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Chin-Ming
Chin-Ming Chang, Tustin, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090149546 | Enhanced Bimatoprost Ophthalmic Solution - A composition comprising from 0.005% to 0.02% bimatoprost by weight and from 100 ppm to 250 ppm benzalkonium chloride, wherein said composition is an aqueous liquid which is formulated for ophthalmic administration is disclosed herein. | 06-11-2009 |
| 20090326034 | KETOROLAC TROMETHAMINE COMPOSITIONS FOR TREATING OR PREVENTING OCULAR PAIN - The present invention provides an aqueous ophthalmic solution comprising an effective amount of ketorolac which comprises carboxymethyl cellulose in an aqueous solution wherein said concentration of carboxymethyl cellulose is selected to provide an increased absorption of ketorolac in the eye of a patient that is at least 130% greater than the absorption of a comparative aqueous ketorolac ophthalmic solution having the same concentration of ketorolac. | 12-31-2009 |
| 20100087503 | KETOROLAC TROMETHAMINE COMPOSITIONS FOR TREATING OR PREVENTING OCULAR PAIN - The present invention provides an aqueous ophthalmic solution comprising an effective amount of ketorolac which comprises carboxymethyl cellulose in an aqueous solution which provides increased visual acuity in users and wherein said concentration of carboxymethyl cellulose is selected to provide an increased absorption of ketorolac in the eye of a patient which is at least 130% greater than the absorption of a comparative aqueous ketorolac ophthalmic solution having the same concentration of ketorolac. | 04-08-2010 |
| 20110021595 | KETOROLAC TROMETHAMINE COMPOSITIONS FOR TREATING OR PREVENTING OCULAR PAIN - The present invention provides an aqueous ophthalmic solution comprising an effective amount of ketorolac which comprises mixtures of carboxymethyl cellulose in an aqueous solution wherein said concentration of carboxymethyl cellulose is selected to provide an increased absorption of ketorolac in the eye and improve visual acuity of the users. | 01-27-2011 |
| 20110046198 | KETOROLAC TROMETHAMINE COMPOSITIONS FOR TREATING OR PREVENTING OCULAR PAIN - The present invention provides an aqueous ophthalmic solution comprising an effective amount of ketorolac which comprises carboxymethyl cellulose in an aqueous solution wherein said concentration of carboxymethyl cellulose is selected to provide an increased absorption of ketorolac in the eye of a patient that is at least 130% greater than the absorption of a comparative aqueous ketorolac ophthalmic solution having the same concentration of ketorolac. | 02-24-2011 |
| 20110124737 | ENHANCED BIMATOPROST OPHTHALMIC SOLUTION - A composition comprising from 0.005% to 0.02% bimatoprost by weight and from 100 ppm to 250 ppm benzalkonium chloride, wherein said composition is an aqueous liquid which is formulated for ophthalmic administration is disclosed herein. | 05-26-2011 |
| 20110160271 | KETOROLAC TROMETHAMINE COMPOSITIONS FOR TREATING OR PREVENTING OCULAR PAIN - The present invention provides an aqueous ophthalmic solution comprising an effective amount of ketorolac which comprises carboxymethyl cellulose in an aqueous solution wherein said concentration of carboxymethyl cellulose is selected to provide an increased absorption of ketorolac in the eye of a patient that is at least 130% greater than the absorption of a comparative aqueous ketorolac ophthalmic solution having the same concentration of ketorolac. | 06-30-2011 |
Chin-Ming Hsu, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100155937 | Wafer structure with conductive bumps and fabrication method thereof - A wafer structure with conductive bumps and fabrication method thereof are disclosed herein. Conductive bumps are later converted into conductive balls. A central area and a marginal area are defined on the wafer. To achieve heights among conductive balls formed on the wafer structure, the sizes (can be but not limited to one) of under bump metallurgy (UBM) layer blocks in the central area are smaller than that in the marginal area. The fabrication procedure for forming under bump metallurgy layer blocks of different size includes depositing a photoresist layer on the metallurgy layer and pattern the photoresist with a photomask of smaller opening area for the central area than for the marginal area, and removing the photoresist layer and the portion of metallurgy layer under the photoresist layer. | 06-24-2010 |
Chin-Ming Hsu, Hukou Shiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20110133327 | SEMICONDUCTOR PACKAGE OF METAL POST SOLDER-CHIP CONNECTION - A semiconductor package with MPS-C2 configuration is revealed, primarily comprising a substrate and a chip. A plurality of leads covered by a solder mask having a rectangular slot disposed on the top surface of the substrate to expose parts of the leads. A plurality of metal pillars are disposed on the active surface of the chip. A patterned plating layer is partially formed on the exposed portions of the leads located inside the slot to form a plurality of plating-defined fingers. Therefore, the soldering area of the solder on the leads can be constrained without exceeding the patterned plating layer to avoid issue of excessive solder ability. | 06-09-2011 |
| 20110156238 | SEMICONDUCTOR PACKAGE HAVING CHIP USING COPPER PROCESS - A semiconductor package having chip using copper process is revealed. A chip using copper process is disposed on a substrate. The substrate has a core layer, a copper circuitry with connecting pads, a patterned diffusion barrier, and a solder mask. The copper circuitry is formed on the core layer. The patterned diffusion barrier has such a pattern identical to the one of the copper circuitry that an upper surface of the copper circuitry is completely covered. The substrate further has a bonding layer formed on a portion of the patterned diffusion barrier inside the solder mask's opening. Therefore, diffusion of copper ions from the copper circuitry of the substrate to the active surface of the chip can be avoided to prevent function failure of the chip. | 06-30-2011 |
Chin-Ming Lin, Jhunan Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100190274 | RTP SPIKE ANNEALING FOR SEMICONDUCTOR SUBSTRATE DOPANT ACTIVATION - A semiconductor substrate has a plurality of active device patterns. At least some of the active device patterns comprise doped regions. The substrate has a plurality of surface regions, including the active device patterns and un-patterned regions, with respectively different reflectances for light in a near infrared wavelength. A first difference is determined, between a largest reflectance at the near infrared wavelength and a smallest reflectance at the near infrared wavelength. A second infrared wavelength is determined, for which a second difference between a largest reflectances a smallest reflectance is substantially less than the first difference at the near infrared wavelength. A rapid thermal processing (RTP) spike annealing dopant activation step is performed on the substrate using a second light source providing light at the second wavelength. | 07-29-2010 |
Chin-Ming Lin, Jia-Yi TW
| Patent application number | Description | Published |
|---|---|---|
| 20080249341 | METHOD FOR PREPARING HIGH ENERGY FUELS - A method for preparing the low carbon number petrochemical products along with the high energy fuels from pyrolysis gasoline is provided. In this method, the pyrolysis gasoline is used as feedstock, and the reactive non-aromatic, unsaturated moieties, and the sulfur impurity contained in the pyrolysis gasoline are removed. Then the stabilized feedstock is used to produce C | 10-09-2008 |