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| 20080297298 | TUNABLE EMBEDDED INDUCTOR DEVICES - The invention provides tunable embedded high frequency inductor devices. The inductor device comprises a dielectric substrate. A first conductive line is disposed on a first surface of the dielectric substrate. A second conductive line is disposed on a second surface of the dielectric substrate. An interconnection is disposed perforating the dielectric substrate and connecting the first conductive line with the second conductive line. A coupling region is defined between the first and the second conductive lines. A conductive plug connecting the first conductive line and the second line is disposed in the coupling region. Alternatively, an opening is disposed in the first and second conductive lines to tune inductance of the inductor. | 12-04-2008 |
| 20090045904 | INTER-HELIX INDUCTOR DEVICES - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 02-19-2009 |
| 20090058589 | SUSPENSION INDUCTOR DEVICES - Suspension inductor devices are provided. A suspension inductor device includes a dielectric substrate and a suspension induction coil. The suspension induction coil includes an input end disposed on the dielectric substrate. A spiral coil is wound from the dielectric substrate to an interconnection. The interconnection is disposed in the spiral coil and connects the input end and the spiral coil. An output end is disposed on the dielectric substrate and adjacent to the input end. | 03-05-2009 |
| 20090183358 | EMBEDDED INDUCTOR DEVICES AND FABRICATION METHODS THEREOF - Embedded inductor devices and fabrication methods thereof. An embedded inductor device includes a substrate, a conductive coil disposed on the substrate, and a patterned high-permeability (μ | 07-23-2009 |
| 20110063067 | Inter-Helix Inductor Devices - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 03-17-2011 |
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| 20090002916 | Interdigital capacitor - An interdigital capacitor includes a first finger electrode structure and a second finger electrode structure. The first finger electrode structure has a first electrode and a plurality of first extending electrodes. The first extending electrodes are linearly disposed and arranged. The second finger electrode structure has a second electrode and a plurality of second extending electrodes. The second extending electrodes are linearly disposed and arranged. The second finger electrode structure interlaces with the first finger electrode structure. At least one pair of first coupling electrodes extend respectively from the neighboring first and second extending electrodes and are disposed between them. | 01-01-2009 |
| 20090051469 | MULTI-FUNCTIONAL COMPOSITE SUBSTRATE STRUCTURE - A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal. | 02-26-2009 |
| 20100226112 | MIRROR IMAGE SHIELDING STRUCTURE - A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented. | 09-09-2010 |
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| 20080197967 | Circuit boards with embedded resistors - The present invention relates to an adjustable resistor embedded in a circuit board and a method of fabricating the same. The adjustable resistor comprises a resistor with a number of connection terminals, and a number of via holes extending to contact with the resistor. The resistive value of the resistor is variable depending on the size of the via holes, the number of the via holes, or the distance between the via holes. | 08-21-2008 |
| 20090072942 | MEANDER INDUCTOR AND SUBSTRATE STRUCTURE WITH THE SAME - A meander inductor is disclosed, the inductor is disposed on a substrate or embedded therein. The meander inductor includes a conductive layer composed of a plurality of sinusoidal coils with different amplitudes and in series connection to each other, wherein the sinusoidal coils with different amplitudes are laid out according to a periphery outline. The profile of the meander inductor is designed according to an outer frame range available for accommodating the meander inductor and is formed by coils with different amplitudes. Therefore, under a same area condition, the present invention enables the Q factor and the resonant frequency fr of the novel inductor to be advanced, and further expands the applicable range of the inductor. | 03-19-2009 |
| 20090268369 | CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY - A capacitor structure is provided. In the capacitor structure, a signal electrode plate and an extension ground electrode plate are disposed on the same plane to form a co-plane capacitor structure. Due to slow wave characteristic, the resonance frequency of the capacitor structure is effectively raised and the capacitor structure may be applied in high frequency. | 10-29-2009 |
