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Chin-Yung
Chin-Yung Chen, Hua Tan Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20100320885 | BATHROOM CABINET - The present invention discloses a bathroom cabinet including two first extruded strips and two second extruded strips enclosed to form a frame. The two first extruded strips and the second extruded strip include opposite slots for embedding a back panel, and through holes are disposed on both ends of the two first extruded strips, and corresponding rails are protruded from surfaces of the two second extruded strips for passing fasteners through the through holes of the two first extruded strips and locking the fasteners into the rails of the two second extruded strips respectively, such that the extruded strips can be adjusted to a required size according to a user's need, and the invention can enhance the structural strength of the bathroom cabinet. | 12-23-2010 |
Chin-Yung Chen, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090246477 | ASSEMBLY STRUCTURE - An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer. | 10-01-2009 |
| 20100129963 | INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF - The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided. | 05-27-2010 |
Chin-Yung Chen, Dasi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090242281 | TOUCH SENSING DEVICE AND TOUCH SENSING APPARATUS - The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed. | 10-01-2009 |
Chin-Yung Chen, Daxi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110254153 | DIE STRUCTURE AND DIE CONNECTING METHOD - A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block. | 10-20-2011 |
Chin-Yung Huang, Foster City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110131245 | IDENTIFYING A GROUP OF PRODUCTS RELEVANT TO DATA PROVIDED BY A USER - A method for using a rule-based system implemented by at least one physical processor to identify from a set of available products a group of products relevant to data provided by a user includes creating with the rule-based system a number of rules based on the data provided by the user, for each available product in the set of available products, creating a combined ruleset including the rules based on the data provided by the user and a number of rules characterizing the available product and determining with the rule-based system whether a conflict exists in the combined ruleset, and returning to the user the available products for which no conflict was found as the group of products relevant to the data provided by the user. | 06-02-2011 |