Patent application number | Description | Published |
20090056984 | SIGNAL TRANSMISSION STRUCTURE AND LAYOUT METHOD FOR THE SAME - A signal transmission structure is provided. The signal transmission structure includes conduction blocks periodically formed at a power plane, neck blocks connecting adjacent conduction blocks, and openings formed corresponding to the neck blocks at a ground plane for reducing equivalent capacitance between the neck blocks and the ground plane, so as to improve the noise isolation performance. | 03-05-2009 |
20100126759 | STRUCTURE OF MULTI-LAYER PRINTED CIRCUIT BOARD - A structure of a multi-layer printed circuit board includes a power layer, a ground layer, and a dielectric layer. The dielectric layer is located between the power layer and the ground layer. The dielectric layer has a relative permittivity and a relative permeability, wherein the product of the relative permittivity and the relative permeability substantially decreases along with an increase in frequency within a frequency range. | 05-27-2010 |
20100200281 | CIRCUIT BOARD STRUCTURE - A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit and the second circuit areas. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit and the fourth circuit areas. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface. | 08-12-2010 |
20110208461 | MEASUREMENT CORRECTING SYSTEM AND METHOD THEREOF - A measurement correcting system including a field measuring unit and a processing unit is provided. The field measuring unit simultaneously senses a first signal to be measured and a second signal to be measured which have opposite polarities and substantially the same magnitude, and generates a first output signal and a second output signal correspondingly. The processing unit determines the first signal to be measured according to the first output signal and the second output signal. A measurement correcting method is also provided. | 08-25-2011 |
20120187944 | PLANAR MAGNETIC FIELD PROBE - A planar magnetic field probe is provided. The planar magnetic field probe increases the sensitivity of magnetic field intensity detection by using a left multi-sensor loop and a right multi-sensor loop formed by a first patterned metal layer and a second patterned metal layer, and decreases the electric field noise coupling by surrounding the left multi-sensor loop and the right multi-sensor loop with a symmetrical shielding metal structure formed by a first patterned shielding metal layer, a second patterned shielding metal layer and a plurality of through vias. | 07-26-2012 |
20130176683 | ELECTRONIC ASSEMBLY - An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern. | 07-11-2013 |
20140077899 | BAND-PASS FILTER - A band-pass filter including a double-sided circuit board, an input terminal, an output terminal and a plurality of resonance units are provided. The double-sided circuit board includes a first conductor layer and a second conductor layer. The first conductor layer includes a grounded metal layer. The grounded metal layer includes one or more vias to connect to a grounded layer of the second conductor layer. The input terminal is disposed in the first conductor layer to receive a signal. The output terminal is disposed in the first conductor layer to output the filtered signal. The resonance units are disposed in the first and second conductor layers respectively, wherein the number of the resonance units is N, and N is a positive integer greater than or equal to 3. | 03-20-2014 |