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Chin-Te
Chin-Te Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110084022 | Process for treating nitrogenous wastewater with simultaneous autotrophic denitrification, hetertrophic denitrification and COD removal - A process for treating nitrogenous wastewater contains an autotrophic denitrification reaction, a heterotrophic denitrification reaction and a COD removal reaction simultaneously and mixedly taking place in a single reactor. The nitrification reaction is caused by nitrifying bacteria, in which ammonium is oxidized into nitrite. The autotrophic denitrification reaction is caused by autotrophic denitrifying bacteria, in which ammonium used as electron donor and nitrite used as electron acceptor are converted into nitrogen gas and nitrate. The heterotrophic denitrification reaction is caused by heterotrophic denitrifying bacteria, in which nitrate and COD are consumed. It is not necessary to build two separate reactors for aerobic nitrification and anaerobic denitrification, thereby effectively reducing the fabrication and operation cost. | 04-14-2011 |
Chin-Te Chen, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100074438 | SYSTEMS AND METHODS FOR KEY MANAGEMENT - A method for key management for a broadcasting system includes generating a receiver group key (RGK) seed and a plurality of parameters for a receiver group provided by the broadcasting system; and calculating an RGK for the receiver group based on the RGK seed and the plurality of parameters. | 03-25-2010 |
Chin-Te Lai, Tucheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20100068941 | Electrical connector having retainer for securing terminals disposed therein - An electrical connector ( | 03-18-2010 |
Chin-Te Lai, New Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110237111 | ELECTRICAL CONNECTOR ASSEMBLY HAVING IMPROVED PROTECTING MEANS - An electrical connector assembly ( | 09-29-2011 |
Chin-Te Liu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110157663 | Scanning Device - A scanning device includes a hollow housing, a holding plate mounted to an upper portion of the housing, a guiding rod mounted in the housing and spaced from the holding plate with a predetermined distance, a reading unit slidably mounted to the guiding rod, and a flexible cable received in the housing. The flexible cable has a restrictive plate and a conducting cable attached to a top of the restrictive plate. The restrictive plate has at least one long side raised upwardly. The flexible cable is received in the housing in a folding manner, with a lower end thereof where the raised side faces upwards connected to the system controller, and an upper end thereof where the raised side faces downwards connected to the reading unit, forming an inverted-U folding portion. The raised side at the folding portion is unfolded for keeping the folding portion in shape, in scanning process. | 06-30-2011 |
Chin-Te Wang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100248430 | High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof - In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost. | 09-30-2010 |
| 20110186974 | HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE - A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost. | 08-04-2011 |