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Chin-Sheng
Chin-Sheng Chen, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20100248543 | ELECTRICAL CONNECTOR ASSEMBLY WITH AN INTEGRATED CIRCUIT MODULE - An electrical connector assembly ( | 09-30-2010 |
Chin-Sheng Lin, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080198562 | PROTECTIVE JACKET OF ELECTRICAL DEVICE - A protective jacket for covering an electrical device is provided. The protective jacket includes a first shell and a second shell. The first shell includes a front cover, a rear cover, and an elastic strip. The front and the rear covers are formed apart from each other and have an individual hollow for receiving the insertion of the device. The elastic strip is formed between these covers. A space is defined on the first shell by theses covers, and the elastic strip together. The second shell is configured to be disposed within the space of the first shell, and has a slot for receiving the insertion of the device. Therefore, the protective jacket conforms to the shape of the device and is capable of covering the device compactly for preventing damages due to collision and avoiding dust and mist pollution so as to increase the life of the device substantially. | 08-21-2008 |
| 20100006468 | PROTECTION COVER FOR PORTABLE PRODUCT - A protection cover is used for sleeving over a portable product so as to help protect the product from being scratched. The protection cover includes a shock-absorbing structure for shielding and concealing a corner of the portable product. The shock-absorbing structure is formed with an air chamber bulging outwardly from the corner of the portable product. The shock-absorbing structure further has an inner region that defines an opening for access into the air chamber and that abuts tightly and sealingly against the corner of the portable product so as to convert the air chamber into an air-trapped chamber when the protection cover is sleeved over the portable product. | 01-14-2010 |
Chin-Sheng Lu, Taichung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100066291 | METHOD AND MODULE FOR CONTROLLING ROTATION OF A MOTORIZED SPINDLE - In a method and module for controlling rotation of a motorized spindle driven by a driving unit, a sensing unit is adapted for sensing vibration of the spindle and generates a voltage signal corresponding to the vibration of the spindle. A processing unit is coupled to the sensing unit for receiving the voltage signal therefrom, and outputs a control signal corresponding to the voltage signal upon detecting that the voltage signal is greater than a reference voltage corresponding to a predetermined vibration level of the spindle, such that the driving unit adjusts a rotation speed of the spindle in response to the control signal from the processing unit. | 03-18-2010 |
Chin-Sheng Wang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120007252 | SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity. | 01-12-2012 |
Chin-Sheng Wen, Sanchung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080253114 | Hid searchlight module - A HID searchlight module includes lamp head unit, a ballast unit and a battery unit respectively connected to one another in series by a respective screw joint. The lamp head unit has an end cap at the rear side that has two holes, two metal springs respectively mounted in the holes and respectively electrically connected to the contacts of the PC board in the lamp head unit, two metal conducting pins respectively supported on the metal springs, a front inner annular flange protruded from the front side at the center, a front outer annular flange protruded from the front side at the center and concentrically spaced around the front inner annular flange, and an annular coupling groove defined between the front outer annular flange and the front inner annular flange. | 10-16-2008 |