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Chiwata
Hiroyuki Chiwata, Honolulu, HI US
| Patent application number | Description | Published |
|---|---|---|
| 20100022287 | DANCE GAME MACHINE, METHOD FOR SCORING DANCE GAME AND COMPUTER-READABLE RECORDING MEDIUM - A dance game machine has a mode wherein instruction information to guide a player's dance motion is displayed on a display part, and a mode wherein the instruction information is not displayed. If not displayed, a storage part stores music data, step data, screen data, and comment data corresponding to the mode. A control part reproduces the stored music data sequentially, as well as outputting to the display part the screen data corresponding to the music data, but excepting the instruction information. An input receiving part receives operational input data based on a player's dance motion, while reproducing the music data sequentially. A determination part creates evaluation data of the player's dance motion by comparing dance data being created based on the music data and the step data with operational input data of the player, and outputs the evaluation data to the control part. The control part outputs comment data corresponding to the evaluation data to the display part. | 01-28-2010 |
Hiroyuki Chiwata, El Segundo, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090042650 | Game input device, game method and game system using the same - The objective of present invention is to provide a game input device which allows a player to enjoy the feeling of actually playing a musical instrument along with a rhythm of music, a game method and a game system using such a game input device. The present invention is a game input device having a moving portion and a neck portion, the moving portion has at least two or more inputs, the moving portion is provided onto the neck portion, and the position of the moving portion is movable on the neck portion. The present invention is also a game method and a game system using the game input device. | 02-12-2009 |
Naofumi Chiwata, Mito JP
| Patent application number | Description | Published |
|---|---|---|
| 20100206468 | Molded Product and Manufacturing Method Thereof - A molded product and a method of manufacturing the same are disclosed, in which the insulating layer of uniform thickness is formed in a narrow clearance between plural metal bodies. Surroundings of metal plates spaced at specified intervals are covered with insulating polymer to insulate them electrically. A spacer polymer which consists of insulating polymer whose melting point is T1 is arranged between the metal plates, and a molded part which consists of insulating polymer whose melting point is T2 (| 08-19-2010 | |
Nobuhiko Chiwata, Shimane JP
| Patent application number | Description | Published |
|---|---|---|
| 20090208363 | SOLDER ALLOY FOR OXIDE BONDING - A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects. | 08-20-2009 |
Nobuhiko Chiwata, Yasugi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090104071 | SOLDER ALLOY FOR BONDING OXIDE MATERIAL, AND SOLDER JOINT USING THE SAME - The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided. | 04-23-2009 |
Nobuhiko Chiwata, Yasugi-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080241552 | SOLDER ALLOY AND GLASS BONDED BODY USING THE SAME - The invention provides a solder alloy containing, by mass, 2.0 to 15.0% of Ag, 0.1 to 6.0% of Al, 0.01 to 0.50% of Y, the balance being Sn and unavoidable impurities. The solder alloy preferably contains 0.01 to 0.50% of Ge by mass. The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass. | 10-02-2008 |
Nobuhiko Chiwata, Matsue JP
| Patent application number | Description | Published |
|---|---|---|
| 20100171209 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device having stacked semiconductor chips is provided wherein alignment of even thin semiconductor chips of a large warpage is easy and thus high assembling accuracy and high reliability are ensured. Semiconductor chips having hollow through-silicon via electrodes each formed with a tapered portion are melt-joined using solder balls each having a core of a material higher in melting point than solder. When melt-joining the semiconductor chips, the temperature is raised while imparting an urging load to stacked semiconductor chips, thereby correcting warpage of the semiconductor chips. In each chip-to-chip connection thus formed, if the connection is to prevent the occurrence of stress around the electrode due to the urging load, a solder ball having a core of a smaller diameter than in the other connections is used in the connection. | 07-08-2010 |
| 20100193936 | SEMICONDUCTOR DEVICE - A novel structure capable of reducing the stress in the insulating layer in the semiconductor element and thereby securing reliability is provided. When the semiconductor element and the substrate are connected with a solder, the stress generated in the insulating layer is reduced by placing a spherical core made of a material having a greater rigidity inside the solder and satisfying the following inequalities: 1 GPa<(Young's modulus of a encapsulation resin)<30 GPa, 20 ppm/k<(linear coefficient of expansion of the encapsulation resin)<200 ppm/k, and 10 MPa<(yield stress of the solder at room temperature)<30 MPa. At the time of connection, the thickness of the solder to be placed between the land on the surface of the semiconductor element and the core is adjusted to 1/10 or less of the terminal pitch. | 08-05-2010 |
Nobuhiko Chiwata, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100147926 | METHOD FOR OXIDE BONDING USING SOLDER ALLOY - A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects. | 06-17-2010 |