Patent application number | Description | Published |
20090257246 | BACK LIGHT MODULE AND DISPLAY APPARATUS USING THE SAME - A back light module including a frame, a light-guide plate and a light source is provided. The frame has a opening and a first surface and a second surface opposite to the first surface. The opening is extended from the first surface to the second surface of the frame, so that an inner surface of the opening is connected to the first surface and the second surface. At least a portion of the inner surface is slanted toward the inner of the opening. The light-guide plate is integrated with the frame and at least a portion of the opening is filled with the light-guide plate. The light-guide plate is tightly attached to the inner surface of the frame. The light source is adjacent to the light-guide plate. | 10-15-2009 |
20090284987 | BACK LIGHT MODULE - A backlight module including a frame, a light guide plate, a light source and a flexible printed circuit board is provided. The flexible printed circuit board includes a body, a light source carrying portion and a connecting portion. The body is bent, so a top edge and a bottom edge of the body are respectively disposed at a top side and a bottom side of the frame. The light source carrying portion carries the light source. The connecting portion has a first end and a second end. The first end is connected to a middle region of a bottom side of the light source carrying portion. The second end is connected to the bottom edge. The connecting portion is bent, such that the light source carrying portion is disposed on the top side of the frame and the light source is positioned at a side of the light guide plate. | 11-19-2009 |
20100014016 | FLEXIBLE PRINTED CIRCUIT AND LIQUID CRYSTAL MODULE USING THE SAME - A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body. | 01-21-2010 |
20120127686 | DECORATION PLATE AND ELECTRONIC APPARATUS HAVING THE SAME - A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening. | 05-24-2012 |
20120287653 | ROTATABLE LIGHTING APPARATUS - A rotatable lighting apparatus includes a terminal, a base which includes a protruding part at a junction portion thereof, a rotatable lamp holder pivoted at the base and including a heat dissipation part and a lighting source, a passing-through device passing through the base and the rotatable lamp holder, and a bellow device connected to the base and the rotatable lamp holder. The heat dissipation part has a plurality of restricting trenches for fastening to the protruding part. When a tensile force is applied to the rotatable lamp holder, the rotatable lamp holder is capable of moving relative to the base along a moving-axis, so that the rotatable lamp holder is capable of rotating relative to the base. When the tensile force is removed, the rotatable lamp holder is fastened to one of the restricting trenches, so that the rotatable lamp holder is fixed to the base. | 11-15-2012 |
20130044505 | ILLUMINATION APPARATUS - An illumination apparatus includes a light-guiding pillar, a sleeve, and a point light source. The light-guiding pillar has a light-emitting surface, a bottom surface, a light incident surface, and a reflection bar disposed on the bottom surface. An extension direction of the reflection bar is parallel to an extension direction of the light-guiding pillar. The light incident surface of the light-guiding pillar is disposed in the sleeve. The sleeve includes a reflection portion surrounding the light incident surface and extending along a direction away from the light-guiding pillar. An internal diameter of the reflection portion decreases in a direction away from the light incident surface. The portion of the light beams emitted by the point light source are reflected to the light incident surface by an inner surface of the reflection portion and enter the light-guiding pillar. | 02-21-2013 |
20130099667 | ILLUMINATION DEVICE CAPABLE OF BEING CONTROLLED BY BLOW - An illumination device capable of being controlled by blow includes a casing, a light emitting module, a driving circuit board and a blow sensing module. At least one air hole is formed on a periphery of the casing. The light emitting module is disposed on a top of the casing. The driving circuit board is disposed in the casing and electrically connected to the light emitting module. The blow sensing module is disposed in the casing, electrically connected to the driving circuit board and used for sensing blow through the at least one air hole. The driving circuit board controls the light emitting module to emit light in different brightness according to a number of blows sensed by the blow sensing module. | 04-25-2013 |
20130100684 | ROTATABLE ILLUMINATION DEVICE - A rotatable illumination device includes a first casing, a light emitting module, a first fixing member and a second fixing member. The first casing has a first rotating portion and a first protruding portion is formed on the first rotating portion. The light emitting module is disposed in the first casing. A first indentation is formed on the first fixing member and the first protruding portion can pass through the first indentation. A second indentation and a second protruding portion are formed on the second fixing member and the first protruding portion can pass through the second indentation. The first and second fixing members are fixed together, and the first and second protruding portions are coplanar. The first protruding portion cooperates with the second protruding portion to limit rotating angle of the first casing. | 04-25-2013 |
20130163222 | ILLUMINATION MODULE - An illumination module comprising a light guide member, a first light source and a first polarizing element is provided. The light guide member is a polarization-maintaining light conductor, and comprises a first end, a second end and a main body. The main body is between the first and the second end, and comprises a light emitting area and a reflective area having a plurality of microstructures. The first light source is near the first end of the light guide member. The first polarizing element is between the first end and the first light source. The light of the first light source entering the first polarizing element is separated into a first polarized light and a second polarized light different from the first polarized light. The second polarized light passing through the first polarizing element and striking the microstructures is reflected as a third polarized light emitted to the outside. | 06-27-2013 |
20130163242 | PROTECTIVE COVER AND LAMP MODULE THEREWITH - A protective cover for covering a lamp base assembly of a lamp module is disclosed. The lamp base assembly is adapted for driving the lamp module. The protective cover includes a first housing and a second housing. The first housing includes a first engaging portion and the second housing includes a second engaging portion corresponding to the first engaging portion. When the second engaging portion engages with the first engaging portion, the first housing contains the lamp base assembly cooperatively with the second housing, and a surface of the lamp base assembly respectively is separated from a surface of the first housing and a surface of the second housing by a distance. | 06-27-2013 |
20130163280 | LIGHT GUIDE DEVICE AND ILLUMINATION MODULE USING THE SAME THEREOF - An illumination device comprising a light guide bar, a light source and a reflective sleeve is provided. The light guide bar comprises a first end surface, a second end surface, and a cylindrical surface. The cylindrical surface is disposed between the first end surface and the second end surface and has a light-emitting surface and a reflective surface. The light source is disposed at the outside of the first end surface of the light guide bar. The reflective sleeve covers the second end surface of the light guide bar and has a reflective cavity, which tapers inward to form a vertex angle. A part of the incident light of the light source is reflected to the light-emitting surface via the reflective surface by the reflective cavity or directly reflected to the light-emitting surface by the reflective cavity. | 06-27-2013 |
20130182406 | POLARIZED LIGHT SOURCE MODULE - A polarized light source module, having a first region and a second region adjacent to at least one edge of the first region, includes a lamp shell, at least one light source, a polarization generator, and a micro-structure layer. The light source is disposed in the second region. The polarization generator is disposed in the second region, and the polarization generator is used to polarize light generated from the light source. The micro-structure layer is disposed in the first region, and the micro-structure layer is used to reflect the light polarized by the polarization generator toward a direction away from the lamp shell. | 07-18-2013 |
20130208460 | ILLUMINATION APPARATUS - An illumination apparatus includes a light emitting module and a containing base. The light emitting module includes a light guide bar and a light emitting device disposed on an end of the light guide bar. The light emitting device includes a heat dissipating sheet and a light emitting element. The heat dissipating sheet has a first positioning component. The light emitting element is disposed on the heat dissipating sheet for emitting light to the light guide bar. The containing base is used for containing the light emitting module. A second positioning component is formed on a side of the containing base corresponding to the first positioning component. The second positioning component is used for engaging with the first positioning component when the light emitting module is disposed on the containing base, so as to fix a position of the light emitting module relative to the containing base. | 08-15-2013 |
20130208470 | ILLUMINATION APPARATUS AND LIGHT EMITTING DEVICE THEREOF - An illumination apparatus includes a light emitting device and a fluorescent lamp base having first and second sockets. The light emitting device is disposed on the fluorescent lamp base and includes a light guide bar, first and second plug structures, and a first LED assembly. The light guide bar has first and second ends corresponding to the first and second plug structures respectively. The first and second plug structures are respectively disposed on the first and second ends of the light guide bar for electrically connecting to the first and second sockets respectively. The first LED assembly is disposed in the first plug structure and has two first cables. The two first cables are electrically connected to the first and second plug structures respectively, so as to make the first LED assembly receive power provided by the fluorescent lamp base for emitting light to the light guide bar. | 08-15-2013 |
20130208506 | LIGHT GUIDE DEVICE - A light guide device is provided. The light guide device includes a light guide plate and a light source. The light guide plate includes an incident plane, a bottom plane and a top plane. The bottom plane includes a reflective plane and an inclined bottom plane, wherein the inclined bottom plane connects the bottom of the incident plane and the reflective plane, and the inclined bottom plane is inclined relative to the reflective plane. The top plane includes an inclined top plane, a light-emitting plane and a connecting plane, wherein the inclined top plane connects the top of the incident plane and the connecting plane, the connecting plane connects the inclined top plane and the light-emitting plane, and the inclined top plane is inclined relative to the connecting surface. Furthermore, the light source is located next to the incident plane. | 08-15-2013 |
20130234858 | WEIGHT SENSING DEVICE AND WEIGHT SENSING SYSTEM - A weight sensing device includes a casing, a weight sensing module and a light emitting module. A container placing area and a light emitting area are defined on a surface of the casing and staggered with each other. The weight sensing module is disposed in the casing and corresponding to the container placing area. The weight sensing module records a weight threshold. The light emitting module is disposed in the casing and corresponding to the light emitting area. When a container, which contains a substance, is placed on the container placing area, the weight sensing module senses a current weight of the container and the substance and compares the current weight with the weight threshold. When the current weight is smaller than the weight threshold, the weight sensing module drives the light emitting module to emit light, which is projected through the light emitting area. | 09-12-2013 |
20130250605 | ILLUMINATION DEVICE - An illumination device includes a light guiding core, an optical film and a light emitting module. The optical film separately surrounds the light guiding core. A ratio of a diameter of the optical film to a diameter of the light guiding core is between 2 and 3. The light emitting module is disposed at one side of the light guiding core. | 09-26-2013 |
20130258664 | ILLUMINATION DEVICE - An illumination device includes a light guide bar and light sources. The light guide bar includes a reflective layer, a light-emitting surface opposite to the reflective layer, and a light-incident surface connecting the reflective layer and the light-emitting surface. The light sources are beside the light-incident surface. Each light source includes a light unit and a lens. The lens is between the LED and the light guide bar and includes two opposite planar portions and two opposite arc-surface portions to surround a light-emitting axis. The planar portions are adjacent to each other and form a valley line aligned to the light-emitting axis at a junction of the planar portions. The planar portions respectively face the reflective layer and the light-emitting surface with respect to the valley line; thus, light provided by the LED is partially emitted toward the reflective layer and the light-emitting surface through the planar portions, respectively. | 10-03-2013 |
20130314939 | LIGHT EMITTING DEVICE - A light emitting device including a light guide pillar, a reflective layer, and a point light source is provided. The light guide pillar has a light incident terminal surface and includes a first portion and a second portion located between the first portion and the light incident terminal surface. The reflective layer is disposed on the first portion and exposes a portion of the first portion. The reflective layer is not disposed on the second portion. The point light source emits light toward the light incident terminal surface. | 11-28-2013 |
Patent application number | Description | Published |
20140126124 | TOUCH DEVICE - A touch device includes a top housing and bottom housing, which define an accommodating space. A touch panel has a lateral surface abutting the top housing. A hollow frame crosses adjacency between a top surface of the touch panel and a top surface of the top housing. | 05-08-2014 |
20140345799 | PRINTING METHOD FOR TOUCH PANEL DEVICE - A printing method for a touch panel device is disclosed. The method includes the following steps: firstly, providing a substrate; then, printing a first shielding layer on a surface of the substrate; and afterwards, printing a second shielding layer on the first shielding layer, wherein the second shielding layer covers the first shielding layer, and a side surface of the second shielding layer is connected to the surface of the substrate. | 11-27-2014 |
20150059159 | APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - An apparatus for manufacturing a semiconductor device includes a holder for holding a carrier and a supporting base for receiving the holder comprising a recess for accommodating a plurality of balls mounted on a surface of the carrier. Furthermore, a method of manufacturing a semiconductor device includes providing a carrier, providing an apparatus comprising a supporting base including a recess, holding the carrier on the supporting base and accommodating a plurality of balls mounted on a surface of the carrier in the recess. | 03-05-2015 |
20150093856 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a WLP semiconductor structure includes several operations. One of the operations is providing a carrier and the carrier includes a top surface. One of the operations is covering a portion of the top surface with a plurality of active dies. One of the operations is disposing a protrudent band on a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier. One of the operations is forming a molding compound on the carrier to cover the plurality of active dies. | 04-02-2015 |
20150104584 | METHOD OF INCREASING STRENGTH OF A PANEL EDGE - A method of increasing strength of a panel edge includes providing a panel having a lateral surface treated by plasma. An elastic material is provided, photoinitiator is added therein, and the elastic material is then liquefied by heating. Subsequently, the liquefied elastic material is sprayed on the lateral surface, and is then cured to result in a protective layer bonded on the lateral surface. | 04-16-2015 |
20150145115 | EMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, a die including a first surface and a second surface, a plurality of first conductive bumps disposed between the second surface of the carrier and the die, wherein the die is flip bonded on the carrier, and a molding disposed over the carrier and surrounding the die, wherein the molding includes a recessed portion disposed on the first surface of the die thereby leaving a portion of the first surface is uncovered by the molding. Further, a method of manufacturing a semiconductor device includes providing a carrier, flip bonding a die on the carrier, disposing a rubber material on a first surface of the die and within the first surface of the die, and forming a molding surrounding the rubber material and covering the carrier. | 05-28-2015 |
20150155221 | ADHESIVE PATTERN FOR ADVANCE PACKAGE RELIABILITY IMPROVEMENT - The present disclosure relates to an integrated chip package having a plurality of different adhesive layers that provide for a low lid induced stress good warpage control of a substrate and/or IC die, and an associated method of formation. The integrated chip package has an integrated chip (IC) die coupled to an underlying substrate by an electrically conductive interconnect structure. A first adhesive layer, having a first Young's modulus, is disposed onto the substrate at a first plurality of positions surrounding the IC die. A second adhesive layer, having a second Young's modulus different than the first Young's modulus, is disposed onto the substrate at a second plurality of positions surrounding the IC die. A lid is affixed to the substrate by the first and second adhesive layers and extends to a position overlying the IC die. | 06-04-2015 |
20150177778 | ADHESIVE FILM FOR ADHERING TO SUBSTRATE - An adhesive piece for adhering to a substrate is disclosed, wherein the adhesive piece has a film, an opening and a separating structure. The opening is formed on the film and configured to enable the substrate to be connected to a flexible printed circuit. The separating structure is formed on the film and has a plurality of perforated cuts, wherein the plurality of perforated cuts form the perforated line which is configured to be extended from an edge of the opening to an edge of the film. | 06-25-2015 |
20150179607 | Semiconductor Packaging Structure and Process - A method and structure for packaging a semiconductor device are provided. In an embodiment a first substrate is bonded to a second substrate, which is bonded to a third substrate. A thermal interface material is placed on the second substrate prior to application of an underfill material. A ring can be placed on the thermal interface material, and an underfill material is dispensed between the second substrate and the third substrate. By placing the thermal interface material and ring prior to the underfill material, the underfill material cannot interfere with the interface between the thermal interface material and the second substrate, and the thermal interface material and ring can act as a physical barrier to the underfill material, thereby preventing overflow. | 06-25-2015 |
20150187679 | Lid Design for Heat Dissipation Enhancement of Die Package - Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened. | 07-02-2015 |
20150214074 | Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices - Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring. | 07-30-2015 |
20150214128 | System and Method for Bonding Package Lid - Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill. | 07-30-2015 |
20150357309 | Package Structure and Methods of Forming the Same - Embodiments relate to packages and methods of forming packages. A package includes a package substrate, a first device die, first electrical connectors, an encapsulant, a redistribution structure, and a second device die. The first device die is attached to a side of the package substrate, and the first electrical connectors are mechanically and electrically coupled to the side of the package substrate. The encapsulant at least laterally encapsulates the first electrical connectors and the first device die. The redistribution structure is on the encapsulant and the first electrical connectors. The redistribution structure is directly coupled to the first electrical connectors. The first device die is disposed between the redistribution structure and the package substrate. The second device die is attached to the redistribution structure by second electrical connectors, and the second electrical connectors are directly coupled to the redistribution structure. | 12-10-2015 |
20150357318 | METHOD OF MANUFACTURING A CHIP PACKAGE - Chip packages and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a chip package includes: stacking a second chip on a first chip, wherein a first interconnect including a support structure and a bonding structure is disposed between the first chip and the second chip; bonding the first chip and the second chip via a thermal process applied to the bonding structure of the first interconnect; stacking a third chip on the second chip, wherein a second interconnect including a support structure and a bonding structure is disposed between the second chip and the third chip; bonding the second chip and the third chip via the thermal process applied to the bonding structure of the second interconnect; and reflowing the bond between the first and second chips and simultaneously reflowing the bond between the second and third chips. | 12-10-2015 |
Patent application number | Description | Published |
20130045745 | Method for Reducing the Handover Frequency by a Communication Device in Femtocell Networks - A method for reducing the handover frequency by a communication device in femtocell networks includes the steps: measuring the radio signal strength by a communication device and storing the information of the serving base station into a cache memory; checking whether the stored information in the cache memory is classified as “femtocell” or not; if so, deleting the macrocell's information from the measurement report by the communication device and transmitting this to the serving base station; when the radio link failure occurred, checking whether the stored information in the cache memory is classified as “femtocell” or not; if so, initiating a timer; detecting an available femtocell before the timer expires; transmitting a call reestablishment request message to the available femtocell for rebuilding the link. | 02-21-2013 |
20130045748 | METHOD FOR REDUCING THE HANDOVER FREQUENCY BY A FEMTO GATEWAY IN FEMTOCELL NETWORKS - A method for reducing the handover frequency by a femto gateway in femtocell networks includes the steps: receiving a measurement report from a communication device by an initial femtocell; transmitting a relocation required message to a femto gateway by the initial femtocell if the signal strength thereof is below a threshold; ignoring the relocation required message and enabling the timer by the femto gateway after receiving the relocation required message; determining whether the cell ID included in the call reestablishment request message is classified as “femtocell” or not by the femto gateway before the timer expires; if so, rebuilding the link to the femtocell in response to the cell ID by the femto gateway. | 02-21-2013 |
20130188679 | COMMUNICATION SYSTEM HAVING DATA-DEPENDENT SUPERIMPOSED TRAINING MECHANISIM AND COMMUNICATION METHOD THEREOF - The present invention discloses a communication system with a data-dependent superimposed training mechanism and a communication method thereof. The system uses a precoding module installed in front of the data-dependent superimposed training mechanism to precode data by a precoding matrix. The precoding matrix is a N×N unitary matrix, which is constructed by Q×Q precoding sub-matrix. Q is the block size N divided by the channel length. The precoding matrix can achieve full frequency diversity. Any two sets of data precoded by the precoding matrix must be different from each other, such that the receiver can effectively identify the data transmitted from the transmitter and the computational complexity of the receiver is reduced. | 07-25-2013 |
20130195024 | Communication Method of Coordinated Multi-Point Transmission Systems - A communication method of coordinated multi-point transmission systems. Based on the Zadoff-Chu sequences, multiple training sequences are implemented, and the training sequences are a set of robust orthogonal training sequence (ROTS). Preamble signals that use the set of training sequences can be transmitted from multiple base stations/relay stations at the same time. In the case with the mixture signal of multiple preamble signals, user equipment can still use the received signal to estimate multiple carrier frequency offsets of the corresponding base stations/relay stations. | 08-01-2013 |
20130195212 | COOPERATIVE MIMO SYSTEM BASED ON PARTIAL ZADOFF-CHU SEQUENCE AND SYNCHRONIZATION METHOD THEREOF - A cooperative multiple-input multiple-output system based on partial Zadoff-Chu sequences and a synchronization method thereof are disclosed, and the system comprises a plurality of transmitters and a receiver. Each transmitter's training signal is disposed in a subband having a length of V, and the training signal is converted into a time domain signal. The receiver receives the time domain signals of the cooperating transmitters. Each transmitter extracts V successive samples from any region of a Zadoff-Chu sequence having a length equal to a multiple of V and the samples are disposed in an exclusive subband as the training signal. When the training signals of cooperating transmitters are converted into time and frequency domain signals, the training signals of all the transmitters are separated from each other to suppress mutual interference in both time and frequency domains and to improve the performance of synchronization. | 08-01-2013 |
20130315324 | Apparatus for Cooperative MIMO OFDM Using Non-Data-Aided Timing Synchronization - An apparatus for cooperative multiple-input multiple-output (MIMO) orthogonal frequency-division multiplexing (OFDM) is provided. The apparatus uses a new carrier assignment scheme (CAS) called generalized interleaved CAS, along with non-data-aided timing synchronization. With the generalized interleaved CAS, random OFDM signals are formed into patterns similar to unequal period synchronization patterns (UPSPs), and a corresponding non-data-aided timing synchronization scheme is set. With the help of majority vote refinement (MVR), the present invention achieves better timing synchronization and enhances the quality of signal demodulation. | 11-28-2013 |