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Ching-Jen
Ching-Jen Chen, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090301272 | CABLE PLIERS STRUCTURE - A cable pliers structure includes a left plier body and a right plier body pivotally connected to each other. The right plier body has an adjusting region. The left plier body is connected with a drive seat movably disposed on one side of the adjusting region. A pressing block is disposed at the top of the drive seat. A clamping component is disposed in the adjusting region and has a clamp base that is movable relative to the pressing block. When the relative distance between the clamp base and the pressing block is changed, that is, the clamp base moves away from or approaches the pressing block, the distance is equivalent to the specification and dimension of a cable connector to be used. Therefore, the cable pliers structure is suitable for cable connectors of various specifications and dimensions through adjusting the distance, without replacing the pressing block. | 12-10-2009 |
Ching-Jen Hsu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080248676 | NETWORK PLUG - The present invention relates to a technical field of high-speed network plug, and more particularly to an improved network plug. The network plug includes a short body, a one-piece holder, a core holder, a clip and a U-like metal housing. The core holder and the one-piece holder are disposed inside the short body. The lengths of the core holder and the one-piece holder are shortened to 4 mm and 3 mm respectively. The back portion of the clip is flexible and arc-like and has a rising and curved central portion. The rear end and the seat thereof are formed integrally. The front end of the clip is inserted in a slot located on a top side of the short body. The clip is fastened on the top side of the short body through a seat thereof. The network plug of the present invention is featured by simple structure, easy plug-out after plugging in a jack, low likelihood of damage to network plug and jack, good high-frequency property and support of demand for performance and speed. | 10-09-2008 |
Ching-Jen Pan, Jhongli City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110012024 | Method for Preparing Ion Source From Nanoparticles - A method for preparing an ion source from nanoparticles is provided. The method includes the steps of: providing nanoparticles, vaporizing the nanoparticles from a solid state to a gaseous state, and ionizing the gas to form the ion source. The ion source is prepared by placing solid nanoparticles in a stainless tube, heating and vaporizing the solid nanoparticles into a gaseous state, and ionizing the gas. The gas can be formed at a lower heating temperature than when solid lumps are used because solid nanoparticles have a lower melting point than solid lumps. Thus, the heating temperature is lowered, and the preparing time of the ion source is shortened. Besides, under the same temperature, an ion source prepared from nanoparticles provides higher vapor pressure and allows a higher implantation dose than when the ion source is prepared from solid lumps, thus expanding the applicability of ion implantation technology. | 01-20-2011 |
Ching-Jen Wang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100166033 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a substrate, a first cladding layer over the substrate, an active region on the first cladding layer, and a second cladding layer on the active region, wherein the active region includes a first type barrier layer that is doped and a second type barrier layer that is undoped, the first type barrier layer being closer to the first cladding layer than the second type barrier layer. | 07-01-2010 |
Ching-Jen Wang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080304243 | CIRCUIT BOARD - A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line. | 12-11-2008 |
| 20090124120 | STACKABLE CONNECTOR ASSEMBLY - This invention discloses a stackable connector assembly, which includes a first connector, a second connector, a shielding member, a contact member, and a ground member. The second connector is placed above the first connector. The shielding member is covered on the first connector. The contact member is used for connecting the shielding member and the ground member. This structure can reduce the electromagnetic radiation from the first connector. | 05-14-2009 |
Ching-Jen Wang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110317378 | ELECTRONIC DEVICE - This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion. | 12-29-2011 |
Ching-Jen Yang, Zhongli City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100143450 | DEVELOPMENT OF ASTHMA THERAPY WITH rAAV-mediated AMCase shRNA - The invention provides small interfering RNA (siRNA) and their carriers that could treat asthma in mammalian through inhibiting acidic mammalian chitinase (AMCase) gene expression. The invention further provides a composition comprising siRNA of the present invention and a carrier. The invention also provides a method for treating asthma of a subject. | 06-10-2010 |