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Chih-Wei Chang
Chih-Wei Chang, Pingtung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110090141 | BACKLIGHT MODULE AND DISPLAY APPARATUS - A backlight module including a light guide plate, light source sets, and controlling circuits is provided. The light guide plate has a plurality of regions, and each region of the light guide plate has a light incident surface correspondingly. Each light source set is disposed at the light incident surface of one of the regions of the light guide plate, and each light source set has at least one middle light source and at least one edge light source. The middle light source is disposed in a middle region of the light source set and the edge light source is disposed at an edge of the light source set. Each controlling circuit is electrically connected to the middle light source of one of the light source sets, and the edge light source of each light source set is electrically connected to the controlling circuit of the adjacent light source set. | 04-21-2011 |
| 20120092593 | FRAME, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY MODULE - A frame formed by cutting and bending a plate base is provided. The maximum thickness of the frame is T, the thickness of the plate base is t, and 1.5t≦T≦2.5t. The frame includes a first plate element, a second plate element, and a bending portion. The second plate element is directly contacted to the first plate element, and the first plate element is substantially parallel to the second plate element. The bending portion is connected between the first plate element and the second plate element. A backlight module using the above-mentioned frame and a liquid crystal display (LCD) module using the backlight module are also provided. | 04-19-2012 |
Chih-Wei Chang, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080199978 | System and method for film stress and curvature gradient mapping for screening problematic wafers - A method of testing a wafer after a current top layer is formed over the wafer. Stress data is collected for the wafer after forming the current top layer. The stress data is derived from changes in wafer curvature. The stress data includes: stress-xx in an x direction and stress-yy in a y direction for each area of a set of finite areas on the wafer, the stress-xx and stress-yy both being derived from wafer-curvature-change-xx in the x direction for each area of the set of finite areas and from wafer-curvature-change-yy in the y direction for each area of the set of finite areas; and the stress-xy being derived from wafer-curvature-change-xy, wherein wafer-curvature-change-xy is a change in wafer twist in the x-y plane for each area of the set of finite areas. A stress gradient vector (and/or its norm) is calculated and used to evaluate the investigating single or multiple accumulated layer. | 08-21-2008 |
| 20090166768 | Semiconductor device with metal silicides having different phases - A fully silicided gate with a selectable work function includes a gate dielectric over the substrate, a first metal silicide layer over the gate dielectric, and a second metal silicide layer wherein the first metal silicide has a different phase then the second metal silicide layer. The metal silicide layers comprises at least one alloy element. The concentration of the alloy element on the interface between the gate dielectric and the metal silicide layers influence the work function of the gate. | 07-02-2009 |
| 20100182767 | BACKLIGHT ASSEMBLY - Backlight assembly includes a plurality of light guide plates, a plurality of light modules, and a plurality of driving units separately in control of corresponding light modules which are configured at the incident sides of the LGPs. Each light module faces two adjacent LGPs such that the driving unit drives the light module to provide light for two adjacent LGPs at the same time. As local dimming function is switched, besides the power-saving and the high contrast, the local edge effect due to the joint of the LGPs can be reduced. | 07-22-2010 |
| 20100246164 | Hollow Edge-Type Backlight Module with Light-Emitting Array - A hollow edge-type backlight module with a light-emitting array and a display apparatus containing the same are disclosed. The hollow edge-type backlight module mainly utilizes a hollow reflection structure to replace a light-guide plate structure, and forms a light-emitting unit by collaborating with an edge-type light source, and forms a light-emitting array by appending together a plurality of light-emitting units. The reflection structure of each light-emitting unit has a horizontal surface and a reflective surface connected to the horizontal surface, wherein there is an angle included between the reflective surface and a surface extended from the horizontal surface, and the light source is disposed adjacent to the horizontal surface. A diffuser of the hollow edge-type backlight module is disposed above the reflective surface and the horizontal surface, and the diffuser, the light source, the horizontal surface and the reflective surface define at least one air cavity. | 09-30-2010 |
| 20100273324 | METHODS OF MANUFACTURING METAL-SILICIDE FEATURES - A method of manufacturing a microelectronic device including forming a dielectric layer surrounding a dummy feature located over a substrate, removing the dummy feature to form an opening in the dielectric layer, and forming a metal-silicide layer conforming to the opening. The metal-silicide layer may then be annealed. | 10-28-2010 |
| 20100279436 | Inspection Method For Integrated Circuit Manufacturing Processes - The present disclosure provides a method for manufacturing integrated circuit devices including an electron beam inspection. The method includes forming a silicide region on a substrate. In an embodiment, the silicide region is formed to provide contact to a device feature such as a source or drain region. An electron beam scan is then performed on the substrate. The electron beam scan includes a first scan and a second scan. The first scan includes a lower landing energy than the second scan. In an embodiment, the first scan provides a dark silicide image analysis and a bright image analysis. In an embodiment, the second scan provides a dark silicide image analysis. The method continues to form a conductive plug after performing the electron beam scan. | 11-04-2010 |
| 20100314698 | METHODS OF MANUFACTURING METAL-SILICIDE FEATURES - A method of manufacturing a microelectronic device including forming a dielectric layer surrounding a dummy feature located over a substrate, removing the dummy feature to form an opening in the dielectric layer, and forming a metal-silicide layer conforming to the opening. The metal-silicide layer may then be annealed. | 12-16-2010 |
| 20110157917 | Backlight Module with Localized Light Source Control - A backlight module with localized light source control is provided. The backlight module includes a first light guide plate, a second light guide plate, and a plurality of luminous elements. The first light guide plate includes a first side. The second light guide plate includes a second side. The first and second light guide plates are disposed along a first direction, so that the first side of the first light guide and the second side of the second light guide face to each other. The luminous elements are respectively disposed along the first side and the second side and emit lights thereto, wherein at least a portion of the luminous elements disposed along the first side and the second side form a light source module so as to act simultaneously. | 06-30-2011 |
| 20120069549 | HEAT-DISSIPATING STRUCTURE, BACKLIGHT MODULE, AND DISPLAY APPARATUS FOR STANDING USE - A heat-dissipating structure, a backlight module, and a display apparatus for standing use are disclosed. The heat-dissipating structure includes a back plate and a heat pipe which is coupled to the back plate and includes a heat-absorbing portion at a side portion of the back plate and a heat-dissipating portion bent upward from the heat-absorbing portion to extend toward a center portion of the back plate. The backlight module includes the heat-dissipating structure, a light-guiding plate disposed above the back plate and the heat pipe, and a light source module disposed on the heat-absorbing portion at a side of the light-guiding plate. The display apparatus includes the backlight module and a panel above the light-guiding plate. Thereby, working fluid in the heat pipe can flow back to the heat-absorbing portion by use of gravity after dissipating heat at the heat-dissipating portion, which improves the whole efficiency of heat dissipation. | 03-22-2012 |
Chih-Wei Chang, Pa-Te City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100033400 | SPRAY NON-CONTACT CUTTING TYPE ANTENNA AND ITS FABRICATION METHOD - A spray non-contact cutting type antenna fabrication method is disclosed to have an antenna radiator be formed on a plastic shell by means of spray-painting a metallic spray paint on the surface of the plastic shell and then cutting the metallic coating into shape, and then to cover the plastic shell with a cover layer by means of an insert molding or spray paining technique to have the antenna radiator be enveloped in the cover layer. | 02-11-2010 |
| 20100176994 | ANTENNA HOLDER FRAME ASSEMBLY FOR NOTEBOOK COMPUTER - An antenna holder frame assembly includes a narrow elongated holder frame mounted on the top side of a display screen of a notebook computer, a plurality of circuit boards fixedly mounted in the holder frame, each circuit board providing a ground plane and having a signal bus line electrically connected to a motherboard in the notebook computer, and a plurality of strip antennas of different operating bands embedded in the front edge of the holder frame and electrically connected with the respective feed-in terminal to the circuit boards for allowing the receiving signal to transmitted to the motherboard through one associating circuit board. | 07-15-2010 |
Chih-Wei Chang, Berkeley, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090277609 | Tunable Thermal Link - Disclosed is a device whereby the thermal conductance of a multiwalled nanostructure such as a multiwalled carbon nanotube (MWCNT) can be controllably and reversibly tuned by sliding one or more outer shells with respect to the inner core. As one example, the thermal conductance of an MWCNT dropped to 15% of the original value after extending the length of the MWCNT by 190 nm. The thermal conductivity returned when the tube was contracted. The device may comprise numbers of multiwalled nanotubes or other graphitic layers connected to a heat source and a heat drain and various means for tuning the overall thermal conductance for applications in structure heat management, heat flow in nanoscale or microscale devices and thermal logic devices. | 11-12-2009 |
| 20100167004 | SOLID STATE THERMAL RECTIFIER - Thermal rectifiers using linear nanostructures as core thermal conductors have been fabricated. A high mass density material is added preferentially to one end of the nanostructures to produce an axially non-uniform mass distribution. The resulting nanoscale system conducts heat asymmetrically with greatest heat flow in the direction of decreasing mass density. Thermal rectification has been demonstrated for linear nanostructures that are electrical insulators, such as boron nitride nanotubes, and for nanostructures that are conductive, such as carbon nanotubes. | 07-01-2010 |
Chih-Wei Chang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100151639 | METHOD FOR MAKING A THERMALLY-STABLE SILICIDE - Provided is a method of fabrication a semiconductor device that includes providing a semiconductor substrate, forming a gate structure over the substrate, the gate structure including a gate dielectric and a gate electrode disposed over the gate dielectric, forming source/drain regions in the semiconductor substrate at either side of the gate structure, forming a metal layer over the semiconductor substrate and the gate structure, the metal layer including a refractory metal layer or a refractory metal compound layer; forming an alloy layer over the metal layer; and performing an annealing thereby forming metal alloy silicides over the gate structure and the source/drain regions, respectively. | 06-17-2010 |
| 20120012903 | METHOD FOR MAKING A DISILICIDE - Methods for fabricating a semiconductor device are disclosed. A metal-rich silicide and/or a mono-silicide is formed on source/drain (S/D) regions. A millisecond anneal is provided to the metal-rich silicide and/or the mono-silicide to form a di-silicide with limited spikes at the interface between the silicide and substrate. The di-silicide has an additive which can lower the electron Schottky barrier height. | 01-19-2012 |
| 20120092629 | PROJECTION DEVICE - A projection device including an optical engine base, a light source, a light valve, and a projection lens is provided. The light source includes a component holder, a light component, and light lens. The component holder is assembled to the optical engine base, and has a component slot and a lens slot communicated with the component slot. The lens slot has at least one slot section plane. The light component is disposed within the component slot. The light lens is disposed within the lens slot, and adapted to form the light generated by the light component into a lighting beam. The light valve and the projection lens are assembled to the optical engine base. The light valve is adapted to convert the lighting beam into an image beam. The projection lens is adapted to convert the image beam into a projection beam. | 04-19-2012 |
Chih-Wei Chang, Tao-Yuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100019977 | ANTENNA TEST APPARATUS - In an antenna test apparatus of the type having a platform for carrying an antenna for test and a pressure board vertically movable by a lifter to hold down a test antenna in the platform for test, the platform has a top flange formed of an electromagnetic wave absorbing material and raised around the periphery, and the pressure board has a bottom flange formed of an electromagnetic wave absorbing material for stopping against the top flange of the platform to protect an antenna to be tested in between the platform and a bottom soft flange of the pressure board against external electromagnetic noises. | 01-28-2010 |
Chih-Wei Chang, Yangmei Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090120216 | THREE-DIMENSIONAL MICROPROBE ARRAY - The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost. | 05-14-2009 |
| 20090283867 | Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same - The present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit. | 11-19-2009 |
Chih-Wei Chang, Jen Te TW
| Patent application number | Description | Published |
|---|---|---|
| 20080291031 | WIRELESS WARNING SYSTEM AND METHOD OF USING THE SAME - A wireless warning system ( | 11-27-2008 |
| 20090053110 | MULTIFUNCTIONAL EARPHONE AND ALCOHOL MONITORING SYSTEM USING THE SAME - A multifunctional earphone includes an earphone body, and an alcohol-testing module provided in the earphone body. The alcohol-testing module includes an alcohol-testing unit provided with an alcohol concentration-measuring program to measure an alcohol concentration of a user of the multifunctional earphone to obtain a measured alcohol concentration value; and a communication unit to receive the measured alcohol concentration value from the alcohol-testing unit, and analyze the measured alcohol concentration value. | 02-26-2009 |
Chih-Wei Chang, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080214856 | Process for preparation of dialkyl carbonate - Provided is a process for preparation of dialkyl carbonates, comprising the step of performing oxidative carbonylation of an alcohol in liquid phase in the presence of CO and O | 09-04-2008 |
| 20080300419 | Method for preparing organic carbonates - A method for preparing organic carbonates comprising subjecting an alcohol compound to oxidative carbonylation in the presence of carbon monoxide, oxygen and a liquid-phase catalytic system, to form a organic carbonates, wherein the liquid-phase catalytic system includes at least one catalyst, at least one additive and at least one ionic liquid composed of a cation, which has a nitrogen-containing heterocyclic structure, and an anion. Through using the additive and the ionic liquid, the activity and the performance of the catalyst are enhanced, and increased reaction rate and yield can be obtained. | 12-04-2008 |
Chih-Wei Chang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080272974 | Multiband planar antenna and electrical apparatus using the same - A multi-band planar antenna including a metal plate, a first radiation portion, a second radiation portion, and a grounding portion is provided. The plate includes a first and a second edge. The first radiation portion is configured on the upper of the plate by a first slot, and the first slot extends to the inner of the plate from the first edge. The second radiation portion is configured on the upper side of the plate adjacent to the second edge by a second slot and a third slot adjacent to the first radiation portion. The second slot extends to the inner of the metal plate from the second edge. The third slot is formed between the first and the second slot. The grounding portion is formed on the lower of the metal plate. The first and the second radiation portion transmit and receive the low-band and high-band of RF signal respectively. | 11-06-2008 |
Chih-Wei Chang, Taichung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080251910 | Fabricating method of semiconductor package and heat-dissipating structure applicable thereto - A method for fabricating semiconductor packages is disclosed, including mounting and electrically connecting a semiconductor chip onto a chip carrier; mounting a heat-dissipating structure on the semiconductor chip; placing the heat-dissipating structure into a mold cavity for filling therein a packaging material to form an encapsulant, wherein the heat-dissipating structure has a heat spreader having a size larger than that of the predetermined size of the semiconductor package, a covering layer formed on the, and a plurality of protrusions formed on edges of the covering layer that are free from being corresponding in position to the semiconductor chip, such that the protrusions can abut against a top surface of the mold cavity to prevent the heat spreader from being warped; and finally performing a singulation process according to the predetermined size and removing the encapsulant formed on the covering layer to form the desired semiconductor package. Also, this invention discloses a heat-dissipating structure applicable to the method described above. | 10-16-2008 |
Chih-Wei Chang, Shindian TW
| Patent application number | Description | Published |
|---|---|---|
| 20110149460 | ELASTIC SHEET STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME - An elastic sheet structure includes an elastic body and a conductive body. The elastic body is capable of elastic deformation, and the conductive body includes a main body, a first elastic arm, and a second elastic arm. The main body is installed into the elastic body; the first elastic arm and the second elastic arm are connected at opposite sides of the main body and extend out from two opposite ends of the elastic body. The first elastic arm is capable of electrically connecting to ground to conduct away static electricity through the second elastic arm, the main body, and the first elastic arm. An electronic device employing the elastic sheet structure is also described. | 06-23-2011 |
| 20110249377 | PORTABLE ELECTRONIC DEVICE WITH FASTENING STRUCTURE - A fastening structure for a portable electronic device includes a main housing and a frame. The main housing defines a slot. A protrusion and a block are formed at two opposite sides of the slot. The frame includes a tab. The tab defines a locking hole. The block pushes the tab toward the protrusion to allow the protrusion to be latched in the locking hole for connecting the frame to the main housing. | 10-13-2011 |
| 20120081865 | DUSTPROOF STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME - A dustproof structure is used in an electronic device, which includes a housing and a display panel. The dustproof structure includes a dustproof section and a first adhesive section. The dustproof section is located and received in the housing. The first adhesive section is fixed on the one side of the dustproof section, and the display panel is fixed on the dustproof structure by the first adhesive section and is assembled to the housing. The dustproof structure fills gaps between the housing and the display panel. | 04-05-2012 |
Chih-Wei Chang, Taichung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20120023754 | Multi-function cutter - A multi-function cutter includes a body composed of a first half and a second half, wherein the first and second halves are formed with indentations, concave portions, guides parallel to the concave portions and rows of positioning pits arranged along the concave portions; a blade holder sliding along the guides to jut out of the indentation and having a spring socket; and an adjusting device deposited in the spring socket and exposing outside the concave portions. Therein, an adjusting spring is arranged between the adjusting device and the spring socket, and the adjusting device is bilaterally formed with wedge portions for detachably engaging the corresponding positioning pits, so as to stretch the blade holder in multiple stages. | 02-02-2012 |
Chih-Wei Chang, Tai-Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120095163 | Polymerization method for acrylic latex without emulisifier - The present invention provides a polymerization method for acrylic latex without emulsifier, in which a reaction system is formed from 40˜60 wt % of pure water and 2˜9 wt % of carboxylic acid monomers with carbon-carbon double bond polymerizable functional groups (A), and 40˜50 wt % of methyl methacrylate or acrylate monomers (B), and 0.2˜2.0 wt % of inorganic alkaline solution is first used to adjust the pH value of the reaction system to within a pH range of 9.0˜13.0, then 0.2˜1.0 wt % of peroxide sulfates are used as initiators, and emulsification polymerization is carried out. At the end of the reaction, organic amine compounds are used to adjust the pH value of the obtained aqueous resin latex to within the pH range 7.0˜9.5. Particle diameters of the manufactured aqueous resin latex are approximately 100˜30 nm, uniformly distributed and have excellent outward appearance. Moreover, acid value is low at 3.5˜6.5 mgKOH/g, and Its specific gravity is approximately 1.07, slightly greater than that of water; storage stability is excellent, with good permeability that facilitates construction. Moreover, water resisting property as a dry film coating is good, tensile strength is excellent, and provides superior abrasion performance. | 04-19-2012 |
Chih-Wei Chang, Tainan TW
| Patent application number | Description | Published |
|---|---|---|
| 20120103413 | THIN-FILM SOLAR CELL AND METHOD FOR FABRICATING THE SAME - A thin-film solar cell includes a body and a polymer layer. The body includes a first electrode layer, a photoelectric conversion layer, and a second electrode layer, and the polymer layer includes a hardening material and an interface material. The photoelectric conversion layer is disposed between the first electrode layer and the second electrode layer, and the polymer layer surrounds the photoelectric conversion layer, in which the interface material is used for bonding to the hardening material and the photoelectric conversion layer respectively. Therefore, the thin-film solar cell may reduce the Staebler-Wronski Effect generated by the photoelectric conversion layer in the photoelectric conversion procedure. Accordingly, the photoelectric conversion efficiency is improved. | 05-03-2012 |