| Patent application number | Description | Published |
|---|
| 20080298070 | LED LIGHTING DEVICE (1) - A LED lighting device includes a light hood, a base and a LED. The light hood has a hood wall and an open side. The base is disposed in and joined to the hood wall to be opposite to the open side. The LED is disposed in and attached to the base. A quartz light-pervious plate is disposed at the open side and light emitted from the LED is capable of being spread outward through the quartz-pervious plate. | 12-04-2008 |
| 20080298071 | LED LIGHTING DEVICE (2) - A LED lighting device includes a light hood, a base and a LED. The light hood has a hood wall and an open side. The base is disposed in and joined to the hood wall to be opposite to the open side. The LED is disposed in and attached to the base. A polygon surface shaped light-pervious plate is disposed at the open side and light emitted from the LED is capable of being spread outward through the polygon surface shaped light-pervious plate. | 12-04-2008 |
| 20090120611 | HEAT DISSIPATION MODULE - A heat dissipation module includes a cooling base, at least a guide heat pipe and a cooling fin set. The cooling base provides at least a circular recess and at least a receiving groove. The guide heat pipe is placed in the circular recess. The cooling fin set is joined to the cooling base and provides a lower folding side at each cooling fin thereof and the folding side has at least a concave upward portion corresponding to the circular recess. The receiving groove is disposed at two end sides of the circular recess for receiving solder, soldering paste, solder club or bonding agent. Therefore, when the cooling fin set and the guide heat pipe are joined to the cooling base, the receiving groove is capable of speeding up the joint and preventing abnormal phenomena such as incomplete soldering, creating clearance and excessive solder. | 05-14-2009 |
| 20090175045 | HEAT DISSIPATING STRUCTURE FOR LIGHT EMITTING DIODES - A heat dissipating structure associated with light emitting diodes includes a circuit substrate, a guide heat component, a heat dissipating device. The circuit substrate is attached with light emitting diodes. The guide heat component has a first end contacting the circuit substrate and a second end contacting with fins, which are provided with the heat dissipating device. The heat generated by the light emitting diodes is transmitted to the heat dissipating device via the guide heat pipe and then dissipated outward via the heat dissipating device. | 07-09-2009 |
| 20090218073 | COOLING FIN - A cooling fin provides at least a projection part and at least a slot is disposed at lateral sides for the airflow producing turbulent flows while passing through the slot and creating eddy currents at the periphery of the cooling fin. Therefore, the cold air, which flows between a plurality of cooling fins, can stagnate longer time for carrying more heat outward and enhancing the heat dissipation efficiency greatly. | 09-03-2009 |
| 20090218082 | HEAT DISSIPATION MODULE - A heat dissipation module includes a plurality of cooling fins and at least a guide heat pipe. The cooling fins stack to one another with at least a through hole at the respective cooling fin for being penetrated with the guide heat pipe. A projecting annular part is disposed at a side of the respective cooling fin to surround the circumference of the through hole with an indented spot at the periphery of the projecting annular part. The outer side of said guide heat pipe has an elongated recess extending along the length thereof to correspond to the indented spot such that the indented spot is capable of fitting with the recess after the guide heat pipe passing through the through hole respectively to facilitate the subsequent welding job. | 09-03-2009 |
| 20090255658 | HEAT DISSIPATION MODULE - A heat dissipation module comprises an aluminum cooling block and a copper base. The cooling block has a plurality of fins extending outward radially from the periphery of the cooling block. The base fits with the cooling block. A central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block. The base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole. The heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively. | 10-15-2009 |
| 20100038060 | HEAT DISSIPATION DEVICE CAPABLE OF COLLECTING AIR - A heat dissipation device capable of collecting air includes a fan, a heat sink and an air collecting hood. The top of the heat sink is joined to the fan. The air collecting hood is disposed to surround the heat sink. It is characterized in that the air collecting hood has an air inlet, a middle section and an air outlet; and the inner side of the middle section has a plurality of support projections against the periphery of said heat sink. Therefore, the air induced by the fan can be gathered at the surroundings of the heat sink with the air collecting hood for enhancing the effect of the heat dissipation. | 02-18-2010 |
