Patent application number | Description | Published |
20100149648 | Method of extrusion molding prism film and prism film manufactured by the same - A method of extrusion molding a prism film and a prism film manufactured by the same, the method including providing a molten film, simultaneously forming a prism pattern and an embossed pattern on opposite surfaces of the molten film by passing the molten film through a gap between a prism roll and an emboss roll, and cooling the molten film having the prism pattern and the embossed pattern on opposite surfaces thereof. | 06-17-2010 |
20110116014 | OPTICAL LAMINATE FILM, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - An optical laminate film, a backlight unit, and a liquid crystal display module, the optical laminate film including a multilayer film composed of multiple layers including at least two polymers having different refractive indexes, the multilayer film transmitting only a light component vibrating in a direction parallel to one transmittance axis while reflecting other light components; an embossed diffusing film laminated on one side of the multilayer film, the embossed diffusing film having roughness on a surface thereof; and a microlens film laminated on another side of the multilayer film, the microlens film having microlenses arranged on a surface thereof. | 05-19-2011 |
20110164321 | DIFFUSING FILM HAVING MICRO LENS PATTERN AND EMBOSSED PATTERN - A diffusing film may have a microlens pattern and an embossed pattern on the surface thereof. The diffusing film includes a light entrance plane for receiving incident light, a light exit plane opposite the light entrance plane, the light exit plane for transmitting light, a plurality of microlenses on a surface of the light exit plane of the diffusing film, microlenses of the plurality of microlenses being spaced apart from one another, and a separation plane between the plurality of microlenses, the separation plane having an embossed pattern on a surface thereof. | 07-07-2011 |
20120252947 | POLYCARBONATE RESIN COMPOSITION FOR FLAME RETARDANT FILM, FLAME RETARDANT FILM INCLUDING THE RESIN COMPOSITION AND METHOD FOR PRODUCING THE FLAME RETARDANT FILM - A polycarbonate resin composition for a flame retardant film includes 100 parts by weight of a polycarbonate resin, about 0.01 to about 10 parts by weight of a silicon compound, about 0.01 to about 1.5 parts by weight of an organic sulfonic acid metal salt having an average particle diameter of about 100 to about 400 μm, and about 0.01 to about 1 part by weight of a polyfluoroethylene resin. | 10-04-2012 |
Patent application number | Description | Published |
20100099043 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent. | 04-22-2010 |
20110003248 | Positive photosensitive resin composition - A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage. | 01-06-2011 |
20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
20110159428 | Positive Type Photosensitive Resin Composition - This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51. | 06-30-2011 |
20110171578 | Positive Photosensitive Resin Composition - A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes. | 07-14-2011 |
20120156614 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same - Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same. | 06-21-2012 |
20120156616 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. | 06-21-2012 |
20120156622 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same - An ortho-nitrobenzyl ester compound including a compound represented by Chemical Formula 1, and a positive photosensitive resin composition including the same are provided. | 06-21-2012 |
20120171609 | Positive Photosensitive Resin Composition, Photosensitive Resin Layer Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Layer - Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided. | 07-05-2012 |
20120171610 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film. | 07-05-2012 |
20120171614 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same. | 07-05-2012 |
20130137036 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film. | 05-30-2013 |
20130164682 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. | 06-27-2013 |
20130171563 | Photosensitive Novolac Resin, Positive Photosensitive Resin Composition Including Same, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R | 07-04-2013 |
20130171564 | Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same - Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. | 07-04-2013 |
20130171568 | Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same. | 07-04-2013 |
20140170562 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm. | 06-19-2014 |
20140319421 | Photosensitive Resin Composition and Color Filter Using the Same - Disclosed are a photosensitive resin composition including a composite dye that includes a red fluorescent dye re-emitting light at a 400 to 800 nm fluorescent wavelength; and a metal complex dye including at least one metal ion selected from Mg, Ni, Co, Zn, Cr, Pt, and Pd, and a color filter using the same. | 10-30-2014 |
Patent application number | Description | Published |
20130040123 | ADHESIVE COMPOSITION, ADHESIVE FILM INCLUDING THE SAME, METHOD OF PREPARING ADHESIVE FILM, AND DISPLAY MEMBER USING THE SAME - A UV curable adhesive composition includes a morpholine group-containing (meth)acrylic copolymer. | 02-14-2013 |
20130345333 | ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND OPTICAL MEMBER INCLUDING THE SAME - An adhesive film, an adhesive composition for the same, and an optical member including the same, the adhesive film having an index of refraction of about 1.48 or more and a dielectric constant variation of about 30% or less, as expressed by Equation 1: | 12-26-2013 |
20140000482 | ADHESIVE COMPOSITION FOR POLARIZING PLATE, POLARIZING PLATE USING THE SAME, AND OPTICAL MEMBER INCLUDING THE SAME | 01-02-2014 |
20140099495 | ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY MEMBER INCLUDING THE SAME - An adhesive film includes a cured product of a (meth)acrylic copolymer and has a refractive index from about 1.5 to about 1.6. An adhesive composition for preparing the adhesive film includes a (meth)acrylic copolymer of a monomer mixture. A display member includes the adhesive film coated on one or more surfaces of an optical film. | 04-10-2014 |
20140161995 | ACRYLIC ADHESIVE COMPOSITION, POLARIZING PLATE, AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - An acrylic adhesive composition includes: an acrylic resin; an epoxy resin; and a cationic photoinitiator, the acrylic adhesive composition having a storage modulus of about 6×10 | 06-12-2014 |
20140162057 | ADHESIVE COMPOSITION, ADHESIVE FILM INCLUDING THE SAME, METHOD OF PREPARING ADHESIVE FILM, AND DISPLAY MEMBER USING THE SAME - A display member includes a display panel, a first adhesive film on the display panel a transparent conductive layer on the first adhesive film, and a second adhesive film and a window on the second adhesive film. At least one of the first adhesive film and the second adhesive film includes a UV curable adhesive composition including a morpholine group-containing (meth)acrylic copolymer. | 06-12-2014 |
20140184053 | ADHESIVE FILM AND OPTICAL DISPLAY INCLUDING THE SAME - An adhesive film and an optical display including the same. The adhesive film has a tan δ of about 0.12 to about 0.4 upon frequency sweep testing under conditions of a strain of 5%, 30° C. and 1 rad/s, and a tan δ of about 0.2 to about 0.7 upon frequency sweep testing under conditions of a strain of 5%, 30° C. and 100 rad/s. | 07-03-2014 |
20140186603 | ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY MEMBER INCLUDING THE SAME - An adhesive film, an adhesive composition for the same, and a display member including the same are disclosed. The adhesive film includes a cured product of an adhesive composition, which includes a (meth)acrylic copolymer formed from a monomer mixture including (a1) an alkyl (meth)acrylate having a C | 07-03-2014 |
20140186604 | ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME - An adhesive film, an adhesive composition for the same, and a display apparatus including the same. The adhesive film includes a urethane functional group, has a glass transition temperature (Tg) of about 30° C. or less, a loss modulus of about 4×10 | 07-03-2014 |
20140205827 | ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME - An adhesive film including a compound including a urethane functional group, the adhesive film having a ratio (B/A) of 180° peel strength (B) after leaving the adhesive film at 70° C. for 2 minutes to 180° peel strength (A) at 25° C. of about 5 or more, is disclosed. A display apparatus including the adhesive film is also disclosed. | 07-24-2014 |
20140315019 | ADHESIVE FILM HAVING A PHASE DIFFERENCE, METHOD FOR MANUFACTURING SAME, AND OPTICAL MEMBER INCLUDING SAME - According to the present invention, an adhesive film having a phase-difference is characterized by a phase difference value of 25° C./55% RH at a thickness of 20 μm being approximately 20 nm to approximately 150 nm, and 1 rad/s storage modulus by a frequency seep test at 30° C. being approximately 10 | 10-23-2014 |
20150315425 | ADHESIVE FILM AND OPTICAL DISPLAY INCLUDING THE SAME - An adhesive film and an optical display, the adhesive film being prepared from an adhesive composition that includes a (meth)acrylic copolymer, wherein the adhesive film has an elongation of about 750% to about 3,000%, and satisfies the following Equation 1: | 11-05-2015 |
Patent application number | Description | Published |
20090108755 | Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods - A composition for fabricating an electrode includes an organic binder and a conductive filler. About 3 to about 60 wt. % of the composition is the organic binder, about 5 to about 95 wt. % of the composition is the conductive filler, the conductive filler includes predominantly aluminum, the conductive filler has a flake shape, and the conductive filler has an average thickness of about 0.05 μm to about 0.75 μm. | 04-30-2009 |
20090134767 | Composition for Electrodes Comprising Aluminum Powder Having Controlled Particle Size Distribution and Size, and Electrodes Made Using the Same - Disclosed herein is a composition for electrodes that enables a firing process in air at a temperature of 600° C. or less and does not cause an increase in absolute resistance and a substantial variation of the resistance even when the composition is repeatedly subjected to the firing process. The composition for electrodes comprises: about 5 to about 95% by weight of aluminum powder, the aluminum powder having a particle size distribution of about 2.0 or less as expressed by the following Equation (1) and having D50 in the range of about 0.1 μm≦D50≦about 20 μm; about 3 to about 60% by weight of an organic binder; and the balance of a solvent: | 05-28-2009 |
20110140054 | COMPOSITION FOR PREPARING BUS ELECTRODE AND PLASMA DISPLAY PANEL INCLUDING ELECTRODE PREPARED THEREFROM - An example embodiment is directed to a composition for preparation of an electrode, including: a conductive material, the conductive material including Ni, Ag, and ITO, an organic binder, a glass fit, and a black pigment. | 06-16-2011 |
20110273086 | Composition for Electrodes Comprising Aluminum Powder Having Controlled Particle Size Distribution and Size, and Electrodes Made Using the Same - Disclosed herein is a composition for electrodes that enables a firing process in air at a temperature of 600° C. or less and does not cause an increase in absolute resistance and a substantial variation of the resistance even when the composition is repeatedly subjected to the firing process. The composition for electrodes comprises: about 5 to about 95% by weight of aluminum powder, the aluminum powder having a particle size distribution of about 2.0 or less as expressed by the following Equation (1) and having D50 in the range of about 0.1 μm≦D50≦about 20 μm; about 3 to about 60% by weight of an organic binder; and the balance of a solvent: | 11-10-2011 |
Patent application number | Description | Published |
20100330780 | MULTI-FUNCTION TAPE FOR A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer. | 12-30-2010 |
20110152394 | ADHESIVE COMPOSITION FOR STEALTH DICING OF SEMICONDUCTOR, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE INCLUDING THE ADHESIVE FILM - An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic epoxy resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent. | 06-23-2011 |
20140186715 | METHOD FOR MANUFACTURING SEPARATOR, SEPARATOR, AND BATTERY USING SEPARATOR - A method for manufacturing a polyolefin-based porous separator includes forming a sheet containing a polyolefin-based resin and a diluent, extracting the diluent from the sheet by using an extracting apparatus, and forming a separator by drying the extracted sheet using a drying apparatus provided with an inlet. The shortest distance between an outlet of the extracting apparatus and an inlet of the drying apparatus may be 100 mm or less. | 07-03-2014 |
Patent application number | Description | Published |
20130127038 | SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM - A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer. | 05-23-2013 |
20130213691 | ELECTRONIC DEVICE - An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1. | 08-22-2013 |
20140034882 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, wherein the anisotropic conductive film has an electrical conductivity of more than 0 μS/cm to about 100 μS/cm. | 02-06-2014 |
20140042374 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm. | 02-13-2014 |
Patent application number | Description | Published |
20100056700 | Environmentally-Friendly Polylactic Acid Resin Composition - An environmentally-friendly polylactic acid resin composition includes (A) a mixed resin including (a1) a polylactic acid (PLA) resin and (a2) a polycarbonate resin, and (B) a compatibilizer capable of forming a stereo-complex with the polylactic acid resin. According to the present invention, the polylactic acid resin composition is environmentally-friendly and has excellent appearance and improved welding impact strength, as well as improved mechanical strength and heat resistance. Accordingly, it can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example electronic parts, office machines, miscellaneous goods, and the like. | 03-04-2010 |
20100160499 | Polylactic Acid/Polycarbonate Resin Composition and Molded Product Using the Same - Disclosed is a polylactic acid/polycarbonate resin composition including (A) about 100 parts by weight of a mixed resin including: (a1)) about 10 to about 90 wt % of a polycarbonate resin and (a2) about 10 to about 90 wt % of a polylactic acid resin; (B) about 1 to about 50 parts by weight of a flame retardant based on about 100 parts by weight of the mixed resin; (C) about 1 to about 30 parts by weight of an acryl-based copolymer based on about 100 parts by weight of the mixed resin; and (D) about 1 to about 20 parts by weight of an impact-reinforcing agent based on about 100 parts by weight of the mixed resin. | 06-24-2010 |
20100160559 | Polylactic Acid/Polycarbonate Resin Composition and Molded Product Made Using the Same - Disclosed is a polylactic acid/polycarbonate resin composition including (A) a mixed resin including (a1) a polycarbonate resin and (a2) a polylactic acid resin, and (B) a modified acrylic-based resin, and a molded product made using the same. | 06-24-2010 |
20100261844 | Thermoplastic Resin Composition and Molded Product Made Therefrom - A thermoplastic resin composition includes a polycarbonate resin, a low molecular weight polymethyl(meth)acrylate resin, and a core-shell graft copolymer, and the low molecular weight polymethyl(meth)acrylate resin has a weight average molecular weight ranging from 5000 to 30,000. The thermoplastic resin composition can have excellent scratch resistance, impact resistance, and transparency, and accordingly can be used in various molded products such as external parts of electronics, external materials of a car, and the like, which can simultaneously require scratch and impact resistance and transparency. | 10-14-2010 |
20120157606 | Polyamide Resin Composition and Molded Product Using the Same - Disclosed are a polyamide resin composition that includes (A) a crystalline polyamide mixed resin including an aliphatic group and at least two different crystalline polyamide resins, (B) a non-crystalline polyamide resin including an aromatic group, and (C) a glass fiber, and a molded product manufacture using the same. | 06-21-2012 |
20120172515 | Polyphenylene Ether Thermoplastic Resin Composition - Polyphenylene ether thermoplastic resin compositions are formed by adding a polyamide resin to a composition of a polyphenylene ether resin and a polystyrene resin. The composition can have improved heat deflection temperature while maintaining fluidity of polyphenylene ether. | 07-05-2012 |
20120264869 | Thermoplastic Resin Composition and Molded Product Using the Same - Provided are a thermoplastic resin composition including a thermoplastic resin and a metal particle obtained by punching that has a ratio of thickness relative to long diameter of about 1:7 to about 1:1, and a molded product using the same. | 10-18-2012 |
20120270988 | Thermoplastic Resin Composition and Molded Product Using the Same - Provided are a thermoplastic resin composition including a thermoplastic resin and an amorphous sheet-shaped metal particle having a ratio of thickness relative to long diameter of about 1:20 to about 1:1, and a molded product using the same. | 10-25-2012 |
20130231437 | Thermoplastic Resin Composition and Molded Products Thereof - The present invention relates to a thermoplastic resin composition, comprising: a base resin comprising (A) a polyphenylene ether resin and (B) an aromatic vinyl-based resin, and (C) glass fibers, wherein the (C) glass fibers include (C1) chopped glass fibers and (C2) milled glass fibers. | 09-05-2013 |
20140187686 | Thermoplastic Resin Composition and Molded Product Including Same - A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin. | 07-03-2014 |
20150187457 | Electroconductive Polyamide/Polyphenylene Ether Resin Composition, Method for Preparing the Same and Molded Product for Vehicle Using the Same - Provided herein is an electroconductive polyamide/polyphenylene ether resin composition, a method for preparing the same, and a molded product for vehicle manufactured using the same. The composition includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d), wherein a pH of the electroconductive filler (d) is about 4 to about 8. | 07-02-2015 |
20150187458 | Electroconductive Polyamide/Polyphenylene Ether Resin Composition and Molded Product for Vehicle Using the Same - An electroconductive polyamide/polyphenylene ether resin composition and a molded product for vehicle manufactured using the same includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d). The electroconductive filler (d) includes aromatic compounds having molecular weights of about 120 to about 1,000 g/mol, wherein the aromatic compounds are byproducts generated when preparing the electroconductive filler (d). | 07-02-2015 |
Patent application number | Description | Published |
20090155717 | Photosensitive Resin Composition with Good Stripper-Resistance for Color Filter and Color Filter Formed Using the Same - The present invention relates to a photosensitive resin composition for a color filter, which has an excellent stripper-resistance and is developed by an alkali aqueous solution, and a color filter formed of the photosensitive resin composition. The photosensitive resin composition includes: (A) a carboxyl-containing acryl-based binder resin; (B) a double bond-containing acryl carboxylate resin represented by the following Formula 1; (C) an acryl-based photopolymerization monomer; (D) a photopolymerization initiator; (E) a pigment; and (F) a solvent. The photosensitive resin composition has excellent stripper resistance, and thus can be used when a color filter is fabricated on a TFT array substrate in order to ensure a high aperture ratio. | 06-18-2009 |
20110305980 | Blue Color Resin Composition for Color Filter and Color Filter Using the Same - Disclosed is a blue resin composition for a color filter that includes a colorant including an azaporphyrin-based dye and a blue pigment, an acrylic-based binder resin, a reactive unsaturated compound, a polymerization initiator, and a solvent. | 12-15-2011 |
20120112140 | Photosensitive Resin Composition for Color Filter and Color Filter Using Same - A photosensitive resin composition for a color filter and a color filter using the same are provided. The photosensitive resin composition for a color filter includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent. | 05-10-2012 |
20120112141 | Photosensitive Resin Composition for Color Filter and Color Filter Using Same - Disclosed are a photosensitive resin composition for a color filter and a color filter including the same. The photosensitive resin composition for a color filter may include (A) an acrylic-based copolymer including a structural unit represented by the following Chemical Formula 1 and a structural unit represented by the following Chemical Formula 2; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent. | 05-10-2012 |
20130137039 | Photosensitive Resin Composition for Color Filter and Color Filter Prepared Using the Same - Disclosed are a photosensitive resin composition for a color filter that includes a colorant including a phthalocyanine-based compound represented by the following Chemical Formula 1 and a triarylmethane-based compound represented by the following Chemical Formula 2, wherein the substituents of Chemical Formulas 1 and 2 are the same as same as defined in the detailed description, and a color filter prepared using the same. | 05-30-2013 |
20130141810 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed is a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye-polymer composite including a structural unit derived from the compound represented by the following Chemical Formula 1, wherein each substituent is the same as defined in the detailed description; (B) an acryl-based photopolymerizable monomer; (C) a photopolymerization initiator; and (D) a solvent. | 06-06-2013 |
20130164678 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye-polymer composite including a structural unit derived from a compound represented by the following Chemical Formula 1; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; and (D) a solvent. | 06-27-2013 |
20140103269 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - A photosensitive resin composition for a color filter includes (A) a dye polymer composite including a repeating unit derived from a compound represented by the following Chemical Formula 1, (B) an acrylic-based photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a solvent, and a color filter using the same. | 04-17-2014 |
20140175346 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed is a photosensitive resin composition for a color filter including (A) a dye-polymer composite wherein the dye includes a repeating unit derived from a compound represented by the following Chemical Formula 1; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent. | 06-26-2014 |
20150034886 | Photosensitive Resin Composition and Color Filter Using the Same - A photosensitive resin composition for a color filter includes (A) a dye including a cation moiety represented by the following Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the detailed description; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) an acrylic-based binder resin; and (E) a solvent, and a color filter using the same. | 02-05-2015 |
Patent application number | Description | Published |
20120154721 | OPTICAL FILTER AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - An optical filter includes a non-crystalline film, a protective coating layer on one side of the non-crystalline film, and a print layer on another side of the non-crystalline film, the other side being opposite to the one side, wherein the print layer is secured to a substrate. | 06-21-2012 |
20130158153 | THERMAL TRANSFER FILM - A thermal transfer film and a method of manufacturing an OLED display, the thermal transfer film including a light to heat conversion layer, the light to heat conversion layer being formed of a composition including carbon black having an oil absorption number (OAN) of about 50 cc/100 gram to about 120 cc/100 gram and a mean particle size of about 40 nm to about 200 nm; and a binder. | 06-20-2013 |
20130171379 | THERMAL TRANSFER FILM AND ORGANIC ELECTROLUMINESCENT DISPLAY MANUFACTURED USING THE SAME - A thermal transfer film and an organic electroluminescent display manufactured using the thermal transfer film, the thermal transfer film including a base layer; and a transfer enhancement layer having a surface energy of about 25 dyne/cm or less. | 07-04-2013 |
20140023801 | THERMAL TRANSFER FILM AND ORGANIC ELECTROLUMINESCENT DEVICE PREPARED USING THE SAME - A thermal transfer film includes a base layer, and a light-to-heat conversion layer on the base layer, the light-to-heat conversion layer including at least one of particles selected from tungsten oxide particles and composite tungsten oxide particles, the particles being present in an amount of about 20 wt % to about 65 wt % in the light-to-heat conversion layer. | 01-23-2014 |
20150030884 | METHOD FOR EVALUATING DISPERSION OF MATERIAL FOR LIGHT TO HEAT CONVERSION IN THERMAL TRANSFER FILM AND THERMAL TRANSFER FILM USING THE SAME - A method for evaluating dispersion of a light-to-heat conversion material in a thermal transfer film includes calculating optical densities OD1 and OD2 of the thermal transfer film according to Equations 2 and 3, and calculating a dispersion evaluation value ΔOD according to Equation 1. The thermal transfer film has good dispersion of the light-to-heat conversion material when the dispersion evaluation value ΔOD is 0.1 or less, and the thermal transfer film has poor dispersion of the light-to-heat conversion material when the dispersion evaluation value ΔOD is greater than 0.1. | 01-29-2015 |
20150333259 | THERMAL TRANSFER FILM, METHOD FOR MANUFACTURING SAME, AND ORGANIC ELECTROLUMINESCENT DEVICE MANUFACTURED THEREFROM - The present invention relates to a thermal transfer film comprising: a photothermal conversion layer; and a diffusion member formed on the upper surface of said photothermal conversion layer, wherein the diffusion member is a thermal transfer film having about 10% or more of the haze, and also relates to a method for manufacturing same, and to an organic electroluminescent device manufactured using said method. | 11-19-2015 |
20150333260 | THERMAL TRANSFER FILM, METHOD FOR MANUFACTURING SAME, AND ORGANIC ELECTROLUMINESCENT ELEMENT MANUFACTURED BY USING THERMAL TRANSFER FILM - The present invention relates to a thermal transfer film, a method for manufacturing the same, and an organic electroluminescent element manufactured by using the thermal transfer film, and the thermal transfer film comprises: a base film; a photothermal conversion layer formed on the upper part of the base film; and a coating layer formed on the lower part of the base film. | 11-19-2015 |
20150336412 | THERMAL TRANSFER FILM, AND ORGANIC ELECTROLUMINESCENT DEVICE PREPARED USING SAME - The present invention relates to a thermal transfer film comprising: a base layer; and a light-to-heat conversion layer which is laminated on top of the base layer and includes a first layer laminated on top of the base layer and a second layer laminated on top of the first layer in the thickness direction, wherein light-to-heat conversion materials are more omnipresent in the first layer than the second layer. The present invention also relates to an organic electroluminescent device prepared using said film. | 11-26-2015 |
20150360496 | THERMAL TRANSFER FILM, AND ORGANIC ELECTROLUMINESCENT DEVICE PREPARED USING SAME - The present invention relates to a thermal transfer film and to an organic electroluminescent device prepared using same, wherein the thermal transfer film includes a base film and an outermost layer which is formed on the base film and has 2% or more of a thickness change ratio expressed by formula 1. | 12-17-2015 |
20150375551 | HEAT TRANSFER FILM AND ORGANIC ELECTROLUMINESCENT ELEMENT MANUFACTURED USING SAME - The present invention relates to a heat transfer film and an organic electroluminescent element manufactured using the same. More specifically, the present invention relates to: a heat transfer film comprising a base film and an outermost layer formed on the base film, wherein a ratio of an elastic modulus of the outermost layer to an elastic modulus of the base film at 25° C. and relative humidity of 45% is approximately 1 or more; and an organic electroluminescent element manufactured using the same. | 12-31-2015 |
Patent application number | Description | Published |
20080297702 | Light Emitting Diode Package and Driving Method Thereof - A light emitting diode package according to an embodiment of the present invention includes a plurality of red LEDs, green LEDs and blue LEDs arranged for emitting a white light using a color mixing, at least one white LED emitting the white light and a printed circuit board having a circuit pattern for driving the plurality of red LEDs, green LEDs, blue LEDs, and white LEDs. | 12-04-2008 |
20120223901 | METHOD OF MANUFACTURING TRANSPARENT CIRCUIT SUBSTRATE FOR TOUCH SCREEN - Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines. | 09-06-2012 |
20120306791 | TRANSPARENT ADHESIVE UNIT AND TOUCH SCREEN HAVING THE SAME - A transparent adhesive unit for a touch screen is provided. The transparent adhesive unit includes a transparent film, a noise-blocking layer located on a first surface of the transparent film and formed of a conductive material, a first adhesive layer located on a surface of the noise-blocking layer, and a second adhesive layer located on a second surface of the transparent film, in which the second surface is positioned in opposition to the first surface. | 12-06-2012 |
20130057497 | TOUCH SCREEN, TRANSPARENT CIRCUIT BOARD FOR TOUCH SCREEN, AND METHOD FOR FABRICATING TOUCH SCREEN - Provided is a method for fabricating a transparent circuit board for a touch screen. The transparent circuit board includes a transparent substrate that has a conductive bridge layer deposited thereon. A liquid insulating layer is deposited on the transparent substrate and the bridge layer, and a sensor layer having first and second conductive patterns is deposited on the transparent substrate and the insulating layer. | 03-07-2013 |
20140362311 | METHOD OF MANUFACTURING TRANSPARENT CIRCUIT SUBSTRATE FOR TOUCH SCREEN - Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines. | 12-11-2014 |
Patent application number | Description | Published |
20140175669 | METHOD FOR FORMING A DUAL DAMASCENE STRUCTURE OF A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR DEVICE THEREWITH - Forming a dual damascene structure includes forming a first insulation layer and a second insulation layer, forming a resist mask, forming a via hole down to a lower end of the first insulation layer, forming a hardmask layer in the via hole and on the second insulation layer using a spin-coating method, forming a resist mask, forming a first trench hole down to a lower end of the second insulation layer, respectively removing a part of the hardmask layer in the via hole and a part of the hardmask layer on the second insulation layer, forming a second trench hole by removing a part of the first insulation layer between a top corner of the hardmask layer remaining in the via hole and a bottom corner of the first trench hole, removing the hardmask layer, and filling the via hole and the second trench hole with a conductive material. | 06-26-2014 |
20140183701 | HARDMASK COMPOSITION AND METHOD OF FORMING PATTERNS AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE PATTERNS - A hardmask composition includes a monomer represented by the following Chemical Formula 1 and an aromatic ring-containing polymer, | 07-03-2014 |
20140186775 | MONOMER FOR HARDMASK COMPOSITION AND HARDMASK COMPOSITION INCLUDING THE MONOMER AND METHOD OF FORMING PATTERNS USING THE HARDMASK COMPOSITION - A monomer for a hardmask composition is represented by the following Chemical Formula 1, | 07-03-2014 |
20140186777 | MONOMER FOR HARDMASK COMPOSITION AND HARDMASK COMPOSITION INCLUDING THE MONOMER AND METHOD OF FORMING PATTERNS USING THE HARDMASK COMPOSITION - A monomer for a hardmask composition represented by the following Chemical Formula 1, | 07-03-2014 |
20140315367 | RINSE LIQUID FOR INSULATING FILM AND METHOD OF RINSING INSULATING FILM - A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1: | 10-23-2014 |
20140335447 | COMPOSITION FOR HARDMASK, METHOD OF FORMING PATTERNS USING THE SAME, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE PATTERNS - A composition for a hardmask including copolymer including repeating units represented by Chemical Formulae 1 and 2 and a solvent, a method of forming a pattern using the same, and a semiconductor integrated circuit device including a pattern formed using the method are provided. | 11-13-2014 |
20140342273 | MONOMER FOR A HARDMASK COMPOSITION, HARDMASK COMPOSITION COMPRISING THE MONOMER, AND METHOD FOR FORMING A PATTERN USING THE HARDMASK COMPOSITION - Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern using the same. | 11-20-2014 |
20150008212 | MONOMER FOR HARDMASK COMPOSITION, HARDMASK COMPOSITION INCLUDING MONOMER, AND PATTERN FORMING METHOD USING HARDMASK COMPOSITION - Disclosed are a monomer for a hardmask composition represented by the Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern. | 01-08-2015 |