| Patent application number | Description | Published |
|---|
| 20090197011 | METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT - A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed. | 08-06-2009 |
| 20090235754 | ENCAPSULATION COMPOSITION FOR PRESSURE SIGNAL TRANSMISSION AND SENSOR - An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing. | 09-24-2009 |
| 20090269505 | METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT - A method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed. | 10-29-2009 |
| 20100166952 | NANO-METAL SOLUTION, NANO-METAL COMPLEX GRAINS AND MANUFACTURING METHOD OF METAL FILM - A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: | 07-01-2010 |
| 20100219369 | COMPOSITION OF THERMAL INTERFACE MATERIAL - A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength. | 09-02-2010 |
| 20100270516 | METHOD FOR FORMING NANOMETER SCALE DOT-SHAPED MATERIALS - A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials. | 10-28-2010 |
| 20110141698 | HEAT SPREADING STRUCTURE - The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure. | 06-16-2011 |
| 20110147646 | MODIFIED BISMALEIMIDE RESINS, PREPARATION METHOD THEREOF AND COMPOSITIONS COMPRISING THE SAME - A modified bismaleimide resin of Formula (I) or (II) is provided. | 06-23-2011 |
