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Chin-Fu
Chin-Fu Hsu, Yonghe City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110218467 | PORTABLE CARDIOPULMONARY RESUSCITATOR FOR IMPLEMENTING CARDIOPULMONARY RESUSCITATION - A portable cardiopulmonary resuscitator for implementing CPR to rescue a user includes a pressing mechanism and a respiration aid. The pressing mechanism includes a pressing element and a pumping element. The pressing element is pressed to massage a heart of the user and the pumping element is operated to produce and discharge air. The respiration aid includes a tube and a mask, an end of the tube is extended from the pumping element and the other end of the tube is provided with the mask which is covered on a face of the user. By the aforementioned structures, a rescuer can use the present invention to perform the CPR to a patient, with infection of germs by being in contact with saliva being avoided, which is indeed provided with practical progressiveness. | 09-08-2011 |
Chin-Fu Lee, Ta Ya Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20080248297 | Cold transfer sticker and method for making the same - A cold transfer sticker is made by preparing a releasing film and an oil layer with patterns and/or character is coated on the releasing film to form the sticker. The surface of the object is first cleaned and a glue layer is spread on the object. The sticker is attached onto the object and firmly pressed by a pressing tool. The releasing film is then removed from the sticker. The glue layer has compatible chemical characteristics with that of the oil layer and the object so as to securely combine the oil layer and the object. A protection layer is spread to the patterns and/or characters. | 10-09-2008 |
Chin-Fu Lin, Chu-Pei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110024610 | IMAGE SENSOR PACKAGE STRUCTURE - The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced. | 02-03-2011 |
| 20110024861 | MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND IMAGE SENSOR PACKAGE STRUCTURE THEREOF - A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure. | 02-03-2011 |
Chin-Fu Lin, Chu-Pei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110024862 | IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY - The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized. | 02-03-2011 |
Chin-Fu Lin, Hsin-Chu Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20110156187 | IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH - An image sensor packaging structure with a predetermined focal length is provided. The image sensor packaging structure includes a substrate, a chip, an optical assembly, and an encapsulation compound. The chip has a sensitization area and is coupled to the substrate. Conductive contacts on the substrate are electrically connected with conductive contacts around the sensitization area. The optical assembly has the predetermined focal length and is disposed above the chip so as to form an air cavity between the optical assembly and the sensitization area of the chip. The encapsulation compound is formed on the substrate to surround the chip and the optical assembly. With the above stated structure, not only can the focus adjusting procedure be dispensed with, but also the image sensor packaging structure can be manufactured by a molding or dispensing process. | 06-30-2011 |
| 20110156188 | IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT - An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured. | 06-30-2011 |
Chin-Fu Wang, Xindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110280924 | Biodegradable filler for restoration of alveolar bones - A biodegradable filler for restoration of alveolar bones is disclosed, which includes: first cross-linked collagen fibers prepared from reacting Non-crosslinked collagen fibers with a cross-linking agent; and supporting particles which are biomedical ceramic particles, bioactive glass, or a combination thereof, and distributed among the first cross-linked collagen fibers. | 11-17-2011 |