| Patent application number | Description | Published |
| 20100308323 | Method for improving light extraction efficiency of group-III nitride-based light emitting device - A method for improving light extraction efficiency of a group-III nitride-based light emitting device is disclosed. The method includes the steps of: providing a group-III nitride-based light emitting device having a top surface; disposing a seed layer on the top surface for increasing adhesion of the group-III nitride-based light emitting device; and forming a patterned oxide layer, having a plurality of nanostructure particles, without absorption of visible light on the seed layer. The size and shape of the nanostructure particles are controlled by reaction concentration, time and temperature during the patterned oxide layer formation, thereby improving light extraction efficiency of the group-III nitride-based light emitting device without damaging the group-III nitride-based light emitting device. | 12-09-2010 |
| 20110089398 | Method for improving internal quantum efficiency of Group-III nitride-based light emitting device - A method for improving internal quantum efficiency of a group-III nitride-based light emitting device is disclosed. The method includes the steps of: providing a group-III nitride-based substrate having a single crystalline structure; forming on the group-III nitride-based substrate an oxide layer, having a plurality of particles, without absorption of visible light, size, shape, and density of the particles are controlled by reaction concentration ratio of nitrogen/hydrogen, reaction time and reaction temperature; and growing a group-III nitride-based layer over the oxide layer; wherein the oxide layer prevents threading dislocation of the group-III nitride-based substrate from propagating into the group-III nitride-based layer, thereby improving internal quantum efficiency of the group-III nitride-based light emitting device. | 04-21-2011 |
| 20110095314 | Light emitting device and method for enhancing light extraction thereof - A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N | 04-28-2011 |
| 20110127551 | Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices - A method for enhancing electrical injection efficiency and light extraction efficiency of a light-emitting device is disclosed. The method includes the steps of: providing a site layer on the light-emitting device; placing a protection layer on the site layer; forming a cavity through the protection layer and the site layer; and growing a window layer in the cavity. The shape of the window layer can be well controlled by adjusting reactive temperature, reactive time, and N | 06-02-2011 |
| 20110143466 | METHOD OF FORMING VERTICAL STRUCTURE LIGHT EMITTING DIODE WITH HEAT EXHAUSTION STRUCTURE - The present invention is to provide a method of forming a vertical structure light emitting diode with a heat exhaustion structure. The method includes steps of: a) providing a sapphire substrate; b) depositing a number of protrusions on the sapphire substrate, each of which has a height of p; c) forming a buffer layer having a number of recesses, each of which has a depth of q smaller than p so that when the protrusions are accommodated within the recesses of the buffer layer, a number of gaps are formed therebetween for heat exhaustion; d) growing a number of luminescent layers on the buffer layer, having a medium layer formed between the luminescent layers and the buffer layer; e) etching through the luminescent layers and the buffer layer to form a duct for heat exhaustion; f) removing the sapphire substrate and the protrusions by excimer laser lift-off (LLO); g) roughening the medium layer; and h) depositing electrodes on the roughened medium layer. | 06-16-2011 |