Patent application number | Description | Published |
20090004802 | METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER - A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness. | 01-01-2009 |
20090253242 | Method of Fabricating Non-Volatile Memory Device - A method of fabricating a non-volatile memory device includes: forming a tunnel insulation layer pattern and a floating gate electrode layer pattern over a semiconductor substrate; forming an isolation trench by etching an exposed portion of the semiconductor substrate so that the isolation trench is aligned with the tunnel insulation layer pattern and the floating gate electrode layer pattern; forming an isolation layer by filling the isolation trench with a filling insulation layer; forming a hafnium-rich hafnium silicon oxide layer over the isolation layer and the floating gate electrode layer pattern; forming a hafnium-rich hafnium silicon oxynitride layer by carrying out a first nitridation on the hafnium-rich hafnium silicon oxide layer; forming a silicon-rich hafnium silicon oxide layer over the hafnium-rich hafnium silicon oxynitride layer; forming a silicon-rich hafnium silicon oxynitride layer by carrying out a second nitridation on the silicon-rich hafnium silicon oxide layer; and forming a control gate electrode layer over the silicon-rich hafnium silicon oxynitride layer. | 10-08-2009 |
20090273018 | NONVOLATILE MEMORY DEVICE WITH MULTIPLE BLOCKING LAYERS AND METHOD OF FABRICATING THE SAME - A nonvolatile memory device with a blocking layer controlling the transfer of electric charges in a charge storage layer includes the blocking layer having a first blocking layer in contact with the charge storage layer and a second blocking layer over the first blocking layer, wherein the first blocking layer has a greater energy band gap than the second blocking layer and the second blocking layer has a greater permittivity than the first blocking layer. | 11-05-2009 |
20090325369 | Semiconductor device and method of fabricating the same - A method of fabricating a semiconductor device includes forming a gate dielectric on a substrate, forming a gate structure on the gate dielectric, the gate structure comprising a stacked layer of a silicon layer and a metal layer, selectively etching the gate structure to form a gate pattern, forming a capping layer surrounding the gate pattern, plasma-treating the capping layer, and performing a gate reoxidation process | 12-31-2009 |
20110014759 | Method of Fabricating Non-volatile Memory Device - A method of fabricating a non-volatile memory device includes: forming a tunnel insulation layer pattern and a floating gate electrode layer pattern over a semiconductor substrate; forming an isolation trench by etching an exposed portion of the semiconductor substrate so that the isolation trench is aligned with the tunnel insulation layer pattern and the floating gate electrode layer pattern; forming an isolation layer by filling the isolation trench with a filling insulation layer; forming a hafnium-rich hafnium silicon oxide layer over the isolation layer and the floating gate electrode layer pattern; forming a hafnium-rich hafnium silicon oxynitride layer by carrying out a first nitridation on the hafnium-rich hafnium silicon oxide layer; forming a silicon-rich hafnium silicon oxide layer over the hafnium-rich hafnium silicon oxynitride layer; forming a silicon-rich hafnium silicon oxynitride layer by carrying out a second nitridation on the silicon-rich hafnium silicon oxide layer; and forming a control gate electrode layer over the silicon-rich hafnium silicon oxynitride layer. | 01-20-2011 |
20110165769 | NONVOLATILE MEMORY DEVICE WITH MULTIPLE BLOCKING LAYERS AND METHOD OF FABRICATING THE SAME - A nonvolatile memory device with a blocking layer controlling the transfer of electric charges in a charge storage layer includes the blocking layer having a first blocking layer in contact with the charge storage layer and a second blocking layer over the first blocking layer, wherein the first blocking layer has a greater energy band gap than the second blocking layer and the second blocking layer has a greater permittivity than the first blocking layer. | 07-07-2011 |
20110250746 | NONVOLATILE MEMORY DEVICE WITH MULTIPLE BLOCKING LAYERS AND METHOD OF FABRICATING THE SAME - A nonvolatile memory device with a blocking layer controlling the transfer of electric charges in a charge storage layer includes the blocking layer having a first blocking layer in contact with the charge storage layer and a second blocking layer over the first blocking layer, wherein the first blocking layer has a greater energy band gap than the second blocking layer and the second blocking layer has a greater permittivity than the first blocking layer. | 10-13-2011 |
Patent application number | Description | Published |
20130176056 | INVERTER DELAY COMPENSATION CIRCUIT - An inverter delay compensation circuit includes a comparison determination unit including a first delay circuit configured for receiving a reference signal and having an inverter chain and a second delay circuit configured for receiving the reference signal and more insensitive to a PVT variation than the first delay circuit, and configured to compare delay amounts of signals obtained by passing the reference signal through the first and second delay circuits, respectively, and the comparison determination unit configured for generating a plurality of control signals; and a compensation circuit unit configured to compensate for a delay amount of an input signal in response to the plurality of control signals and configured to output an output signal. | 07-11-2013 |
20130329507 | OUTPUT ENABLE SIGNAL GENERATION CIRCUIT - An output enable signal generation circuit includes an output enable reset signal generation unit configured to enable an output enable reset signal in response to an external clock signal, a DLL locking signal, and a reset signal, an output enable reset signal delay unit configured to delay the output enable reset signal and output the delayed output enable reset signal, a counter unit configured to output the count of the external clock signal as a value in response to the output enable reset signal and the delayed output enable reset signal, a read command delay unit configured to delay a read command and output the delayed read command, and an output enable signal output unit configured to shift the delayed read command in synchronization with a DLL clock signal and output an output enable signal, according to control of CL and the count value. | 12-12-2013 |
20140064014 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD OF OPERATING USING THE SAME - A semiconductor memory apparatus includes a reset pad configured to receive and transfer an external reset signal and an external control signal; a first input buffer configured to buffer the external reset signal in response to a buffer control signal and output an internal reset signal; a second input buffer configured to buffer the external control signal in response to the buffer control signal and output an internal control signal; and an input buffer control unit configured to generate the buffer control signal in response to an external command. | 03-06-2014 |
20140184286 | DATA OUTPUT CIRCUIT - A data output circuit according to one embodiment of the present invention includes: a delay control block configured to generate a clock delay signal in response to a power-up signal and a reset signal; a first delay block configured to correct a duty ratio of a rising clock according to the clock delay signal and output the corrected rising clock; and a second delay block configured to correct a duty ratio of a falling clock according to the clock delay signal and output the corrected falling clock. | 07-03-2014 |
20140334242 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD OF OPERATING USING THE SAME - A semiconductor memory apparatus includes a reset pad configured to receive and transfer an external reset signal and an external control signal; a first input buffer configured to buffer the external reset signal in response to a buffer control signal and output an internal reset signal; a second input buffer configured to buffer the external control signal in response to the buffer control signal and output an internal control signal; and an input buffer control unit configured to generate the buffer control signal in response to an external command. | 11-13-2014 |
Patent application number | Description | Published |
20120106262 | PROGRAMMING METHOD FOR NONVOLATILE MEMORY APPARATUS - Provided is a method for programming a nonvolatile memory apparatus which includes a bit line selector coupled to first and second bit lines and a page buffer including a main data transmission switch coupled to the bit line selector, a first latch coupled to the main data transmission switch, a temporary data transmission switch coupled to the bit line selector, and a second latch coupled between the temporary data transmission switch and the first latch. In the programming when the first bit line is precharged to a power supply voltage level, a main data transmission switch and a temporary data transmission switch are simultaneously turned on to set up a voltage of the second bit line depending on data levels stored in the first and second latches. | 05-03-2012 |
20120170366 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device includes performing a first program loop including a first program operation and a first verification operation in order to store a lower bit data of n-bit data in memory cells coupled to a page, performing a subprogram loop for memory cells of an erase state, having threshold voltages lower than a target voltage of a negative potential, so that the threshold voltages of the memory cells of the erase state become higher than the target voltage, and performing a second program loop including a second program operation and a second verification operation in order to store an upper bit data of the n-bit data in the memory cells. | 07-05-2012 |
20120236618 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF - A semiconductor memory device includes a memory array configured to include memory cells for storing input data and Code Address Memory (CAM) cells for storing setting data used to set an operation condition; an operation circuit configured to perform a CAM read operation by supplying a read voltage to the CAM cells, perform a test operation for detecting unstable CAM cells in each of which a difference between a threshold voltage and the read voltage is smaller than a permitted limit, from among the CAM cells, and perform an erase operation or a program operation for the unstable CAM cells; and a controller configured to control the operation circuit so that the program operation for storing the setting data in the unstable CAM cells is performed if the number of unstable CAM cells detected in the test operation is greater than a permitted value. | 09-20-2012 |
20130033940 | APPARATUS AND METHODS OF BIT LINE SETUP - Methods and apparatus are disclosed, including an apparatus that has a memory cell array with a memory cell selectively coupled to a bit line. A control circuit is configured to provide a control signal. A voltage generator is configured to provide a sense signal and a precharge signal in response to the control signal. The apparatus further includes a page buffer configured to provide a bit line voltage to the bit line based on the sense signal and the precharge signal, to thereby control a programming of the memory cell. | 02-07-2013 |
20130088930 | NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A nonvolatile memory device includes a page buffer unit configured to include a plurality of page buffers coupled to the respective bit lines; a pass/fail circuit coupled to the page buffer unit and configured to perform a pass/fail check operation by comparing the amount of current, varying according to verify data stored in the plurality of page buffers, with an amount of reference current corresponding to the number of allowed error correction code bits; and a masking circuit configured to preclude the pass/fail check operation by coupling a ground terminal to sense nodes coupled to the remaining page buffers, respectively, other than page buffers corresponding to column addresses having the identical upper bits as an input column address. | 04-11-2013 |
Patent application number | Description | Published |
20110291264 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer. | 12-01-2011 |
20120025374 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT - An integrated circuit packaging system includes: a package carrier; an integrated circuit attached to the package carrier; a rounded interconnect on the package carrier; and an encapsulation over the package carrier covering the integrated circuit and exposing the rounded interconnect having a characteristic free of denting. | 02-02-2012 |
20120119345 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base bottom side and a base top side; mounting an integrated circuit perpendicular to the base top side, the integrated circuit having a first conductor partially exposed at a first end facing and connected to the base top side; and forming an encapsulation over the integrated circuit. | 05-17-2012 |
20120146229 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side. | 06-14-2012 |
20120146235 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming an outer contact pad having an outer pad top side; mounting an integrated circuit above the outer pad top side; forming an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation over the integrated circuit with the encapsulation bottom side coplanar with the outer pad top side; and forming a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation. | 06-14-2012 |
Patent application number | Description | Published |
20120061739 | METHOD FOR FABRICATING CAPACITOR AND SEMICONDUCTOR DEVICE USING THE SAME - Provided are a method for fabricating a capacitor and a semiconductor device using the same. The semiconductor device includes a MOS transistor capacitor, first and second plate capacitors, and a metal interconnection. The MOS transistor capacitor is arranged between a power supply and a ground. The first and second plate capacitors are arranged between the power supply and the ground. The metal interconnection is configured to connect the first and second plate capacitors. | 03-15-2012 |
20120248586 | SEMICONDUCTOR APPARATUS FOR PREVENTING CROSSTALK BETWEEN SIGNAL LINES - A semiconductor integrated circuit apparatus includes a semiconductor substrate, a plurality of signal lines, and at least one interface member. The signal lines are disposed on the semiconductor substrate. The interface member is disposed in the semiconductor substrate between the adjacent signal lines among the signal lines to pierce the semiconductor substrate. | 10-04-2012 |
20130320504 | SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS HAVING THROUGH SILICON VIAS - A semiconductor integrated circuit apparatus includes a semiconductor substrate, a plurality of through-silicon vias (TSVs) formed in the semiconductor substrate, and an impedance path blocking unit located between the plurality of TSVs. | 12-05-2013 |
20140062557 | METHOD FOR REDUCING OUTPUT DATA NOISE OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS IMPLEMENTING THE SAME - Provided is a method for reducing output data noise of a semiconductor apparatus which includes a plurality of output buffers to output data. The method includes the steps of: driving low data to a specific output buffer among the plurality of output buffers, and driving data transiting from a high level to a low level to the other output buffers; and measuring the magnitude of data noise occurring in output data of the specific output buffer, and deciding slew rates of the plurality of output buffers based on the measurement result. | 03-06-2014 |
Patent application number | Description | Published |
20090087960 | METHOD FOR FABRICATING RECESS GATE IN SEMICONDUCTOR DEVICE - A method for fabricating a recess gate in a semiconductor device includes etching a silicon substrate to form a trench that defines an active region, forming a device isolation layer that gap-fills the trench, forming a hard mask layer over the silicon substrate, the hard mask layer comprising a stack of an oxide layer and an amorphous carbon layer, wherein the hard mask layer exposes a channel target region of the active region, and forming a recess region with a dual profile by first etching and second etching the channel target region using the hard mask layer as an etch barrier, wherein the second etching is performed after removing the amorphous carbon layer. | 04-02-2009 |
20100025806 | Semiconductor device and method of fabricating the same - In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions. | 02-04-2010 |
20110266634 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions. | 11-03-2011 |
20110266648 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions. | 11-03-2011 |
Patent application number | Description | Published |
20090011584 | Method for forming transistor of semiconductor device - A method for forming a transistor of a semiconductor device, includes forming a trench by etching a semiconductor substrate on which a pad oxide film and a pad nitride film are sequentially formed; forming a isolation oxide film by filling the trench with oxide; removing an upper portion of the isolation oxide film until an upper lateral portion of the semiconductor substrate is exposed; forming a barrier nitride film over the isolation oxide film, the semiconductor substrate, and the pad nitride film; forming a sacrificial oxide film over the barrier nitride film; performing a planarization process until the pad nitride film is exposed; performing a wet etching process until the active region is exposed; forming a photoresist pattern over the active region and the barrier nitride film; and performing a dry etching process by using the photoresist pattern as an etching mask, thereby forming a recessed gate trench. | 01-08-2009 |
20100025758 | METHOD OF MANUFACTURING HIGH-INTEGRATED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME - A semiconductor device comprises a plurality of vertical transistors each comprising barrier metal layers corresponding to source/drain regions in which a conduction region is formed under a channel region having a pillar form, and a bit line comprising a metal layer to connect the plurality of vertical transistors. | 02-04-2010 |
20100148228 | SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a gate formed on a semiconductor substrate. A first junction region is formed on a first side of the gate and a second junction region formed on a second side of the gate. A bit line is formed over the gate to be electrically coupled with the first junction region. A first metal plug is formed electrically coupling the second junction region. A bit line contact plug is provided between the first junction region and the bit line, and electrically couples the first junction region and the bit line. A second metal plug is formed over the first metal plug and electrically couples the first metal plug. The junction region of a gate in a core or peripheral region is connected to the metal line using a metal plug so that bit lines formed in the core and peripheral area can have a pattern similar to that formed in a cell region. | 06-17-2010 |
20130323911 | METHOD FOR FORMING SEMICONDUCTOR DEVICE - A method for forming a semiconductor device is disclosed. In the semiconductor device, a gate is formed to enclose a fin structure in a 6F | 12-05-2013 |