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Chin-Min
Chin-Min An, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100297455 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE - The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R | 11-25-2010 |
Chin-Min Lin, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100241263 | SYSTEM AND METHOD OF MULTI-OBJECTIVE CAPACITY PLANNING IN TFT-LCD PANEL MANUFACTURING INDUSTRY - A system and a method of multi-objective capacity planning in the TFT-LCD panel manufacturing industry are provided. The system includes a capacity planning module and a multi-objective planning module. In the present method, a capacity planning plan corresponding to different objective is evaluated by the capacity planning module. A set of constraints of each objective is established by the multi-objective planning module according to characteristic parameters, so as to optimize the objective. Then, the optimized objectives are drawn into a graph to select an appropriate capacity planning plan. | 09-23-2010 |
Chin-Min Lin, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090263674 | Forming Sensing Elements above a Semiconductor Substrate - An integrated circuit structure includes a substrate and a metallization layer over the substrate. The metallization layer includes a dielectric layer and metal lines in the dielectric layer. The integrated circuit structure further includes a sensing element over the metallization layer. The sensing element may be formed in passivation layers. | 10-22-2009 |
Chin-Min Lin, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090020838 | APPARATUS AND METHOD FOR REDUCING OPTICAL CROSS-TALK IN IMAGE SENSORS - An image sensor device includes a semiconductor substrate having a front surface and a back surface; an array of pixels formed on the front surface of the semiconductor substrate, each pixel being adapted for sensing light radiation; an array of color filters formed over the plurality of pixels, each color filter being adapted for allowing a wavelength of light radiation to reach at least one of the plurality of pixels; and an array of micro-lens formed over the array of color filters, each micro-lens being adapted for directing light radiation to at least one of the color filters in the array. The array of color filters includes structure adapted for blocking light radiation that is traveling towards a region between adjacent micro-lens. | 01-22-2009 |