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Chih-Yang
Chih-Yang Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090050906 | Photo Detector and a Display Panel having the Same - A photo detector has a sensing TFT (thin film transistor) and a photodiode. The sensing TFT has a gate and a base. The photodiode has an intrinsic semiconductor region electrically connected to the gate and the base of the sensing TFT. The sensing TFT and the photodiode both have a structure comprising low temperature poly-silicon. A display panel contains the photo detector is also disclosed. | 02-26-2009 |
Chih-Yang Hsu, Tu Cheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100252852 | COOLING BLOCK ASSEMBLY AND LED INCLUDING THE COOLING BLOCK - An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks. | 10-07-2010 |
Chih-Yang Hsu, Tao-Yuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090215216 | Packaging method of image sensing device - A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid. | 08-27-2009 |
| 20090256222 | Packaging method of image sensing device - A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing an annular dam on a substrate; b) mounting an image sensing module, having a light-receiving region exposed, inside the annular dam on the substrate; c) connecting the image sensing module and the substrate via a plurality of bonding wires; d) forming a barrier around the light-receiving region on the image sensing module; e) filling an adhesive between the barrier and the annular dam with the plurality of bonding wires being encapsulated; f) forming a transparent lid above the light-receiving region; and g) cutting off the annular dam. | 10-15-2009 |
| 20100025795 | Image sensing device and packaging method thereof - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 02-04-2010 |
| 20100295099 | IMAGE SENSING DEVICE AND PACKAGING METHOD THEREOF - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 11-25-2010 |
Chih-Yang Hsu, Tucheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100096658 | Structure of Light Emitting Diode - An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board. | 04-22-2010 |
Chih-Yang Huang, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110183014 | PRODUCT CONTAINING EXTRACT FROM ZANTHOXYLUM AVICENNAE (LAM.) DC., AND PREPARATION PROCESS AND USE THEREOF - Disclosed herein are a product containing an extract from | 07-28-2011 |
Chih-Yang Lee, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110215593 | ON-ROAD ENERGY CONVERSION AND VIBRATION ABSORBER APPARATUS - An on-road energy conversion and vibration absorber apparatus receives the kinetic energy from moving vehicles and pedestrians when being weighed down, and converts the received kinetic energy into a potential energy using a restorable elastic element compressing a fluid thereby storing the potential energy in a pressure chamber, and then conducting the pressurized fluid to pass though a check valve along a conduit and drive a vane wheel by releasing its potential energy. The vane wheel in turn drives a generator to generate electric energy, and the vibration of the vehicles is alleviated by cushion effect provided by the apparatus. | 09-08-2011 |
Chih-Yang Liao, Sinshih Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20120005507 | Display Devices and Control Methods - A display device includes a host, a control unit, and a display unit. The control unit receives host data from the host and then generates input data. The control unit includes first, second, and third memories and an arbiter. The first memory stores the input data to serve as first stored data. The second memory stores second stored data and outputs it for generating output data. The third memory stores third stored data. When the amount of the first stored data is greater than a first threshold value, the arbiter performs a writing operation to write the first stored data into the third memory. When the amount of the second stored data is lower than a second threshold value, the arbiter performs a reading operation to read the third stored data to being written into the second memory. The display unit displays images according to the output data. | 01-05-2012 |
Chih-Yang Lin, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20120014589 | METHOD FOR ANALYZING PERIPHERAL COMPONENT INTERCONNECT SOCKETS - A method uses a time domain reflectometer (TDR) to determine unqualified clasps of a peripheral component interconnect (PCI) socket. A scanning electron microscope (SEM) captures an image of an unqualified clasp and magnifies the image from a nanometer scale to view the unqualified clasp. An electron spectroscopy for chemical analysis (ESCA) obtains a degree of oxidation at each position of the unqualified clasp in response to a determination that the unqualified clasp is oxidated. A Fourier transform infrared spectroscopy (FTIR) displays a position of the soldering flux using in response to the determination that the unqualified clasp comprises the soldering flux. | 01-19-2012 |
Chih-Yang Lin, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090039332 | RESISTIVE NON-VOLATILE MEMORY DEVICE - The present disclosure provides a memory cell. The memory cell includes a first electrode, a variable resistive material layer coupled to the first electrode, a metal oxide layer coupled the variable resistive material layer; and a second electrode coupled to the metal oxide layer. In an embodiment, the metal oxide layer provides a constant resistance. | 02-12-2009 |
Chih-Yang Lin, Minsyong Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100135530 | METHODS AND SYSTEMS FOR CREATING A HIERARCHICAL APPEARANCE MODEL - A method for creating an appearance model of an object includes receiving an image of the object and creating a hierarchical appearance model of the object from the image of the object. The hierarchical appearance model has a plurality of layers, each layer including one or more nodes. Nodes in each layer contain information of the object with a corresponding level of detail. Nodes in different layers of the hierarchical appearance model correspond to different levels of detail. | 06-03-2010 |
Chih-Yang Liu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090016692 | PLAYBACK CONTROL METHODS AND SYSTEMS - Playback control methods and systems are provided. At least one picture is obtained. The picture corresponds to a frame, and the picture includes a first region and a second region adjacent to the first region. It is determined whether at least one pixel in the first region has a predefined color, and whether at least one pixel in the second region has the predefined color. When the pixel in the first region has the predefined color and the pixel in the second region does not have the predefined color, the first region is removed, and the second region is enlarged to cover an original position of the first region. The enlarged second region is then played back via an anamorphic lens. | 01-15-2009 |
Chih-Yang Wang, San Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090296394 | Light emission structure - A light emission structure includes a circuit board and at least one light-emitting diode. The circuit board defines at least one opening, which receives the light-emitting diode therein in such a way that the light-emitting diode has a plurality of terminals extending over and supported by the circuit board and a gap is formed between the light-emitting diode and the opening. As such, heat dissipation of the light-emitting diode is enhanced and overall thickness is reduced. | 12-03-2009 |
| 20090315064 | Light emission device - A light emission device includes a substrate, at least one light-emitting diode (LED), and a plurality of electrical connection elements. The substrate defines a plurality of pilot holes, each having a conductive layer formed in a circumference thereof. The LED is set on the substrate and has a plurality of terminals each forming a through hole corresponding to a respective pilot hole of the substrate. Each electrical connection element is arranged between the conductive layer of each pilot hole of the substrate and each terminal of the LED. The electrical connection element is molten by being heated to form an electric connection portion, which attaches to the conductive layer of the pilot hole and the terminal of the light-emitting diode. In this way, precise positioning between the substrate and the LED is realized, bonding strength is enhanced, and overall thickness is reduced. | 12-24-2009 |
Chih-Yang Yeh, Jhubei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090311628 | METHOD FOR ETCHING AN ULTRA THIN FILM - A method for etching an ultra thin film is provided which includes providing a substrate having the ultra thin film formed thereon, patterning a photosensitive layer formed over the ultra thin film, etching the ultra thin film using the patterned photosensitive layer, and removing the patterned photosensitive layer. The etching process includes utilizing an etch material with a diffusion resistant carrier such that the etch material is prevented from diffusing to a region underneath the photosensitive layer and removing portions of the ultra thin film underneath the photosensitive layer. | 12-17-2009 |
| 20100261118 | Intensity Selective Exposure Method And Apparatus - A gradated photomask is provided. The photomask includes a first region including a first plurality of sub-resolution features and a second region including a second plurality of sub-resolution features. The first region blocks a first percentage of the incident radiation. The second region blocks a second percentage of the incident radiation. The first and second percentage are different. An intensity selective exposure method is also provided. | 10-14-2010 |
| 20100279234 | DOUBLE PATTERNING METHOD USING METALLIC COMPOUND MASK LAYER - A hard mask layer and a developable bottom anti-reflective coating (dBARC) layer are formed over a dielectric layer of a substrate. A first photosensitive layer is formed above the dBARC layer, exposed, and developed to form a first pattern. The dBARC layer is developed. The first pattern is etched into the hard mask layer to form a first pattern of openings in the hard mask layer. Following removal of the first photosensitive layer, a second photosensitive layer is formed within the first pattern of openings. The second photosensitive layer is exposed and developed to form a second pattern. The dBARC layer is developed. The second pattern is etched into the hard mask layer to form a second pattern of openings in the hard mask layer. Following the removal of the second photosensitive layer and the dBARC layer, the first and the second patterns are etched into the dielectric layer. | 11-04-2010 |
| 20110217630 | INTENSITY SELECTIVE EXPOSURE PHOTOMASK - An intensity selective exposure photomask, also describes as a gradated photomask, is provided. The photomask includes a first region including a first array of sub-resolution features. The first region blocks a first percentage of the incident radiation. The photomask also includes a second region including a second array of sub-resolution features. The second region blocks a second percentage of the incident radiation different that the first percentage. Each of the features of the first and second array includes an opening disposed in an area of attenuating material. | 09-08-2011 |