Ching-Chung Chen
Ching-Chung Chen, Taipei TW
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20090186519 | DETECTING DEVICE AND CONNECTOR MODULE THEREOF - A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed. | 07-23-2009 |
20100061045 | ELECTRONIC DEVICE AND ENGAGING STRUCTURE THEREOF - The invention discloses an electronic device and an engaging structure thereof. The electronic device comprises a first casing and a second casing. The first casing comprises a plate portion and a plurality of hooks. Each hook is located on the plate portion. The second casing comprises a first side portion, a second side portion, an engaging portion, a first rib and a second rib. The engaging portion is between the first and the second side portions and comprises a plurality of recesses. Each recess is engaged with one of the hooks and has a front edge. A gap is between one end of the hook and the front edge of the recess. The first and second ribs are respectively located on the first and the second side portions. The plate portion is disposed on the first and second ribs. The hook can be detached from the recess by the gap. | 03-11-2010 |
20100267275 | DETECTING DEVICE AND CONNECTOR MODULE THEREOF - A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed. | 10-21-2010 |
Ching-Chung Chen, Taipei City TW
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20100258283 | ELECTRONIC DEVICE - An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing. | 10-14-2010 |
20130148298 | DOCKING STATION - A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device. | 06-13-2013 |
20130157066 | METHOD FOR MANUFACTURING A HARD, WATER-RESISTANT ANTI-FOG COATING - The present invention relates to a method for manufacturing a hard, water-resistant anti-fog coating, and particularly relates to a method for manufacturing a hard, water-resistant anti-fog coating on plastic material. In this method, an organic-inorganic hard adhesion layer and a hydrophilic anti-fog coating film are prepared for manufacturing a hard, water-resistant anti-fog coating. Both of the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating have C=C double bonds. Therefore, the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating are adhered to each other tightly. It brings high hardness, high water resistance and good anti-fog effect. | 06-20-2013 |
Ching-Chung Chen, Taipei County TW
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20100148958 | EXPIRATION WARNING DEVICE OF REFRIGERATOR - An expiration warning device installed on a refrigerator includes a processor unit, a power source unit electrically connected to the processor unit, an operating unit electrically connected to the processor unit for setting a countdown of number of days, at least one display unit electrically connected to the processor unit for displaying the countdown of number of days, at least one switch unit electrically connected to processor unit for controlling the power source unit and the display unit, and at least one warning unit electrically connected to the processor unit and corresponding to the display unit for alerting the countdown of number of days. The processor unit, power source unit, operating unit, display unit, switch unit and warning unit are coupled to a casing and installed on the refrigerator for setting a countdown of expiration of related foods to remind users about the expiration in advance. | 06-17-2010 |
Ching-Chung Chen, Kaohsiung City TW
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20100025702 | SUBSTRATE-FREE FLIP CHIP LIGHT EMITTING DIODE - A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material. | 02-04-2010 |
Ching-Chung Chen, Taipei Hsien TW
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20090052205 | LIGHT SOURCE MODULE OF SCANNING DEVICE - A light source module of scanning device includes a light guide rod and a light emitting diode. The light guide rod has a top surface, a bottom surface and two end portions. The top surface and the bottom surface are disposed opposite to each other. The light emitting diode is disposed adjacent to one of the end portions. | 02-26-2009 |
20090052207 | LIGHT SOURCE MODULE OF SCANNING DEVICE - A light source module of scanning device includes a first light guide rod, a second light guide rod, and a light emitting diode. The first light guide rod has a first incident surface and is disposed at a first end portion. The second light guide rod has a second incident surface and is disposed at a second end portion. The light emitting diode is disposed between the first end portion and the second end portion. | 02-26-2009 |
Ching-Chung Chen, Hukou TW
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20120075882 | LIGHT EMITTING DIODE MODULE - An LED module includes an LED and a light-guiding board. The light-guiding board includes a light-incident face facing the LED, a light-emergent face, a light-reflecting face opposite to the light-emergent face, and a light-converting layer containing phosphors therein. Light emitted from the LED sequentially moves the light-incident face, the light-converting layer and the light-emergent face to leave the light-guiding board. The light-converting layer has a uniform thickness. | 03-29-2012 |
20120273809 | LIGHT EMITTING DIODE DEVICE - An LED package includes a substrate, a first LED module and a second LED module. The first LED module includes a plurality of first LEDs arranged at the substrate. The second LED module includes a plurality of second LEDs arranged at the substrate and surrounding the first LED module. A luminous intensity of the first LED module is less than a luminous intensity of the second LED module. | 11-01-2012 |
Ching-Chung Chen, Hsinchu TW
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20120256219 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup. | 10-11-2012 |
20140151722 | LIGHT EMITTING DIODE (LED) LIGHT SOURCE DEVICE HAVING UNIFORM ILLUMINATION - An LED light source device includes a printed circuit board (PCB) and a plurality of LED light sources located on the PCB and electrically connected with the PCB. The plurality of LED light sources are arranged symmetrically relative to a center point of the PCB, and a distance between every adjacent two LED light sources decreases along a direction away from the center point of the PCB. An optical lens is located over the LED light sources for diverging light from a central one of the LED light sources. | 06-05-2014 |