibrator applies an impact to the stator due to excessive vibration, and minimizing attenuation of the linear vibration quantity as the cut part that is formed by cutting a portion of the magnet to form the air gap with the coil. | 02-09-2012 |
20120146433 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator for generating vibration in a mobile communication terminal, a portable terminal, and a photographing apparatus, including: a stator part including a bracket, coils connected to the bracket and a printed circuit board connected to the bracket and applying power to the coils; and a vibrator part configured of a magnet opposite to the coils, a yoke connected to the magnet and a weight body connected to the yoke, wherein the weight body has a cutting part formed by cutting a portion thereof. | 06-14-2012 |
20120169149 | LINEAR VIBRATION MOTOR - Disclosed herein is a linear vibration motor. The motor includes a stator and a vibrator. The stator includes a magnet. The vibrator includes a coil facing the magnet. A weight is coupled to the coil. A PCB is connected to the coil and the stator. An elastic member is coupled to stator and the coil. A damper is provided on the weight at a position facing the elastic member. The damper may be provided between the elastic member and the weight or between the elastic member and the inner surface of a casing. The damper can mitigate metallic high frequency noise attributable to friction between the elastic member and the weight or between the elastic member and the casing. Furthermore, the spatial utilization is increased, thereby enhancing the degree of freedom in designing the linear vibration motor. | 07-05-2012 |
20130033126 | LINEAR VIBRATION DEVICE - Disclosed herein is a linear vibration device including: a stator that includes magnets, a bracket, and a case having an inner space formed therein and coupled to the bracket; and a vibrator that includes a coil facing the magnets, a weight body coupled to the coil, a flexible printed circuit (FPC) coupled to a lower portion of the weight body, and an elastic member having one end coupled to the case and the other end coupled to the coil and is received in the case, wherein the magnets are disposed at a lower portion of the coil of the vibrator and include a first magnet having a magnetic fluid applied to a lower portion thereof and a second magnet facing the first magnet and coupled to an upper side of the case. | 02-07-2013 |
20130140918 | LINEAR VIBRATION MOTOR - Disclosed herein is a linear vibration motor including: a stator part including a magnet; a vibrator part including a coil facing the magnet to generate electromagnetic force and a printed circuit board having one end coupled to the stator part and the other end coupled to the coil; and an elastic member connecting the stator part and the vibrator part to each other, wherein the stator part further includes a damper facing the vibrator part. The damper is made of a rubber material having lower density in order to alleviate and absorb impact at the time of contact with the vibrator part, thereby making is possible to prevent vibration noise due to residual vibration generated at the time of contact between the vibrator part and the stator part. | 06-06-2013 |
20130300255 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module including a vibration plate that is surrounded by an upper case and a lower case, and includes a first stopper capable of preventing direct collision between a piezoelectric element and an internal constituent member, for example, an upper plate while vibrating linearly therein. In particular, the piezoelectric vibration module may further include a second stopper in the lower case. | 11-14-2013 |
20130300256 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module that includes a side damper between a vibration plate with a piezoelectric element and an upper case so as to ensure reliability against external shock applied to the side and narrows a spaced distance between the vibration plate and the upper case. | 11-14-2013 |
20130300261 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module in which piezoelectric elements generating vibration force by repetitively extending and being shrinkingly deformed through application of flat external power are placed symmetrically around the center of a lower plate of a vibration plate. | 11-14-2013 |
Patent application number | Description | Published |
20120018764 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a vertical/horizontal light-emitting diode for a semiconductor. An exemplary embodiment of the present invention provides a semiconductor light-emitting diode comprising: a conductive substrate; a light-emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer sequentially formed over the conductive substrate; a second conductive electrode including a conductive via that passes through the first conductive semiconductor and active layers to be connected with the second conductive semiconductor layer therein, and an electrical connector that extends from the conductive via and is exposed outside the light-emitting structure; a passivation layer for covering a dielectric and at least the side surface of the active layer of the light-emitting structure, the dielectric serving to electrically isolate the second conductive electrode from the conductive substrate, the first conductive semiconductor layer and the active layer; and a surface relief structure formed on the pathway of light emitted from the active layer. According to the present invention, a semiconductor light-emitting diode exhibiting enhanced external light extraction efficiency, especially the diode's side light extraction efficiency, can be obtained. | 01-26-2012 |
20120032218 | SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved. | 02-09-2012 |
20120299042 | SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer. | 11-29-2012 |
Patent application number | Description | Published |
20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
20120319260 | POWER MODULE PACKAGE AND SYSTEM MODULE HAVING THE SAME - Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate. | 12-20-2012 |
20130154069 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a second lead frame that is patterned and bonded to the second semiconductor device; and a second heat dissipation substrate formed on the first lead frame. | 06-20-2013 |
20130154070 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate. | 06-20-2013 |
20140096380 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 04-10-2014 |
Patent application number | Description | Published |
20110024242 | ELECTRO-HYDRAULIC BRAKE SYSTEM - Disclosed herein is an electro-hydraulic brake system. The electro-hydraulic brake system includes a master cylinder having a first cylinder and a second cylinder, a hydraulic power unit to supply brake oil into the respective first and second cylinders, and a first wheel and a second wheel connected respectively to the first cylinder and the second cylinder. The first wheel and the second wheel are independently controlled by hydraulic pressure generated in the first cylinder and the second cylinder. | 02-03-2011 |
20110025121 | ELECTRO-HYDRAULIC BRAKE SYSTEM - Disclosed herein is an electro-hydraulic brake system. The electro-hydraulic brake system includes a master cylinder to transmit brake oil, a high-pressure accumulator to transmit brake oil independently of the master cylinder, first and second circuits connected respectively to the master cylinder, at least one first wheel to be braked by the first circuit, and at least one second wheel to be braked by the second circuit. The first circuit is connected to the high-pressure accumulator, to control the first wheel. The second circuit is connected to the first circuit, to control the second wheel. | 02-03-2011 |
20110074205 | PUMP UNIT FOR ELECTRONICALLY CONTROLLED BRAKE SYSTEM - Disclosed is a pump unit for an electronically controlled brake system. The pump unit is operated by a motor having a shaft to be rotated about a rotating axis, and the shaft includes a concentric shaft portion and an eccentric portion integrally formed with each other. An eccentric bearing is coupled to the concentric shaft portion and a concentric bearing is coupled to the eccentric portion, to reduce hydraulic pulsation during operation of pumps and achieve rapid generation of hydraulic pressure. | 03-31-2011 |
Patent application number | Description | Published |
20100077415 | Chucking device for a disk - A chucking device for a disk including a turntable on which an optical disk is seated, a housing provided on the turntable in such a manner as to be inserted into a center hole of the optical disk, a chuck pin having an end protruding outwards from the housing so that, when the optical disk is inserted into and released from the chuck pin, the chuck pin reciprocates from the center of the optical disk, a spring elastically forcing the end of the chuck pin outwards from the center of the optical disk, and a spring holder provided slantwise on the chuck pin such that the spring is held thereon so that an elastic force of the spring is applied inclined onto the chuck pin acting towards the direction of the turntable. | 03-25-2010 |
20110167439 | SLIP PREVENTION MEMBER FOR TURNTABLES - Disclosed herein is a slip prevention member for a turntable. A friction layer prevents a slip of a disk placed on an upper surface thereof. A hardness reinforcing layer is provided under the lower surface of the friction layer. An adhesive layer is provided under the lower surface of the hardness reinforcing layer. A releasable sheet is attached to the lower surface of the adhesive layer. The slip prevention member reduces use of environmentally toxic material and uses the hardness reinforcing layer, thus preventing occurrence of vibrations and noise which may be induced when the hardness of the slip prevention member is relatively low. | 07-07-2011 |
20130049546 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft insertedly mounted so as to be perpendicular to an upper side portion; a sleeve receiving the shaft therein to thereby rotatably support the shaft and forming a space between the sleeve and the shaft to thereby be spaced apart from the shaft so as not to contact the shaft; a holder having the sleeve mounted in an inner portion thereof and having a lower portion mounted on an upper portion of a plate; and the plate integrally supporting lower portions of the shaft and the sleeve and including connecting parts connecting the holder and the plate to each other and fixing parts fixing positions of the holder and the plate so that a lower surface of the holder is coupled thereto. | 02-28-2013 |
20130069466 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a bearing receiving the shaft therein to thereby rotatably support the shaft; a bearing holder having the bearing mounted therein; an armature including a core stacked on an outer diameter of the bearing holder and a coil wound around the core; a rotor case having a magnet mounted therein so as to rotate by electromagnetic force with the armature and mounted on an outer diameter of the shaft; and an electromagnet selectively mounted on the armature or the bearing holder so as to face the rotor case, thereby preventing floating or separation of the rotor case by attractive force. | 03-21-2013 |
20130119797 | SPINDLE MOTOR - Disclosed herein is a spindle motor in which a space part is formed between a shaft and a rotor case and a hooker part and a fixing part coupled to each other are formed at a bearing holder and a rotor case, respectively, thereby making it possible to easily prevent floating of a rotor without using a separate component. | 05-16-2013 |
20130147300 | SPINDLE MOTOR - Disclosed herein is a spindle motor. The spindle motor includes a main magnet formed to have an asymmetrical cross section without a pulling magnet according to the prior art that has been installed on an upper end of a core in order to prevent floating of a rotor, such that the main magnet may prevent the floating of the rotor instead of the pulling magnet. | 06-13-2013 |
20130162079 | SPINDLE MOTOR - Disclosed herein is a spindle motor. In the spindle motor according to the present invention, a thrust part is disposed at a lower portion of a shaft, and a support part surface-contacting a lower end of the shaft is formed at the thrust part so as to have a round shape, thereby making it possible to easily prevent a wobble phenomenon of a rotor due to a gap in a shaft system. In addition, a guide part is formed to be protruded at the thrust part to lock the shaft including a narrow part formed therein, thereby making it possible to easily prevent floating of the rotor. | 06-27-2013 |