Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Ching-Wen
Ching-Wen Chang, Kaohsiung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080265687 | Linear electromagnetic driving module and linear electromagnetic driving device - A linear electromagnetic driving device composed of multiple linear electromagnetic driving modules. A linear electromagnetic driving module has a base, an electromagnetic driving assembly, a crankshaft assembly and a bumper assembly. The electromagnetic driving assembly has a housing with coil and a linear magnetic shaft capable of moving linearly in the housing. The crankshaft assembly is mounted on the base, is connected to the linear magnetic shaft through crank arm and has two crank disks with pivot output shafts mounted rotatably on the base. The electromagnetic induced power output of each driving module is controlled and coordinated electronically through a sensor assembly on the driving device to maximize the energy efficiency. The device is compact and energy efficient. | 10-30-2008 |
Ching-Wen Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110101527 | MECHANISMS FOR FORMING COPPER PILLAR BUMPS - The mechanism of forming a metal bump structure described above resolves the delamination issues between a conductive layer on a substrate and a metal bump connected to the conductive layer. The conductive layer can be a metal pad, a post passivation interconnect (PPI) layer, or a top metal layer. By performing an in-situ deposition of a protective conductive layer over the conductive layer (or base conductive layer), the under bump metallurgy (UBM) layer of the metal bump adheres better to the conductive layer and reduces the occurrence of interfacial delamination. In some embodiments, a copper diffusion barrier sub-layer in the UBM layer can be removed. In some other embodiments, the UBM layer is not needed if the metal bump is deposited by a non-plating process and the metal bump is not made of copper. | 05-05-2011 |
Ching-Wen Chen, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20100233522 | BATTERY CONNECTOR AND HOLDING STRUCTURE FOR BATTERY - A battery connector for a portable electronic device comprises a seat body and a plurality of elastic pins, the seat body includes a first plate and a second plate perpendicularly formed a side of the first plate, the first plate and the second plate cooperatively enclosing a plurality of assembly grooves to assemble the elastic pins. Each elastic pin includes a first folding portion and a second folding portion connecting with the first folding portion. The elastic pins are assembled in the assembly grooves accordingly, the first folding portion protrudes from the first plate and the second folding portion protrudes laterally from the second plate. It is also provides a holding structure applying the battery connector. | 09-16-2010 |
Ching-Wen Hsiao, Banciao City, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090232156 | System, Apparatus, and Method for Loading Bits into Sub-Channels - An apparatus and a method for loading a predetermined number of bits into a plurality of sub-channels are provided. The apparatus comprises a sort module, a calculation module, and a decision module. The sort module is configured to sort the sub-channels into a plurality of sorted sub-channels according to the quality value of each of the sub-channels. The calculation module is configured to calculate the difference value for each of the sorted sub-channels, except for the first sorted sub-channels, according to the corresponding quality value. The decision module is configured to decide a number of bits for each of the sorted sub-channels according to the difference values, wherein a summation of the numbers is equal to the predetermined number. The apparatus and the method are able to load bits efficiently according to the difference values. | 09-17-2009 |
Ching-Wen Hsiao, Banciao City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100112757 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate. | 05-06-2010 |
Ching-Wen Hsiao, Taipel TW
| Patent application number | Description | Published |
|---|---|---|
| 20080286938 | Semiconductor device and fabrication methods thereof - A method for packaging a semiconductor device disclosed. A substrate comprising a plurality of dies, separated by scribe line areas respectively is provided, wherein at least one layer is overlying the substrate. A portion of the layer within the scribe lines area is removed by photolithography and etching to form openings. The substrate is sawed along the scribe line areas, passing the openings. In alternative embodiment, a first substrate comprising a plurality of first dies separated by first scribe line areas respectively is provided, wherein at least one first structural layer is overlying the first substrate. The first structural layer is patterned to form first openings within the first scribe line areas. A second substrate comprising a plurality of second dies separated by second scribe line areas respectively is provided, wherein at least one second structural layer is overlying the substrate. The second structural layer is patterned to form second openings within the second scribe line areas. The first substrate and the second substrate are bonded to form a stack structure. The stack structure is cut along the first and second scribe line areas, passing the first and second openings. | 11-20-2008 |
Ching-Wen Kao, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080302616 | Brake disk with grooves - A brake disk includes a central hole so as to be connected to a wheel shaft and a serrated periphery which includes a plurality of first protrusions and a second protrusion is located between any two adjacent first protrusions. Two recesses are connected between the second protrusion and the two adjacent first protrusions. A plurality of first grooves and second grooves are defined in each of two sides of the brake disk. Each second groove communicates with the first groove corresponding thereto so that rain drops, dust and debris from lining plates of calipers can be easily removed from the brake disk. | 12-11-2008 |
Ching-Wen Wang, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080276037 | Method to Access Storage Device Through Universal Serial Bus - A method accessing a flash memory storage device through universal serial bus (USB) of the present invention includes a flash controller and a flash memory, wherein the method includes connecting the storage device to a USB interface of an electronic device; outputting a plurality of accessing instructions to the flash controller via the electronic device; deciding which data is needed to be temporarily saved in a cache memory and a priority of the accessing instructions according to the characteristic of the file system and the content of preceding instructions of the flash controller; and writing the data temporarily saved in the cache memory into the flash memory according to the priority of the flash controller. The objective of the method of the present invention is to enhance the operation efficiency of the storage device. | 11-06-2008 |
Ching-Wen Wu, Kuntien Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20100134351 | GPS SIGNAL TRANSMISSION APPARATUS - A GPS signal transmission apparatus includes a DC converter with a GPS power unit and an auxiliary power unit, an external GPS antenna, an RF amplifier and an internal GPS antenna. The DC converter receiving a DC power from a cigarette lighter and supplies electrical power to the RF amplifier, a GPS device through the GPS power unit, and portable electronic devices through the auxiliary power unit. The external GPS antenna receives a GPS signal and the GPS signal is amplified by the RF amplifier and then sent to the internal GPS antenna. Therefore, the GPS signal can be sent to the GPS device in wireless manner by the internal GPS antenna. | 06-03-2010 |
Ching-Wen Wu, Tainan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100134357 | SURFACE MOUNTED PLANNER ANTENNA APPARATUS - A surface mounted planner antenna apparatus includes an antenna and a circuit board. The antenna includes a base, a radiation metal plate arranged on a top face of the base, and a ground metal plate arranged on a bottom face of the base. A through hole is defined from the radiation metal plate and passed through the base to the ground metal plate. A signal feeder is arranged in the through hole and electrically connected to the radiation metal plate but electrically insulated with the ground metal plate. The circuit board is attached on the bottom face of the base and includes an upper face and a lower face, the upper face includes an area for binding with the ground metal plate on the bottom face of the base, and the lower face includes a first pad and a signal feeding trace electrically connected with the signal feeder. | 06-03-2010 |
Ching-Wen Yang, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110301058 | MICROFLUIDIC DEVICE - A novel approach for fabricating Monolithic Internal micro Pillars (MIPi) made of SU-8 photoresist is described. A microfluidic chip with the internal pillars (a MIPi chip) was used for cell capturing study. The surface of MIPi was coated with specific antibody and then used for capturing cells by affinity binding. An antibody, anti-EGFR, which has high affinity to lung cancer cells, CL1-5, was coated on the micro pillars. The coated MIPi chip specifically captured the cancer cells that were pumped through the MIPi chip. Simulation and experiment was carried out to compare the effect of different geometry of the micro pillars on the cell capturing rate. | 12-08-2011 |
Ching-Wen Yeh, Shulin City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100206070 | SPEED METER HAVING PEDOMETRIC FUNCTION - A speed meter having pedometric function comprises a casing provided with a liquid crystal screen, a gravity sensor provided in electric connection in the casing, a circuit board, and a microprocessor. A changeover switch is respectively connected with the gravity sensor and the microprocessor. Thereby, the forward speed of a vehicle can be obtained by the detection of the gravity sensor and the calculation of the microprocessor when the vehicle is driven. After the changeover switch is switched into a status of walking or running, the step count of a user can be obtained by the detection of the gravity sensor and the calculation of the microprocessor and shown on the liquid crystal screen. | 08-19-2010 |
| 20100207802 | G-SENSOR REMOTE CONTROLLER - A G-sensor (gravity sensor) remote controller is characterized in that at least a G-sensor and a microprocessor are provided within the main body of the remote controller. Each G-sensor provided in the main body of the remote controller is used for sensing the tapping action of a user to produce sensing signals and different sensing signals can be produced according to the area on the main body the user taps or the tapping frequency within a period of time. The microprocessor provided in the main body of the remote controller is electrically connected with the G-sensor and for processing the sensing signals from the G-sensor to control the function setting of the remote controller itself or other electric apparatuses. | 08-19-2010 |
| 20100208421 | BIKE COMPUTER HAVING DUAL POWER SOURCE - A bike computer having dual power source comprises a housing, a first power module, a switch module and a second power module. The housing has a control module, a liquid display module and a light source module. The control module is electrically connected to the liquid display module, and the light source module provides lights to the liquid display module. A first power module is electrically connected to the control module to supply power to the control module; the switch module is electrically connected to the control module, the first power module, and the light source module. A second power module is electrically connected to the switch module, where is controllable by the control module to switch power outputting for the light source module from the first power module to the second power module. | 08-19-2010 |
| 20100211350 | SPEED METER - A speed meter connected to a vehicle comprises a casing provided with a liquid crystal screen, and a gravity sensor, a power source, a circuit board, and a microprocessor are provided in the casing. The microprocessor is located on the circuit board. The power source, the circuit board, the liquid crystal screen, and the gravity sensor are respectively electrically connected with each other and the gravity sensor is connected with the microprocessor. Thereby, when the vehicle is driven forward, the forward speed of the vehicle can be obtained via the calculation of the microprocessor after the gravity sensor detects the forward acceleration. The obtained forward speed can be shown on the liquid crystal screen to inform users immediately. | 08-19-2010 |